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    BGA37 Search Results

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    BGA37 Price and Stock

    Hirose Electric Co Ltd IT5HM-100S-BGA(37)

    CONN INTERPOSER 100 POS
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    DigiKey IT5HM-100S-BGA(37) Tray 38 1
    • 1 $22.33
    • 10 $18.204
    • 100 $15.13963
    • 1000 $14.125
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    Avnet Americas IT5HM-100S-BGA(37) Tray 40
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    Mouser Electronics IT5HM-100S-BGA(37) 4
    • 1 $22.33
    • 10 $18.21
    • 100 $15.13
    • 1000 $14.12
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    Newark IT5HM-100S-BGA(37) Bulk 40
    • 1 $25.6
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    • 100 $22.6
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    Sager IT5HM-100S-BGA(37)
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    Hirose Electric Co Ltd IT3M-200S-BGA(37)

    CONN RCPT 200POS SMD GOLD
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    DigiKey IT3M-200S-BGA(37) Box 22 1
    • 1 $19.88
    • 10 $19.88
    • 100 $15.875
    • 1000 $15.875
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    Avnet Americas IT3M-200S-BGA(37) Tray 24
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    Mouser Electronics IT3M-200S-BGA(37)
    • 1 $19.88
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    • 100 $15.87
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    Newark IT3M-200S-BGA(37) Bulk 24
    • 1 $28.8
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    • 100 $25.4
    • 1000 $25.4
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    Sager IT3M-200S-BGA(37)
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    Hirose Electric Co Ltd IT2-380S-BGA(37)

    CONN RCPT 380POS SMD GOLD
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    DigiKey IT2-380S-BGA(37) Tray
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    Hirose Electric Co Ltd IT5M-300S-BGA(37)

    CONN INTERPOSER 300 POS
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    DigiKey IT5M-300S-BGA(37) Tray 16
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    • 100 $41.5975
    • 1000 $41.5975
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    Mouser Electronics IT5M-300S-BGA(37)
    • 1 $50.12
    • 10 $41.6
    • 100 $41.59
    • 1000 $40.92
    • 10000 $40.92
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    Newark IT5M-300S-BGA(37) Bulk 16
    • 1 $66.2
    • 10 $66.2
    • 100 $58.4
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    Sager IT5M-300S-BGA(37) 1
    • 1 $55.2
    • 10 $51
    • 100 $41.4
    • 1000 $41.4
    • 10000 $41.4
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    Hirose Electric Co Ltd IT3D-200S-BGA(37)

    CONN RCPT 200POS SMD GOLD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey IT3D-200S-BGA(37) Box
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    Mouser Electronics IT3D-200S-BGA(37) 29
    • 1 $27.65
    • 10 $24.22
    • 100 $22.42
    • 1000 $20.47
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    Sager IT3D-200S-BGA(37)
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    BGA37 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA376 package SOT741-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


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    BGA376 OT741-1 OT741-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: TRAY CONTAINER UNIT : mm 3 x 7=21 NEC 80.0 135° C MAX. A' 37.70 40.00 37.50 37.70 27.95 7 BGA37.5 × 37.5A 40.00 135.9 PPE A 240.0 315.0 322.6 SECTION A-A' 3.92 (6.35) 7.62 37.70 Applied Package Quantity (pcs) 1296-pin Plastic BGA (37.5×37.5) (FLIP CHIP TYPE)


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    BGA37 1296-pin SSD-A-H7543 PDF

    BGA376

    Abstract: MS-034 sot741 MS 034
    Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 ∅v M C A B b 1/2 e e AB AA Y W V U T R P N M L K J H G F E


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    BGA376: OT741-1 MS-034 BGA376 MS-034 sot741 MS 034 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b 1/2 e e ∅v M C A B AB AA Y W V U T R P N M L K J H G F E D C B A y y1 C ∅w M C e e2 1/2 e 1 shape


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    BGA376: OT741-1 MS-034 PDF

    23X23

    Abstract: PBGA376 BGA376 PRBG0376FA-A
    Text: JEITA Package Code P-BGA376-23x23-1.00 RENESAS Code PRBG0376FA-A Previous Code 376FHP MASS[Typ.] 2.1g φb A A φx M S AB e A1 ZD e B D y S Index mark Laser mark S ZE E AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10111213141516171819202122


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    P-BGA376-23x23-1 PRBG0376FA-A 376FHP 23X23 PBGA376 BGA376 PRBG0376FA-A PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA376: plastic ball grid array package; 376 balls SOT1094-1 B D A D1 ball A1 index area E1 E A A2 A1 detail X C e1 e AF AD AB Y V T P M K H F D B 1/2 e ∅v ∅w b C A B C y y1 C AE AC AA e W U R e2 N L 1/2 e J G E C A 1 3 5 7 9 11 13 15 17 19 21 23 25


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    BGA376: OT1094-1 sot1094-1 MS-034 PDF

    SF-BGA372B-B-11

    Abstract: ST BGA
    Text: D Package Code: BGA372B C 24.13mm [0.950"] Ø 0.40mm [Ø 0.0156"] tooling hole X2 optional See BGA pattern code to the right for actual pattern layout Y 24.13mm [0.950"] 1.27mm typ. [0.050"] X Top View (reference only) 0.64mm [0.025"] typ. 2 0.36mm [0.014"] dia.


