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    56FBGA Price and Stock

    BPM Microsystems Inc FASMR256FBGAC

    SOCKET MODULE, 256 PIN BGA; B=17
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FASMR256FBGAC 1
    • 1 $1872.97
    • 10 $1872.97
    • 100 $1872.97
    • 1000 $1872.97
    • 10000 $1872.97
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    56FBGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    K4T2G264QA

    Abstract: RESISTOR 820 OHM
    Text: RDIMM DDR2 SDRAM DDR2 Registered SDRAM MODULE 240pin Registered Module based on 1Gb A-die 72-bit ECC 68FBGA & 56FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.


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    PDF 240pin 72-bit 68FBGA 56FBGA K4T2G264QA RESISTOR 820 OHM

    Untitled

    Abstract: No abstract text available
    Text: RDIMM DDR2 SDRAM DDR2 Registered SDRAM MODULE 240pin Registered Module based on 1Gb A-die 72-bit ECC 68FBGA & 56FBGA with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.


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    PDF 240pin 72-bit 68FBGA 56FBGA

    Untitled

    Abstract: No abstract text available
    Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.6, OCT. 30, 2013 1 MX29GL512F Contents FEATURES. 5


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    PDF MX29GL512F PM1617

    K8P3215UQB

    Abstract: K8P2815 K8p3215 K8P3215U k8p2815u K8P32 48FBGA samsung nor flash Samsung MCP K8P6415
    Text: K8P3215UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,


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    PDF K8P3215UQB 10MAX 48FBGA 48-PIN 1220F 047MAX K8P3215UQB K8P2815 K8p3215 K8P3215U k8p2815u K8P32 samsung nor flash Samsung MCP K8P6415

    k 1358

    Abstract: 56FBGA
    Text: 32 Mbit Burst Mode Concurrent SuperFlash ComboMemory SST34WA32A3 / SST34WA32A4 / SST34WA3283 / SST34WA3284 Advance Information FEATURES: • Flash Organization: – 2M x 16 • PSRAM Organization: – 8 Mbit: 512k X 16 – 16 Mbit: 1M x 16 • Single Voltage Read and Write Operations


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    PDF SST34WA32A3 SST34WA32A4 SST34WA3283 SST34WA3284 SST34WA32x3 SST34WA32x4 MO-225, 56-fbga-MVN-6x8-1 56-Ball S71358-01-000 k 1358 56FBGA

    MX29GL256F

    Abstract: MX29GL256FHT2I-90Q MX29GL256FLT2I-90Q TSOP 62 Package MX29GL256FLT2i
    Text: MX29GL256F MX29GL256F DATASHEET P/N:PM1544 REV. 1.3, JAN. 12, 2012 1 MX29GL256F Contents FEATURES. 5


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    PDF MX29GL256F MX29GL256F PM1544 MX29GL256FHT2I-90Q MX29GL256FLT2I-90Q TSOP 62 Package MX29GL256FLT2i

    Untitled

    Abstract: No abstract text available
    Text: MX29GL128F MX29GL128F DATASHEET P/N:PM1683 REV. 1.4, OCT. 30, 2013 1 MX29GL128F Contents FEATURES. 5


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    PDF MX29GL128F PM1683

    MX29GL512

    Abstract: MX29GL512FHT MX29GL512FUXFI-12G MX29GL512FHXFI-11 MX29GL512FLT2 Q8-Q14
    Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.4, JUL. 31, 2012 1 MX29GL512F Contents FEATURES. 5


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    PDF MX29GL512F MX29GL512F PM1617 MX29GL512 MX29GL512FHT MX29GL512FUXFI-12G MX29GL512FHXFI-11 MX29GL512FLT2 Q8-Q14

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


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    PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    PD78F9224

    Abstract: PD78F0840 PD78F1818 PD78F1201 PD78F0841 PD78F1213 PD780023A PD78F0712 PD78F1036 PD78F1841
    Text: www.renesas.com 2010.11 78Kマイクロコントローラ セレクションガイド ルネサス マイクロコンピュータ ルネサス マイクロコンピュータ 78Kマイクロコントローラ セレクションガイド 2005, 2010. Renesas Electronics Corporation, All rights reserved. Printed in Japan.


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    PDF R01CL0007JJ0200 78K0S 10-SSOP PD78F9502 PD78F9501 78K0/Kx2, 78K0/Fx2, 78K0/Lx3 78K0/Ix2, 78K0/Kx2-L PD78F9224 PD78F0840 PD78F1818 PD78F1201 PD78F0841 PD78F1213 PD780023A PD78F0712 PD78F1036 PD78F1841

    K9F2G08U0B

    Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
    Text: Samsung Semiconductor, Inc. Product Selection Guide Memory and Storage January 2009 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


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    PDF BR-09-ALL-001 K9F2G08U0B K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B

