CHL8228G-00CRT
Abstract: No abstract text available
Text: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based
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CHL8225G/8G
40-pin
56-pin
CHL8225G/8G
CHL8228G
CHL8228G
CHL8228G-00CRT
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schematic atx 250
Abstract: No abstract text available
Text: nRF2460 2.4 GHz wireless mono audio streamer Product Specification v1.0 Features • • • • • • • • • • • • World-wide 2.4 GHz ISM band operation 6x6 mm 36 pin QFN package 4 Mbps on-air data rate Mono 32 kHz audio rate 16 bit resolution
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nRF2460
schematic atx 250
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schematic atx 250
Abstract: No abstract text available
Text: nRF2460 2.4 GHz wireless mono audio streamer Product Specification v1.0 Features • • • • • • • • • • • • World-wide 2.4 GHz ISM band operation 6x6 mm 36 pin QFN package 4 Mbps on-air data rate Mono 32 kHz audio rate 16 bit resolution
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nRF2460
schematic atx 250
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6x6mm
Abstract: No abstract text available
Text: KEYSWITCHES SERIES KB CHARACTERISTICS • • • • • SPECIFICATIONS Small 6x6 mm Base Lighted and not lighted Round and square caps Available w/o Cap Only 8.2 mm High Rating: Switching 50 mA @ 12VDC max Contact Resistance: 100 mΩ max initial Insulation Resistance: 100 MΩ min @ 500V
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12VDC
6x6mm
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84 FBGA
Abstract: JEDEC FBGA 141-PIN tray fbga 84
Text: TRAY CONTAINER NEC 135.9 119.6 PPE 14x35=490 UNIT : mm 135°C MAX. 7 FBGA 6×6ESP A' 6.50 8.15 9.20 A 6.50 8.80 299.2 7.90 315.0 322.6 Section A – A' 6.50 (6.16) (5.62) 7.62 6.00 Applied Package Quantity (pcs) Tray FBGA 6×6 ESP 64-pin Plastic FBGA (6×6)
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64-pin
65-pin
84-pin
85-pin
97-pin
141-pin
SSD-A-H7453-3
84 FBGA
JEDEC FBGA
tray fbga 84
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JEDEC tray standard
Abstract: JEDEC TRAY DIMENSIONS FBGA 97PIN TRAY DIMENSIONS fBGA package tray 12
Text: TRAY CONTAINER NEC 119.6 8.80 6.50 299.2 315.0 322.6 7.90 6.50 6.00 (5.62) (6.16) Section A – A' 7.62 6.50 135° CMAX. FBGA6 x 6C A' A 8.15 9.20 135.9 PPE 14 × 35=490 UNIT : mm Applied Package Quantity (pcs) 64-pin Plastic FBGA (6×6) 65-pin Plastic FBGA (6×6)
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65-pin
490MAX.
