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    441-PIN BGA Search Results

    441-PIN BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    441-PIN BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-441-11-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 441-11-005 21 X 21 # Of Pins Mill-Max Part Number 441 587-10-441-11-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


    Original     		C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A PDF

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


    Original     		1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-441-11-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 441-11-005 21 X 21


    Original     		C17200) 64-56A 64-22A/31A 65-17A PDF

    construction of photo diode

    Abstract: BGA 441 EH11 au 81 441 ball bga flip chip bga 0,8 mm
    Text: Multi Chip Module MCMC SP Chip size package Advanced semiconductor mounting CSP is realized by Hybrid IC technology Realize high accumulation and a low price by fine printed substrate. CSP Features Single / Multi layer printed substates with minimum line width


    Original     		PDF

    BGA 441

    Abstract: SF-BGA441D-B-42
    Text: Patent Pending 27.00mm [1.063"] Top View 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 27.00mm [1.063"] 1.33mm 0.052" 2.45mm [0.097"] Detail A Side View 2 3 Detail A 1 2.95mm [0.116"] 4 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37 gram, Initial insertion force with 0.254mm dia. pin


    Original     		FR4/G10 Alloy172, 254mm 2545mm SF-BGA441D-B-42 BGA 441 PDF

    electrolytic capacitor, 1000 microfarad

    Abstract: JTAG series termination resistors stackup 0.1 microfarad electrolytic capacitor 1500 microfarad capacitor datasheet FG676 UG002 hyperlynx
    Text: R Chapter 4: PCB Design Considerations Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply


    Original     		UG002 electrolytic capacitor, 1000 microfarad JTAG series termination resistors stackup 0.1 microfarad electrolytic capacitor 1500 microfarad capacitor datasheet FG676 UG002 hyperlynx PDF

    wristwatch

    Abstract: 441-pin BGA
    Text: CSP,MCM Modules CSP,MCM Modules AV, OA Information, Mobile communication, Industry/Field: Industrial equipment Breakthrough in High-Density Mounting High-Density Mounting via 20µm Fine Printed substrate • Development goals: Manufacture of high-density modules for


    Original     		100nH 10pF/mm2 3000pF/mm2 wristwatch 441-pin BGA PDF

    BGA-56 DATASHEET

    Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
    Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


    Original     		PDF

    337 BGA

    Abstract: BB 438 dd 127 dd 127 d v19 423 PQFP ALTERA 160 201-37 256-pin BGA 448 B14 aa g15 BB 313
    Text: EPM7512AE Dedicated Pin-Outs ver. 1.0 Dedicated Pin INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 2 TMS (2) TCK (2) TDO (2) GNDINT GNDIO VCCINT VCCIO No Connect (N.C.) Total User I/O Pins (3) Altera Corporation 144-Pin TQFP 208-Pin PQFP (1) 256-Pin BGA


    Original     		EPM7512AE 144-Pin 208-Pin 256-Pin 256-Pin EPM7256A EPM7256E EPM7256S 337 BGA BB 438 dd 127 dd 127 d v19 423 PQFP ALTERA 160 201-37 256-pin BGA 448 B14 aa g15 BB 313 PDF

    MACH3 cpld

    Abstract: MAX7000 actel core 8051 circuit diagram of sound wireless ulc 2003 35x35 bga FLEX10K FLEX6000 FLEX8000 MAX5000
    Text: FPGA/CPLD CONVERSION SERVICE COST ULC SAVINGS AT NO RISK P L U G A N D S AV E COST REDUCTION In today's market, cost reduction is a must to on Verify-Before-Silicon techniques, allows MADE EASY maintain competitiveness. New products us to deliver in-system guaranteed parts. If


    Original     		PDF

    ibis format

    Abstract: hyperlynx Device Reliability report XILINX
    Text: R XPower XPower XPower is the first graphic power-analysis software available for programmable logic design. Earlier than ever in the design flow you can analyze total device power, power per net, routed, or partially routed or unrouted designs. You can also receive graphical or


    Original     		FG256 FG456 FF672 FF896 XC2VP20 ibis format hyperlynx Device Reliability report XILINX PDF

    "sd1v4

    Abstract: Fusion-MPT Message Passing Interface Specification LSI53C1020A LSI53C1000
    Text: TECHNICAL MANUAL LSI53C1020/1020A PCI-X to Ultra320 SCSI Controller February 2004 Version 2.3 DB14-000176-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020/1020A Ultra320 DB14-000176-05 DB14-000176-05, LSI53C1020 LSI53C1020A "sd1v4 Fusion-MPT Message Passing Interface Specification LSI53C1000 PDF

    of 1000 microfarad electrolytic capacitor

    Abstract: JTAG series termination resistors
    Text: R Printed Circuit Board Considerations Layout Considerations The PC board is no longer just a means to hold ICs in place. At today’s high clock rates and fast signal transitions, the PC board performs a vital function in feeding stable supply voltages to the IC and in maintaining signal integrity between devices.