    R8A77343DA00BG

    Abstract: R5F61725 MINI DX3 READER HEAD WIRING DIAGRAM R5F64218 R4F2113 HD6412240FA20V R8A77343DA0FBG R8A77310D333BG R8A77343DA06BG HD6417032F20V
    Text: 2011.06 Renesas Microcomputer General Catalog www.renesas.com CONTENTS Lineup 3 Renesas Development Environment 5 Application Matrix 7 SuperH Family 15 V850 MCUs 59 M32R Family 76 RX Family 78 RL78 Family 96 R8C Family 112 78K MCUs 164 M16C Family 221 H8SX Family


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    PDF R01CS0001EJ0201 R8A77343DA00BG R5F61725 MINI DX3 READER HEAD WIRING DIAGRAM R5F64218 R4F2113 HD6412240FA20V R8A77343DA0FBG R8A77310D333BG R8A77343DA06BG HD6417032F20V

    atc 93lc46

    Abstract: 25LV512 39SF020A 25LV010 49LF040 25LF020A 95p08 89lpc932 nt68f63g 39vf020
    Text: LabTool-48XP Version 5.60 <ALL> Device List Page 1 of 23 ACTRANS AC29LV400B *44PS AC39VF080 *40TS AC29LV400B *48TS AC39VF088 *48TS AC29LV400T *44PS AC39VF800 *48TS AC29LV400T *48TS ALi M6759 M6759 *44 M6759 *44Q M8720 Alliance AS29F040 AS29LV800T *48TS AS29LV400B *48TS


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    PDF LabTool-48XP AC29LV400B AC39VF080 AC39VF088 AC29LV400T AC39VF800 M6759 atc 93lc46 25LV512 39SF020A 25LV010 49LF040 25LF020A 95p08 89lpc932 nt68f63g 39vf020

    Untitled

    Abstract: No abstract text available
    Text: MX29GL256F MX29GL256F DATASHEET P/N:PM1544 REV. 1.5, OCT. 30, 2013 1 MX29GL256F Contents FEATURES. 5


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    PDF MX29GL256F PM1544

    samsung 2GB X16 Nand flash

    Abstract: SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH
    Text: Multi-Chip Package Technology from Samsung The ultimate memory solution for mobile devices MCPs: New Memory Solution for Today’s Handhelds As the popularity of handheld electronic devices continues to expand, the Best Source for MCPs memory solution of choice for designers of these products has become


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    PDF BR-06-MEM-001 samsung 2GB X16 Nand flash SAMSUNG MCp samsung camera module samsung NAND Flash DIE MCP Technology Trend samsung 2GB Nand flash SAMSUNG MCp nand ddr SAMSUNG MCp nand ddr sram 256mb 512MB NOR FLASH

    A25L020AO-F

    Abstract: rtd2122l n25q128a13 cFeon EN25T80 EN25T80 wt61p8 A25L5120-F WT6702F pm25w020 GD25Q40
    Text: Page 1 of 69 Dataman-48XP/48UXP Version 8.10 <ALL> Device List ACTRANS AC25LV010 *8SO AC29LV400B *44PS AC29LV400T *44PS AC39LV010 *32PLCC AC39LV020 *32PLCC AC39LV040 *32PLCC AC39LV080 *40TS AC39LV512 *32PLCC AC39LV800 *48TS SDP-UNIV-16SO SDP-UNIV-44PS SDP-UNIV-44PS


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    PDF Dataman-48XP/48UXP AC25LV010 AC29LV400B AC29LV400T AC39LV010 32PLCC AC39LV020 AC39LV040 A25L020AO-F rtd2122l n25q128a13 cFeon EN25T80 EN25T80 wt61p8 A25L5120-F WT6702F pm25w020 GD25Q40

    Untitled

    Abstract: No abstract text available
    Text: MX29GL512F MX29GL512F DATASHEET P/N:PM1617 REV. 1.7, FEB. 26, 2014 1 MX29GL512F Contents FEATURES. 5


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    PDF MX29GL512F PM1617

    K9F2G08U0C

    Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
    Text: Product Selection Guide Samsung Semiconductor, Inc. Memory & Storage 2H 2010 Samsung Semiconductor, Inc. Samsung offers the industry’s broadest memory portfolio and has maintained its leadership in memory technology for 16 straight years. Its DRAM, flash and SRAM


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    PDF BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0

    K9HDG08U1A

    Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
    Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


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    PDF BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe

    sharp mask rom

    Abstract: No abstract text available
    Text: MEMORIES Combination Memories ★ Under development • SRAM +Flash Memory Stacked TSOP Capacity SK configuration 1M SRAM X 4M FLASH X 8 8 LR-S13011 LR-S1302 1MSRAM X 8M FLASH X 8 8 1MSRAM X 16 8M FLASH vA 1O Block) 2M SRAM 1 1 1 1 1 8M FLASH 1 1 1 BM FLASH


    OCR Scan
    PDF LR-S13011 LR-S1302 LR-S1304 LR-S1303 LR-S1313 LR-S1306 LR-S1305A LR-S1307 56FBGA 72FBGA sharp mask rom