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    1999E Search Results

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    1999E Price and Stock

    Rochester Electronics LLC MAX1999EEI

    IC REG LIN TFT/LCD PWR SUP/BUFF
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    DigiKey MAX1999EEI Bulk 43,442 40
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    Rochester Electronics LLC MAX1999EEI+

    DUAL SWITCHING CONTROLLER, CURRE
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    DigiKey MAX1999EEI+ Bulk 5,952 34
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    Maxim Integrated Products MAX1999EEI+

    IC REG QD BUCK/LNR SYNC 28QSOP
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    DigiKey MAX1999EEI+ Tube 12 1
    • 1 $9.96
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    Rochester Electronics MAX1999EEI+ 5,952 1
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    CoreStaff Co Ltd MAX1999EEI+ 32
    • 1 $3.417
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    • 100 $3.199
    • 1000 $3.177
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    Maxim Integrated Products MAX1999EEI+T

    IC REG QD BUCK/LNR SYNC 28QSOP
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    DigiKey MAX1999EEI+T Reel 2,500
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    Bristol Electronics MAX1999EEI+T 1,579
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    Maxim Integrated Products MAX1999EEI

    MAX1999 High-Efficiency, Quad Output, Main Power-Supply Controller For Notebook Computers '
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Rochester Electronics MAX1999EEI 43,442 1
    • 1 $7.61
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    1999E Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    GS840E18A

    Abstract: GS840E32A GS840E36A
    Text: Preliminary GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original
    PDF GS840E18/32/36AT/B-190/180/166/150/100 840E18A GS840E18A GS840E32A GS840E36A

    TS 100-12

    Abstract: GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840H18/32/36AT/B-180/166/150/100 100-lead 840H18A 840E18 840H18 TS 100-12 GS840H18A GS840H18AT-150 GS840H18AT-166 GS840H18AT-180 GS840H32A GS840H36A B180

    Untitled

    Abstract: No abstract text available
    Text: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840E18/32/36AT/B-190/180/166/150/100 100-lead 119-Bump GS840E18/32/362 1999E

    ESPC

    Abstract: 0171B
    Text: RealView Compilation Tools for BREW Version 1.2 Compilers and Libraries Guide Copyright 2001, 2002 ARM Limited. All rights reserved. ARM DUI 0171B RealView Compilation Tools for BREW Compilers and Libraries Guide Copyright © 2001, 2002 ARM Limited. All rights reserved.


    Original
    PDF 0171B ESPC 0171B

    lenovo

    Abstract: OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573
    Text: 本图纸版权属原厂家所有 5 仅在服务该产品使用者时使用 4 3 立成网:综合性笔记本维修服务平台 2 1 < SONOMA > DC/DC & Charger CPU VR ARIES II BLOCK DIAGRAM Dothan Yonah /Alviso D +1.8V MAX6648 +VCCP C P:5 P:4 VCORE_VGA LVDS


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    PDF ADI3205 1715EEI 1999EEI MAX1993ETG MAX8527EUD LP2989AILD-2 LP2996MRX OZ862AS CK410 CY28411 lenovo OZ862AS lenovo t42 VIA10 foxconn FB-23 VIA15 FMC-101 Lenovo fpc R4573

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation


    Original
    PDF GS840E18/32/36AT/B-200/180/166/150/100 200MHzâ 100MHz control2/362 2000G GS840E18/32/362 032/2000G; 840E18

    B180

    Abstract: V/GS840E18A
    Text: GS840E18/32/36AGT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840E18/32/36AGT/B-180/166/150/100 840E18A B180 V/GS840E18A

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Single Cycle Deselect SCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840H18/32/36AT/B-180/166/150/100 840H18A B180

    B180

    Abstract: No abstract text available
    Text: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840E18/32/36AT/B-180/166/150/100 840E18A B180

    B180

    Abstract: GS84018
    Text: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply


    Original
    PDF GS84018/32/36T/B-180/166/150/100 100-lead GS84018/32/362 1999E 032/2000G 032/2000G; B180 GS84018

    GS840E18A

    Abstract: GS840E32A GS840E36A B180
    Text: Preliminary GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original
    PDF GS840E18/32/36AT/B-180/166/150/100 100-lea 840E18A GS840E18A GS840E32A GS840E36A B180

    GS840E18A

    Abstract: GS840E32A GS840E36A
    Text: Preliminary GS840E18/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation


    Original
    PDF GS840E18/32/36AT/B-200/180/166/150/100 100table, 840E18A GS840E18A GS840E32A GS840E36A

    180i

    Abstract: GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180
    Text: GS840E18/32/36AT/B-180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840E18/32/36AT/B-180/166/150/100 100-lead 119Code: 840E18A 180i GS840E18A GS840E18AT-166 GS840E18AT-180 GS840E32A GS840E36A B180

    B180

    Abstract: No abstract text available
    Text: GS840H18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • High Output Drive current.