    Original     		UG002 of 1000 microfarad electrolytic capacitor JTAG series termination resistors PDF

    LSI53C1020A

    Abstract: ARM966E-S CRC-32 LSI53C1000R LSI53C1020 PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification
    Text: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2002 Version 2.0 DB14-000176-02 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020 Ultra320 DB14-000176-02 DB14-000176-02, LSI53C1020A ARM966E-S CRC-32 LSI53C1000R PAR64 KY 719 "sd1v4 SD1V Fusion-MPT Message Passing Interface Specification PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    Fast Cycle RAM

    Abstract: EP1C12
    Text: 1. Introduction C51001-1.2 Introduction The CycloneTM field programmable gate array family is based on a 1.5-V, 0.13-µm, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phaselocked loops (PLLs) for clocking and a dedicated double data rate (DDR)


    Original     		C51001-1 33-MHz, 32-bit 144-pin 100-Pin 144-Pin 240-Pin 256-Pin 324-Pin 400-Pin Fast Cycle RAM EP1C12 PDF

    "Fast Cycle RAM"

    Abstract: altera cyclone 3 pins BGA and QFP Package 256 PIN QFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION 256-pin Plastic BGA EP1C12 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface
    Text: 1. Introduction C51001-1.5 Introduction The Cyclone field programmable gate array family is based on a 1.5-V, 0.13- m, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phase-locked loops (PLLs) for clocking and a dedicated double data rate


    Original     		C51001-1 33-MHz, 32-bit 64-bit "Fast Cycle RAM" altera cyclone 3 pins BGA and QFP Package 256 PIN QFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION 256-pin Plastic BGA EP1C12 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface PDF

    LSI53C1020

    Abstract: LSI53C1020A Fusion MPT doorbell Fusion MPT ARM966E-S CRC-32 LSI53C1000R PAR64 Fusion-MPT Message Passing Interface Specification LSI53C1000
    Text: TECHNICAL MANUAL LSI53C1020 PCI-X to Ultra320 SCSI Controller June 2003 Version 2.1 DB14-000176-03 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSI53C1020 Ultra320 DB14-000176-03 DB14-000176-03, Ultra320 IX-11 IX-12 LSI53C1020A Fusion MPT doorbell Fusion MPT ARM966E-S CRC-32 LSI53C1000R PAR64 Fusion-MPT Message Passing Interface Specification LSI53C1000 PDF

    jtag pin

    Abstract: PQFP ALTERA 160 EP1C12
    Text: 1. Introduction C51001-1.4 Introduction The Cyclone field programmable gate array family is based on a 1.5-V, 0.13- m, all-layer copper SRAM process, with densities up to 20,060 logic elements LEs and up to 288 Kbits of RAM. With features like phaselocked loops (PLLs) for clocking and a dedicated double data rate (DDR)


    Original     		C51001-1 33-MHz, 32-bit 64-bit jtag pin PQFP ALTERA 160 EP1C12 PDF

    337 BGA

    Abstract: BB 313 BB 438 BB 444 bga 208 PACKAGE U-328 EPM7256A EPM7256AE EPM7256B EPM7256S
    Text: EPM7512B Dedicated Pin-Outs ver. 1.1 Dedicated Pin 100-Pin TQFP 144-Pin TQFP 169-Pin Ultra FineLine BGA INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI 2 TMS (2) TCK (2) TDO (2) VREFA (3) VREFB (3) GNDINT 87 89 88 90 4 15 62 73 12 60 38, 86 D8 D6 D7


    Original     		EPM7512B 100-Pin 144-Pin 169-Pin 208-Pin 256-Pin 127256B EPM7256B EPM7256A, EPM7256AE, 337 BGA BB 313 BB 438 BB 444 bga 208 PACKAGE U-328 EPM7256A EPM7256AE EPM7256S PDF

    Fusion-MPT Message Passing Interface Specification doorbell

    Abstract: sgpio cpld SFF-8485 LSISAS1064 3.0Gbit SATA controller LSISAS Fusion-MPT Message Passing Interface Specification msi g20 DB14-000274-05 sas bridge
    Text: TECHNICAL MANUAL LSISAS1064 PCI-X to 4-Port Serial Attached SCSI/SATA Controller October 2005 Version 3.2 DB14-000274-05 This document contains proprietary information of LSI Logic Corporation. The information contained herein is not to be used by or disclosed to third parties


    Original     		LSISAS1064 DB14-000274-05 Fusion-MPT Message Passing Interface Specification doorbell sgpio cpld SFF-8485 3.0Gbit SATA controller LSISAS Fusion-MPT Message Passing Interface Specification msi g20 DB14-000274-05 sas bridge PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		26x26 15X15 PDF