64-pin
85-pin
97-pin
SSD-A-H7469-3
JEDEC tray standard
JEDEC TRAY DIMENSIONS FBGA
97PIN
TRAY DIMENSIONS
fBGA package tray 12
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DIELECTRIC COAXIAL RESONATOR
Abstract: Epcos coaxial resonators
Text: Gurtung und Verpackung Taping and Packing Koaxialresonatoren und dielektrische Resonatoren werden standardmäßig in Paletten geliefert. Lieferung im Gurt auf Anfrage. Gurtung und Rollenverpackung entsprechen den Vorschriften von DIN IEC 286, Teil 3. Coaxial and dielectric resonators are supplied in trays, if not
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circuit diagram of sequential LED
Abstract: diagram for led cfl bulb cl8801 6x6 TRAY k6 driver QFn Package tray CL8801K63-G
Text: CL8801 Product Summary Sheet Sequential Linear LED Driver 120V transient protection Applications: ►► Fluorescent tube retrofit ►► Incandescent & CFL bulb replacement ►► General LED lighting AC Mains TAP1 BIAS TAP2 1 0 in reg TAP3 1 0 TAP4 1 0 GND
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CL8801
CL8801
40-Lead
CL8801,
circuits3012
CL8801K6-G
CL8801K63-G
circuit diagram of sequential LED
diagram for led cfl bulb
6x6 TRAY
k6 driver
QFn Package tray
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circuit diagram of sequential LED
Abstract: CL8800K63-G CL8800 tray qfn 6x6 33-lead diagram for led cfl bulb 6x6 TRAY QFn Package tray cl8800k63 k6 driver
Text: CL8800 Product Summary Sheet Sequential Linear LED Driver Applications: ►► Fluorescent tube retrofit ►► Incandescent & CFL bulb replacement ►► General LED lighting Transient Protection 22Ω 33Ω 275VAC 10mm 440VDC 1.5kW AC Mains TAP1 TAP2 BIAS 1 0
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275VAC
CL8800
440VDC
120VAC
230VAC
CL8800
40-Lead
CL8800,
brid3012
circuit diagram of sequential LED
CL8800K63-G
tray qfn 6x6
33-lead
diagram for led cfl bulb
6x6 TRAY
QFn Package tray
cl8800k63
k6 driver
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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cu pillar
Abstract: Flip Chip Substrate HL832 ds7409 FCCSP amkor flip chiparray amkor HL832N CABGA 48 7x7 amkor cabga thermal resistance
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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BGA 64 PACKAGE thermal resistance
Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect
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63Sn/37Pb)
BGA 64 PACKAGE thermal resistance
FCCSP
CABGA 6x6
amkor flip
fcBGA PACKAGE thermal resistance
bga 9x9 Shipping Trays
CABGA 8X8
BGA 256 PACKAGE power dissipation
BGA 256 PACKAGE thermal resistance
BGA45
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tray qfn 6x6
Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA
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O-236AB
OT-23)
OT-23
O-220
O-252
OT-223
QFN00/Reel
490/Tray
tray qfn 6x6
tqfp 7x7 tray
QFN tray 5x5
QFN tray
QFn Package tray
QFN tray qfn 4x4
QFN tray 4x4
LQFP Package tray
6x6 TRAY
tray QFN 5x5
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Full Bridge N-Channel FET driver IC
Abstract: No abstract text available
Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o
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MLX81100
16-bit
CPU90
30kbyte
100-kBaud
100Hz
100kHz
16-channel
10-bit
Full Bridge N-Channel FET driver IC
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CL8800
Abstract: Pcb cl8800 tray qfn 6x6 QFN ac driver led
Text: Supertex inc. CL8801 Sequential Linear LED Driver Features General Description ►► Minimal component count base config: CL8801 + 4 resistors + diode bridge ►► No magnetics, no capacitors ►► Up to 13W output ►► >115Lm/W using efficient LEDs
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CL8801
115Lm/W
CL8801
CL8801,
DSFP-CL8801
A040412
CL8800
Pcb cl8800
tray qfn 6x6
QFN ac driver led
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CHL8325A
Abstract: No abstract text available
Text: Digital Multi-Phase Buck Controller FEATURES IR3541 CHL8325A/B DESCRIPTION • 5-phase dual output PWM Controller Phases are flexibly assigned between Loops 1 & 2 Intel VR12, AMD® 400kHz & 3.4MHz SVI and Memory modes The IR3541 and CHL8325A/B are dual-loop digital
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IR3541
CHL8325A/B
400kHz
IR3541
