EPA025A-70
Abstract: 0466 1.5 micron
Text: Excelics EPA025A-70 DATA SHEET High Efficiency Heterojunction Power FET 6 6 ' • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +21.5dBm TYPICAL OUTPUT POWER 8.0dB TYPICAL POWER GAIN AT 18GHz TYPICAL 0.85dB NOISE FIGURE AND 11.0dB ASSOCIATED GAIN AT 12GHz
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EPA025A-70
70mil
18GHz
12GHz
Rn/50
EPA025A-70
0466 1.5 micron
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EFA040A-70
Abstract: PT 1132
Text: Excelics EFA040A-70 DATA SHEET Low Distortion GaAs Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +22.0dBm TYPICAL OUTPUT POWER 8.0dB TYPICAL POWER GAIN AT 12GHz 0.3 X 400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EFA040A-70
70mil
12GHz
18GHz
EFA040A-70
PT 1132
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EFA080A-70
Abstract: No abstract text available
Text: Excelics EFA080A-70 DATA SHEET Low Distortion GaAs Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +23.5dBm TYPICAL OUTPUT POWER 7.0 dB TYPICAL POWER GAIN AT 12GHz 0.3 X 800 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EFA080A-70
70mil
12GHz
18GHz
EFA080A-70
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17-pin
Abstract: No abstract text available
Text: ZIG-ZAG IN-LINE PACKAGE 17 PIN PLASTIC ZIP-17P-M02 Lead pitch 70mil Sealing method Plastic mold 17-pin plastic ZIP ZIP-17P-M02 17-pin plastic ZIP (ZIP-17P-M02) 31.50(1.240)MAX 4.20(.165)MAX 24.00(.945) R1.80(.071) 12.00 (.472) 6.50 (.256) INDEX 1.778(.070)TYP
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ZIP-17P-M02
70mil
17-pin
ZIP-17P-M02)
Z17003S-1C-2
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EPA040A-70
Abstract: igd 515 Excelics 70mil PACKAGE
Text: EPA040A-70 High Efficiency Heterojunction Power FET UPDATED 11/22/2004 FEATURES • • • • • • NON-HERMETIC LOW COST CERAMIC 70MIL PACKAGE +25.5 dBm OUTPUT POWER AT 1dB COMPRESSION 7.0 dB POWER GAIN AT 12GHz 0.3 x 800 MICRON RECESSED “MUSHROOM” GATE
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EPA040A-70
70MIL
12GHz
18GHz
EPA040A-70
igd 515
Excelics 70mil PACKAGE
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Untitled
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M03 EIAJ code : ∗SDIP040-P-0600-1 40-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M03 40-pin plastic SH-DIP (DIP-40P-M03) +0.20 +.008 38.35 –0.30 1.510 –.012
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DIP-40P-M03
SDIP040-P-0600-1
70mil
600mil
40-pin
DIP-40P-M03)
D40012S-1C-2
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EPA080A-70
Abstract: 744 773 047
Text: Excelics EPA080A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +25.5dBm TYPICAL OUTPUT POWER 7.0dB TYPICAL POWER GAIN AT 12GHz 0.3 X 800 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA080A-70
70mil
12GHz
EPA080A-70
744 773 047
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11-source
Abstract: maximum idss FET
Text: EPA030C-70 High Efficiency Heterojunction Power FET UPDATED 01/06/2005 FEATURES • • • • • • • NON-HERMETIC LOW COST CERAMIC 70MIL PACKAGE +22.0 dBm OUTPUT POWER AT 1dB COMPRESSION 8.0 dB POWER GAIN AT 18GHz 0.3 x 300 MICRON RECESSED “MUSHROOM” GATE
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EPA030C-70
70MIL
18GHz
12GHz
440mW
370mW
11-source
maximum idss FET
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EPA040A-70
Abstract: No abstract text available
Text: Excelics EPA040A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +23.5dBm TYPICAL OUTPUT POWER 7.0dB TYPICAL POWER GAIN AT 18GHz 0.3 X 400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION
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EPA040A-70
70mil
18GHz
12GHz
Com52
EPA040A-70
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070-007
Abstract: SDIP028-P-0400-1 020MIN
Text: SHRINK DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20 26.00 –0.30 1.024 +.008 –.012
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DIP-28P-M03
SDIP028-P-0400-1
70mil
400mil
28-pin
DIP-28P-M03)
D28012S-3C-3
070-007
SDIP028-P-0400-1
020MIN
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Untitled
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 64 PIN CERAMIC DIP-64C-A06 EIAJ code : SDIP064-C-0750-2 Lead pitch 70mil Row spacing 750mil Sealing method Metal seal 64-pin ceramic SH-DIP DIP-64C-A06 64-pin ceramic SH-DIP (DIP-64C-A06) 56.90±0.56 (2.240±.022) 8.89(.350) DIA
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DIP-64C-A06
SDIP064-C-0750-2
70mil
750mil
64-pin
DIP-64C-A06)
D64006SC-1-2
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DIP-64P-M01
Abstract: SDIP064-P-0750-1 020MIN 750-mil
Text: SHRINK DUAL IN-LINE PACKAGE 64 PIN PLASTIC DIP-64P-M01 EIAJ code : SDIP064-P-0750-1 64-pin plastic SH-DIP Lead pitch 70mil Row spacing 750mil Sealing method Plastic mold DIP-64P-M01 64-pin plastic SH-DIP (DIP-64P-M01) +0.22 58.00 –0.55 +.008 2.283 –.022
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DIP-64P-M01
SDIP064-P-0750-1
70mil
750mil
64-pin
DIP-64P-M01)
D64001S-3C-4
DIP-64P-M01
SDIP064-P-0750-1
020MIN
750-mil
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SIC01
Abstract: "vlsi technology" on 5718 ICC05
