HSOP24
Abstract: HSOP-24
Text: SANYO Semiconductor Small Outline Package with Heat Sink 24Pin Plastic HSOP24 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
24Pin
HSOP24
375mil)
ED-7303A)
45max
HSOP24
HSOP-24
|
Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M03 EIAJ code : ∗SOP016-P-0375-1 16-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-16P-M03 16-pin plastic SOP
|
Original
|
PDF
|
FPT-16P-M03
OP016-P-0375-1
50mil
375mil
16-pin
FPT-16P-M03)
00pitch
|
Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M02 EIAJ code : ∗SOP024-P-0375-1 24-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-24P-M02 24-pin plastic SOP
|
Original
|
PDF
|
FPT-24P-M02
OP024-P-0375-1
50mil
375mil
24-pin
FPT-24P-M02)
|
Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M05 EIAJ code : ∗SOP020-P-0375-2 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M05 20-pin plastic SOP
|
Original
|
PDF
|
FPT-20P-M05
OP020-P-0375-2
50mil
375mil
20-pin
FPT-20P-M05)
|
MFP36SLF
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SLF 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
36Pin
MFP36SLF
375mil)
ED-7303A
45MAX
MFP36SLF
|
HSOP28HC
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28HC 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
28Pin
HSOP28HC
375mil)
ED-7303A
HSOP28HC
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
48Pin
HSSOP48
375mil)
ED-7303A
HSSOP48
|
MS-013-AA
Abstract: SOP-16P 16P2V-A
Text: 16P2V-A Plastic 16pin 375mil SOP EIAJ Package Code SOP16-P-375-1.27 JEDEC Code MS-013AA Weight g 0.4 Lead Material Cu Alloy e b2 9 E Recommended Mount Pad 8 1 Symbol F A D A2 A1 b y L e L1 HE e1 I2 16 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
16P2V-A
16pin
375mil
OP16-P-375-1
MS-013AA
MS-013-AA
SOP-16P
16P2V-A
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package 28Pin Plastic MFP28 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
28Pin
MFP28
375mil)
ED-7303A)
35MAX
MFP28
|
codes
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SLF 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
36Pin
MFP36SLF
375mil)
ED-7303A)
45erning
45MAX
MFP36SLF
codes
|
MFP24
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package 24Pin Plastic MFP24 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
24Pin
MFP24
375mil)
ED-7303A)
35max
MFP24
|
MFP30S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SDJ 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
30Pin
MFP30SDJ
375mil)
ED-7303A)
45ming
45max
MFP30SDJ
MFP30S
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
48Pin
HSSOP48R
375mil)
ED-7303A)
HSSOP48R
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SD 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
36Pin
MFP36SD
375mil)
ED-7303A)
45max
MFP36SD
|
|
|
HSOP36
Abstract: HSOP36R
Text: SANYO Semiconductor Small Outline Package with Heat Sink 36Pin Plastic HSOP36R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
36Pin
HSOP36R
375mil)
ED-7303A)
45max
HSOP36R
HSOP36
|
HSOP28H
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28H 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
28Pin
HSOP28H
375mil)
ED-7303A)
45max
HSOP28H
|
MFP30S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30S 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
|
Original
|
PDF
|
30Pin
MFP30S
375mil)
ED-7303A)
35max
MFP30S
|
Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M02 EIAJ code : ∗SOP020-P-0375-1 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M02 20-pin plastic SOP
|
Original
|
PDF
|
FPT-20P-M02
OP020-P-0375-1
50mil
375mil
20-pin
FPT-20P-M02)
|
Untitled
Abstract: No abstract text available
Text: 24P2U-A Plastic 24pin 375mil SSOP EIAJ Package Code SSOP24-P-375-0.80 Weight g 0.4 JEDEC Code – Lead Material Cu Alloy e I2 13 E Recommended Mount Pad F Symbol 12 1 A A2 A1 D e y L L1 HE e1 24 b2 b c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
24P2U-A
24pin
375mil
SSOP24-P-375-0
|
14AD
Abstract: 28P2V SOP28 package SOP28-P-375-1 MS-013-AE
Text: 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight g 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
28P2V-A
28pin
375mil
OP28-P-375-1
MS-013AE
14AD
28P2V
SOP28 package
SOP28-P-375-1
MS-013-AE
|
MFP24D
Abstract: No abstract text available
Text: SANYO Semiconductor Small Outline Package 24Pin Plastic MFP24D 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
|
Original
|
PDF
|
24Pin
MFP24D
375mil)
ED-7303A
45MAX
MFP24D
|
Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SD 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the names
|
Original
|
PDF
|
30Pin
MFP30SD
375mil)
ED-7303A)
MFP30SD
|
JEDEC TRAY DIMENSIONS ssop
Abstract: SOP JEDEC tray
Text: UNIT : mm PPE 7 HEAT PROOF NEC 135°C MAX. 10.3 105.0 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (375mil)(1.7mm thick)
|
Original
|
PDF
|
375mil48p
48-pin
375mil)
375mil48pSSOP
JEDEC TRAY DIMENSIONS ssop
SOP JEDEC tray
|
MS-013AC
Abstract: SOP20 Package SOP20-P-375-1 20P2V-A
Text: 20P2V-A Plastic 20pin 375mil SOP EIAJ Package Code SOP20-P-375-1.27 JEDEC Code MS-013AC Weight g 0.48 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 10 Symbol F A D A2 A1 b y L e L1 HE e1 I2 20 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters
|
Original
|
PDF
|
20P2V-A
20pin
375mil
OP20-P-375-1
MS-013AC
MS-013AC
SOP20 Package
SOP20-P-375-1
20P2V-A
|