    Original
    PDF GS840H18/32/36T/B-180/166/150/100 GS840H18/32/362 1999E 2000G GS840E18/32/362 032/2000G; 840H18 B180

    GS840E18A

    Abstract: GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A
    Text: GS840E18/32/36AT/B-190/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipelined operation • Dual Cycle Deselect DCD operation • 3.3 V +10%/–5% core power supply


    Original
    PDF GS840E18/32/36AT/B-190/180/166/150/100 100-lead 840E18A GS840E18A GS840E18AT-180 GS840E18AT-190 GS840E32A GS840E36A

    interworking between arm and thumb in arm7tdmi

    Abstract: ARM1020E ARM1136JF-S ARM920T VFP10 JAN 6418 Rogue Wave Software
    Text: RealView Compilation Tools Version 2.1 Compiler and Libraries Guide Copyright 2002-2004 ARM Limited. All rights reserved. ARM DUI 0205D RealView Compilation Tools Compiler and Libraries Guide Copyright © 2002-2004 ARM Limited. All rights reserved. Release Information


    Original
    PDF 0205D their-62 int64 Index-12 interworking between arm and thumb in arm7tdmi ARM1020E ARM1136JF-S ARM920T VFP10 JAN 6418 Rogue Wave Software

    Untitled

    Abstract: No abstract text available
    Text: GS84018/32/36AGT/B*-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and


    Original
    PDF GS84018/32/36AGT/B GS84018/32/36A 840xxA 84018A

    Untitled

    Abstract: No abstract text available
    Text: GS840E18/32/36AGT/B*-180/166/150/100 Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and bump 5R in the BGA . Holding the FT mode pin/bump low


    Original
    PDF GS840E18/32/36AGT/B GS840E18/32/36A 840E18A

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS84018/32/36AT/B-200/180/166/150/100 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 200MHz100MHz 3.3 V VDD 4Mb Sync Burst SRAMs 3.3 V and 2.5 V I/O Features degradation of chip performance. • FT pin for user-configurable flow through or pipelined operation


    Original
    PDF GS84018/32/36AT/B-200/180/166/150/100 200MHzâ 100MHz GS84018/32/36A1 2000G 032/2000G; 84018A

    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS840H18/32/36AT/B-200/180/166 TQFP, BGA Commercial Temp Industrial Temp 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation.


    Original
    PDF GS840H18/32/36AT/B-200/180/166 poH18/32/36A1 GS840H18/32/36A1 2000G 032/2000G; 840H18A

    B180

    Abstract: No abstract text available
    Text: GS840E18/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Dual Cycle Deselect DCD Operation. • 3.3V +10%/-5% Core power supply


    Original
    PDF GS840E18/32/36T/B-180/166/150/100 100-lead GS840E18/32/362 1999E 2000G 032/2000G; B180

    GS84018

    Abstract: B180
    Text: GS84018/32/36T/B-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features • FT pin for user configurable flow through or pipelined operation. • Single Cycle Deselect SCD Operation. • 3.3V +10%/-5% Core power supply


    Original
    PDF GS84018/32/36T/B-180/166/150/100 100-lead GS84018/32/362 1999E 032/2000G 032/2000G; GS84018 B180

    Untitled

    Abstract: No abstract text available
    Text: BYW77G-200 HIGH EFFICIENCY FAST RECOVERY DIODES MAIN PRODUCT CHARACTERISTICS I f a v 25 A V rrm trr 200 V 50 ns VF 0.85 V 1 & 3—^ |—4 FEATURES AND BENEFITS 1 • VERYSMALLCONDUCTION LOSSES ■ NEGLIGIBLE SWITCHING LOSSES ■ LOW FORWARD AND REVERSE RECOVERY


    OCR Scan
    PDF BYW77G-200

    Untitled

    Abstract: No abstract text available
    Text: STPS3L25S LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS If av 3A V rrm 25 V Tj (max) 150°C V f (max) 0.44 V FEATURES AND BENEFITS • VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION ■ OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST


    OCR Scan
    PDF STPS3L25S DO-214AB