Text: SIC01 SERIES 70mil 1.778mm SHRINK IC SOCKET SUMMARY As IC electronic packaging progresses towards further LSI/VLSI technology, KEL Corp. has met this challenge by developing a new 70mil Shrink IC socket. Kel has again incorporated a high reliability and quality
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SIC01
70mil
778mm)
70mil
ICC05
SIC01
"vlsi technology"
on 5718
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Excelics 70mil PACKAGE
Abstract: EFA080A-70
Text: EFA080A-70 Low Distortion GaAs Power FET FEATURES S S 70 D 40 • • • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +23.5dBm TYPICAL OUTPUT POWER 7.0 dB TYPICAL POWER GAIN AT 12GHz 0.3 X 800 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION ADVANCED EPITAXIAL DOPING PROFILE
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EFA080A-70
70mil
12GHz
18GHz
Excelics 70mil PACKAGE
EFA080A-70
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Untitled
Abstract: No abstract text available
Text: GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 70MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG70 SERIES CHIP DIMENSIONS CHIP APPEARANCE 47mil 70mil GNSG70-700E GNSG70-900E
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GNSG70-500E
GNSG70-700E
GNSG70-900E
GNSG70-B00E
70MIL
GNSG70
47mil
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V3055
Abstract: No abstract text available
Text: EPA018B-70 High Efficiency Heterojunction Power FET ISSUED 11/01/2007 FEATURES • • • • • • • Non-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 11.0 dB Power Gain at 18GHz Typical 0.75 dB Noise Figure and 12.5 dB Associated Gain at 12GHz
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EPA018B-70
70mil
18GHz
12GHz
V3055
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EPA060B-70
Abstract: 2657 FET EPA060B
Text: Excelics EPA060B-70 DATA SHEET High Efficiency Heterojunction Power FET 6 6 * PROVIDES EXTRA HIGH POWER EFFICIENCY, AND HIGH RELIABILITY Applications • High Dynamic Range LNA • DC to 18 GHz ' 0LQ $OO /HDGV Features • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE
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EPA060B-70
70mil
26dBm
Rn/50
EPA060B-70
2657 FET
EPA060B
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Excelics EPA018A
Abstract: EPA018A-70 EPA018A7 Excelics 70mil PACKAGE
Text: Excelics EPA018A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +20.0dBm TYPICAL OUTPUT POWER 11.0dB TYPICAL POWER GAIN AT 18GHz TYPICAL 0.75dB NOISE FIGURE AND 12.5dB ASSOCIATED
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EPA018A-70
70mil
18GHz
12GHz
Excelics EPA018A
EPA018A-70
EPA018A7
Excelics 70mil PACKAGE
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EFA025A-70
Abstract: No abstract text available
Text: EFA025A-70 Low Distortion GaAs Power FET UPDATED 04/28/2006 FEATURES • • • • • • • • None-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 10.0 dB Power Gain at 12GHz 7.0 dB Power Gain at 18GHz Typical 1.50 dB Noise Figure and
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EFA025A-70
70mil
12GHz
18GHz
Rn/50
EFA025A-70
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d480
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 48 PIN PLASTIC DIP-48P-M01 EIAJ code : SDIP048-P-0600-1 48-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-48P-M01 48-pin plastic SH-DIP (DIP-48P-M01) +0.20 43.69 –0.30 +.008 1.720 –.012
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DIP-48P-M01
SDIP048-P-0600-1
70mil
600mil
48-pin
DIP-48P-M01)
D48002S-3C-3
d480
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dip 24 dimension
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 Lead pitch 70mil Row spacing 300mil Sealing method Plastic mold 24-pin plastic SH-DIP DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20 22.05 –0.30 .868 +.008 –.012
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DIP-24P-M05
SDIP024-P-0300-1
70mil
300mil
24-pin
DIP-24P-M05)
D24034S-3C-2
dip 24 dimension
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EPA018BV-70SC
Abstract: Excelics 70mil PACKAGE noise gate compression
Text: EPA018BV-70SC High Efficiency Heterojunction Power FET ISSUED 01/31/2006 FEATURES • • • • • • • None-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 11.0 dB Power Gain at 18GHz Typical 0.75 dB Noise Figure and
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EPA018BV-70SC
70mil
18GHz
12GHz
EPA018BV-70SC
Excelics 70mil PACKAGE
noise gate compression
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EFA018A-70
Abstract: EFA018A
Text: Excelics EFA018A-70 DATA SHEET Low Distortion GaAs Power FET 20 P1dB G1dB PAE NF Ga S S 70 D G All Dimensions In mils. ELECTRICAL CHARACTERISTICS Ta = 25 OC SYMBOLS 44 19 4 40 • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +18.5dBm TYPICAL OUTPUT POWER
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EFA018A-70
70mil
12GHz
18GHz
EFA018A-70
EFA018A
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JKX050S65
Abstract: JKX0-50
Text: ib : File No. s : I — 2 67 SHEET r~ 1 / 1 j 2.50 2.50 llllllllllllllllllllllll o o H CO SPECIFICATION Insulator R esistance^ OOMegohms Min Contact Resistance:70Milliohm s Max Temperature:— 4 0 'C ~ + 8 5 'C lnsulator:High Temperature Thermoplastic U L 9 4 V -0 Glass Filled
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70Milliohms
UL94V-0
JKX050S65
JKX050S65
JKX0-50
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