CHL8325A/B
IR3541/CHL8325A)
CHL8325A
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peak tray qfn 6x6
Abstract: tqfp 6X6 tray 6x6 TRAY tqfp
Text: MLX81100 DC-Motor Controller Features CPU o o MelexCM CPU Dual RISC CPU – 5MIPS o LIN protocol controller o 16-bit application CPU90 Internal RC-Oscillator Memories o o 2kbyte RAM, 30kbyte Flash, 128 byte EEPROM Flash for series production Periphery o
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MLX81100
16-bit
CPU90
30kbyte
100-kBaud
100Hz
100kHz
16-channel
10-bit
peak tray qfn 6x6
tqfp 6X6 tray
6x6 TRAY tqfp
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atmel 038
Abstract: QFN-6x6 48 tray qfn 6x6 5047B QFN-6x6 package AT88RF1354 ATMEL Tape and Reel code AT88SC0808CRF AT88SC1616CRF AT88SC6416CRF
Text: Standard Product Offerings The families of Secure RF devices in the tables below are available as standard products. Wafers, smart card modules, RFID tags, and standard package options are listed. Ordering codes indicate specific options to be used with the device number e.g.,
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AT88SC6416CRF-MR1
5047C
5047C·
atmel 038
QFN-6x6 48
tray qfn 6x6
5047B
QFN-6x6 package
AT88RF1354
ATMEL Tape and Reel code
AT88SC0808CRF
AT88SC1616CRF
AT88SC6416CRF
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xg1015-SE
Abstract: XB1013-qt CMM6001-BD CFP0103-SP CMM6004-BD XZ1003-QT XU1016 QH XP1073-BD XD1008-QH XP1035-BD
Text: Sales Contact Information NORTH AMERICA COLORADO, UTAH USA ALABAMA, FLORIDA, GEORGIA, MISSISSIPPI, NORTH CAROLINA, SOUTH CAROLINA,TENNESSEE, Electronic Marketing Associates EMA 919-847-8800 rdenny@emarep.com Alabama Office 256-880-8050 djones@emarep.com
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QFN48 6x6
Abstract: No abstract text available
Text: PM6690 Three phase controller for Intel MVP7 CPU power supply Data brief Features • 4.5 V to 28 V input voltage range ■ 0.25 V to 1.52 V output voltage range, 8 bit SVID ■ IMVP7 spec compliant ■ Selectable PWM switching frequency, maximum temperature, maximum currents,
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PM6690
QFN48 6x6
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CL8800
Abstract: 13w cfl circuit a0404 Pcb cl8800
Text: Supertex inc. CL8800 Sequential Linear LED Driver Features ►► Minimal component count base config: CL8800 + 6 resistors + diode bridge ►► No magnetics, no capacitors ►► Up to 13W output ►► >115Lm/W using efficient LEDs ►► 90% typical electrical efficiency
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CL8800
115Lm/W
CL8800
CL8800,
A040412
13w cfl circuit
a0404
Pcb cl8800
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Untitled
Abstract: No abstract text available
Text: IR3563A Single Output Digital Multi-Phase Controller FEATURES DESCRIPTION • 8-phase single output PWM Controller Intel VR12 and VR12.5 modes & Memory VR mode Overclocking & Gaming Mode PVI and SVI GPU VR modes Switching frequency from 200kHz to 2MHz per
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IR3563A
200kHz
sys12V
CHL8515
IR3563A
CHL8505
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IR3563A
Abstract: VR12 tray qfn 6x6 IR3563 intel VR12 IR3563AM VR12 INTEL PWM charge controller circuit Diagram
Text: IR3563A Single Output Digital Multi-Phase Controller FEATURES DESCRIPTION • 8-phase single output PWM Controller Intel VR12 and VR12.5 modes & Memory VR mode Overclocking & Gaming Mode PVI and SVI GPU VR modes Switching frequency from 200kHz to 2MHz per
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IR3563A
200kHz
CHL8515
IR3563A
CHL8505
VR12
tray qfn 6x6
IR3563
intel VR12
IR3563AM
VR12 INTEL
PWM charge controller circuit Diagram
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10X14 package tray
Abstract: 5060
Text: CHIP PACKING METHOD W A FFL E P A C K Packing method Top cover carrier 25 carriers i P 26 carriers 717 PACKAGE INFORMATION Carrier o Ï "1 T'LZJ Figure 1. Carrier Drawings 718 ELECTRONICS PACKAGE INFORMATION Table 1. Carrier Dimensions Unit:mm, Tolerance: ± 0. Imm
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OCR Scan
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10x10
13x14
20x15
10x14
11x11
13x14
16x15,
20x15
20x18
10X14 package tray
5060
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