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    BGA372B SF-BGA372B-B-11 ST BGA PDF

    SF-BGA372A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA372A C 28.52mm [1.123"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 28.52mm [1.123"] X Top View reference only 1.5mm [0.059"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 1.5mm [0.059"] Ø 0.64mm pad [Ø 0.025"]


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    BGA372A FR4/G10 SF-BGA372A-B-11 PDF

    SAMSUNG MCP

    Abstract: ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor
    Text: Preliminary MCP MEMORY KBB0xB400M Document Title Multi-Chip Package MEMORY 64M Bit 8M x8/4M x16 Dual Bank NOR Flash *2 / 256M Bit (16Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History 0.0 Initial Draft (64M NOR Flash M-die_rev1.1)


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    KBB0xB400M 16Mx16) 4Mx16) 80-Ball 80x12 SAMSUNG MCP ECH information KBB0xB400M BA102 ba4901 UtRAM Density BA5101 samsung NAND memory BGA180 ba30 transistor PDF

    Untitled

    Abstract: No abstract text available
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


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    K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 08MAX PDF

    TAS5412

    Abstract: TAS5422 audio guide TAS5707 300w stereo amplifier with bass and treble TAS3308 TLV320AIC34 TMS320C6747 purepath studio bass treble using ne5532
    Text: Audio Guide Class-AB, Class-D and Class-G Amplifiers, Audio Converters, Clocks, Digital Signal Processing, Interface, Switches and USB Audio www.ti.com/audio 1Q 2009 2 Audio Guide ➔ Table of Contents Audio Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3


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    PDF

    pu2211

    Abstract: 4835D SiS 961 tp51112 MITAC MPU mitac 8 PU516 SiS961 SERVICE MANUAL tv hyundai w220 foxconn
    Text: SERVICE MANUAL FOR 8575A 8 5 7 5 A BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8575A N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………


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    mPGA478 SiS650 SiS691 SiS301LV CH7019 PCI1410GGU uPD72872 IEEE1394 pu2211 4835D SiS 961 tp51112 MITAC MPU mitac 8 PU516 SiS961 SERVICE MANUAL tv hyundai w220 foxconn PDF

    SiS 961

    Abstract: LA 1361 foxconn SIS 650 compal S1-A13 Compal Electronics 2N7002 MARK 702 100K-0402 BM 00603
    Text: A B C D E 1 1 Compal Confidential 2 2 Schematics Document P4 uFCBGA/uFCPGA Northwood with SIS Core Logic 2001-5-30 3 3 REV:1.0A 4 4 Compal Electronics, Inc. Title THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS,INC. AND CONTAINS CONFIDENTIAL


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    ACT10 SiS 961 LA 1361 foxconn SIS 650 compal S1-A13 Compal Electronics 2N7002 MARK 702 100K-0402 BM 00603 PDF

    R2A25416SP

    Abstract: SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system
    Text: 2009.10 Renesas Automotive www.renesas.com Introduction 1 Introduction 1 Imagination to Realize. Renesas Automotive Automotive Semiconductor Devices for the Future of Car Electronics The wider use of electronics in motor vehicles brings new requirements for automotive semiconductor devices.


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    REJ01F0001-0300 R2A25416SP SH7777 Renesas SH72546 Renesas SH72543 SH72544 car ECU training sh72543 R5E72546RKBG SH 72546 Wiring Diagram of NIPPON car center lock system PDF

    FSQ510 Equivalent

    Abstract: BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2
    Text: SEMICONDUCTORS MCU/MPU/DSP Atmel. . . . . . . . . 167, 168, 169, 170, 171, 172 Blackhawk. . . . . . . . . . . . . . . . . . . . . . . . . 173 Cyan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 Cypress. . . . . . . . . . . . . . . 175, 176, 177, 178


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    GP-20) FSQ510 Equivalent BTA12 6008 bta16 6008 ZIGBEE interface with AVR ATmega16 Precision triac control thermostat thyristor t 558 f eupec gw 5819 diode transistor a564 A564 transistor BSM25GP120 b2 PDF

    BA100 diode

    Abstract: BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode
    Text: KADxx0300B - Txxx MCP MEMORY Document Title Multi-Chip Package MEMORY 128M Bit Two Dual Bank 64M Bit NOR Flash Memory / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark August 9, 2002 Preliminary 0.0 Initial Draft 0.1 Revised (UtRAM)


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    KADxx0300B 2Mx16) 69-Ball 10MAX BA100 diode BA115 BA116 BA961 SAMSUNG MCP ba841 ba7 transistor BA124 BA127 BA133 diode PDF

    BA107

    Abstract: ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


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    K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA107 ba4901 ba741 BA115 ba901 BA5101 BA100 diode BA102 BA116 ba941 PDF

    8 pin ic sdc 3733

    Abstract: MITAC 8640 PU516 windows china tv kit STR power supply ps2 mouse diagram li-ion battery pack 14.8V RJ 49 CONNECTORS toshiba c850 PU515 SIEMENS BST h45 100
    Text: SERVICE MANUAL FOR 8640 8640 BY: Dragon Jiang TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Nov .2002 8640 N/B Maintenance Contents 1. Hardware Engineering Specification -1.1 Introduction -1.2 System Overview -1.3 System Hardware -1.4 Electrical Characteristic -


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    SIS650/645DX SIS962 3437S) CB1410 map17 8 pin ic sdc 3733 MITAC 8640 PU516 windows china tv kit STR power supply ps2 mouse diagram li-ion battery pack 14.8V RJ 49 CONNECTORS toshiba c850 PU515 SIEMENS BST h45 100 PDF

    VT1611A

    Abstract: power module hd 110M NAD-16A gld tv schematic diagram IC25N010ATDA040-0 HT14X13-102 QD141X1LH03 PCT303W LTN150P1-L03 pj77
    Text: SERVICE MANUAL FOR 8500 BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Aug . 2002 8500 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………


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    mPGA478 SiS650 SiS691 SiS301LV CH7017 W83697HF MB86613L IEEE1394 VT1611A power module hd 110M NAD-16A gld tv schematic diagram IC25N010ATDA040-0 HT14X13-102 QD141X1LH03 PCT303W LTN150P1-L03 pj77 PDF

    BA114

    Abstract: BA107 samsung ba92 BA122
    Text: K8D6x16UTM / K8D6x16UBM FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1 Revised


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    K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA114 BA107 samsung ba92 BA122 PDF

    mitsumi dc motor r-14

    Abstract: QD141X1LH03 south bridge SIS 968 samsung crt monitor 56v circuit diagram SDR-081 F3437 mitac 8 diode S4 68a resistor 56E R87 motherboard mPGA478 circuit
    Text: SERVICE MANUAL FOR 8575 BY: Sissel Diao TESTING TESTING TECHNOLOGY TECHNOLOGY DEPARTMENT DEPARTMENT // TSSC TSSC Jun. 2002 8575 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………


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    mPGA478 SiS650 SiS691 SiS301LV CH7019 PCI1410GGU uPD72872 IEEE1394 mitsumi dc motor r-14 QD141X1LH03 south bridge SIS 968 samsung crt monitor 56v circuit diagram SDR-081 F3437 mitac 8 diode S4 68a resistor 56E R87 motherboard mPGA478 circuit PDF

    BA961

    Abstract: BA43 48FBGA samsung nor flash ba107
    Text: K8D6x16UTM / K8D6x16UBM NOR FLASH MEMORY Document Title 64M Bit 8M x8/4M x16 Dual Bank NOR Flash Memory Revision History Revision No. History Draft Date Remark 0.0 Initial Draft January 10, 2002 Preliminary 1.0 Final Specification May 22, 2002 Final 1.1


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    K8D6x16UTM K8D6x16UBM 48TSOP1 16M/16M 48FBGA 047MAX BA961 BA43 samsung nor flash ba107 PDF

    SAMSUNG MCP

    Abstract: KBB05A500 transistor BA29 BA102 NAND FLASH BGA transistor ba47 Pre-programming nand samsung UtRAM Density BA841 BGA-100
    Text: KBB0xA500M - T402 MCP MEMORY Document Title Multi-Chip Package MEMORY 64M Bit 8Mx8/4Mx16 Dual Bank NOR Flash *2 / 128M Bit (8Mx16) NAND Flash / 64M Bit (4Mx16) UtRAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft October 15, 2002


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    KBB0xA500M 8Mx8/4Mx16) 8Mx16) 4Mx16) 150uA 100uA 200uA 80-Ball 80x12 SAMSUNG MCP KBB05A500 transistor BA29 BA102 NAND FLASH BGA transistor ba47 Pre-programming nand samsung UtRAM Density BA841 BGA-100 PDF

    SAMSUNG MCP

    Abstract: samsung toggle mode NAND ba7810 BA102 NAND FLASH BGA UtRAM Density BA5101 BA340 BGA-60
    Text: SEC Only MCP MEMORY KAB0xD100M - TxGP Document Title Multi-Chip Package MEMORY 64M Bit 8Mx8/4Mx16 Dual Bank NOR Flash / 128M Bit (8Mx16) NAND Flash / 32M Bit (2Mx16) UtRAM Revision History Revision No. History Draft Date Remark 0.0 Initial Draft March 20, 2002


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    KAB0xD100M 8Mx8/4Mx16) 8Mx16) 2Mx16) 39page) 43page) 80-Ball SAMSUNG MCP samsung toggle mode NAND ba7810 BA102 NAND FLASH BGA UtRAM Density BA5101 BA340 BGA-60 PDF