TSSOP30
Abstract: No abstract text available
Text: SANYO Semiconductor Thin Shrink Small Outline Package 30Pin Plastic TSSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
TSSOP30
275mil)
ED-7303A)
TSSOP30
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30P4
Abstract: DIP30-P-600-2
Text: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5
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30pin
600mil
DIP30-P-600-2
30P4
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DIP30SD
Abstract: DIP-30SD
Text: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SD 400mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。
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30Pin
DIP30SD
400mil)
ED-7303A
DIP30SD
DIP-30SD
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TA8776N
Abstract: philips sub woofer circuit diagram circuit diagram "dolby digital stereo" sub woofer circuit i2c bass volume balance hall
Text: TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8776N SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled I2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package. FEATURES
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TA8776N
TA8776N
30pin
000707EBA2
philips sub woofer circuit diagram
circuit diagram "dolby digital stereo"
sub woofer circuit
i2c bass volume balance hall
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traffic light controller
Abstract: BM1040R0A TLCS-870 TMP86CH12MG
Text: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86CH12MG 8-bit microcontroller in small-sized package suitable for inverter-type lights and IH appliances TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 V
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TLCS-870
TLCS-870/C
30pin
TMP86CH12MG
10-bit
16-bit
traffic light controller
BM1040R0A
TMP86CH12MG
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Untitled
Abstract: No abstract text available
Text: 30S1B Metal seal 30pin 400mil DIP EIAJ Package Code WDIP30-C-400-1.78 Weight g JEDEC Code – 1 15 e1 16 E 30 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 4.75 – – 0.72 3.53 – –
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30S1B
30pin
400mil
WDIP30-C-400-1
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Zigzag In-line Package 30Pin Plastic SIP30Z Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations ED-7303A , which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
SIP30Z
ED-7303A)
16MAX
95MIN
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Untitled
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SDLF 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
DIP30SDLF
400mil)
ED-7303A)
DIP30SDLF
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MFP30S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SDJ 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
MFP30SDJ
375mil)
ED-7303A)
45ming
45max
MFP30SDJ
MFP30S
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SSOP30
Abstract: SSOP30 package
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic SSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
SSOP30
275mil)
ED-7303A)
SSOP30
SSOP30 package
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MFP30S
Abstract: No abstract text available
Text: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30S 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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30Pin
MFP30S
375mil)
ED-7303A)
35max
MFP30S
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TA8776N
Abstract: circuit diagram "dolby digital stereo" philips sub woofer circuit diagram dual sub woofer circuit diagram circuit diagram "dolby digital" bass treble control circuit for woofer sorround sound processor ic dolby bass circuit 3d surround sound circuits i2c bass volume balance hall
Text: TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8776N SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled I2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package. FEATURES
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TA8776N
TA8776N
30pin
000707EBA2
circuit diagram "dolby digital stereo"
philips sub woofer circuit diagram
dual sub woofer circuit diagram
circuit diagram "dolby digital"
bass treble control circuit for woofer
sorround sound processor ic
dolby bass circuit
3d surround sound circuits
i2c bass volume balance hall
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Untitled
Abstract: No abstract text available
Text: QB-144-CA-01's pin header cover for 78K0/KB2 30pin MC package CP1 CP2 CP3 CP4 GND N.C. N.C. 20 19 18 N.C. N.C. N.C. N.C. 17 16 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 15 N.C. N.C. 14 13 N.C. 12 N.C. 11 10 9 8 7 N.C. N.C. GND GND 78K0/KB2 30pinMC
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QB-144-CA-01
78K0/KB2
30pin
78K0/KB2
30pinMC
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Untitled
Abstract: No abstract text available
Text: 30P4B Plastic 30pin 400mil SDIP JEDEC Code – Weight g 2.2 Lead Material Alloy 42 16 1 15 E 30 e1 c EIAJ Package Code SDIP30-P-400-1.78 D L A1 A A2 Symbol b1 SEATING PLANE b e A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08 0.51
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30P4B
30pin
400mil
SDIP30-P-400-1
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TLCS-870
Abstract: TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C808NG TMP86P808DMG TMP86P808NG
Text: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86F808DMG/NG 8-bit microcontroller with flash memory and two serial interfaces in small-sized package TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 Ｖ
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TLCS-870
TLCS-870/C
30pin
TMP86F808DMG/NG
16-bit
TMP86C408DMG
TMP86C408NG
TMP86C808DMG
TMP86C8083
TMP86C408DMG
TMP86C408NG
TMP86C808DMG
TMP86C808NG
TMP86P808DMG
TMP86P808NG
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Untitled
Abstract: No abstract text available
Text: September 2006 TLCS-870 Family TLCS-870/C Series 30pin TMP86FH92DMG 8-bit microcontroller incorporating Flash memory, power-on reset circuit and voltage detecting circuit in 30-pin SSOP TLCS-870/C CPU Core •Operating voltage 4.0 to 5.5 V, 2.7 to 5.5 V ·Minimum instruction execution time
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TLCS-870
TLCS-870/C
30pin
TMP86FH92DMG
30-pin
10-bit
16-bit
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HM511000
Abstract: hb56g19b-7
Text: HB56G19A/B Series Maintenance only 1,048,576-word x 9-bit High Density Dynamic RAM Module The HB56G19 is a 1M × 9 dynamic RAM module, mounted two 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 1 Mbit DRAM (HM511000 AJP/ALJP) sealed in SOJ package. An outline of the HB56G19 is 30pin single in-line package. Therefore, the
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HB56G19A/B
576-word
HB56G19
HM514400BS/BLS)
HM511000
30pin
HB56G19A-7B/7BL
hb56g19b-7
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Untitled
Abstract: No abstract text available
Text: QB-144-CA-01's pin header cover for PD78F073x 30pin MC package CP1 GND N.C. N.C. N.C. N.C. N.C. N.C. 14 13 12 11 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 22 21 20 19 18 17 16 15 23 N.C. N.C. 10 9 N.C. N.C. GND GND μPD78F073x 30MC CP2
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QB-144-CA-01
PD78F073x
30pin
PD78F073x
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Untitled
Abstract: No abstract text available
Text: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.
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TA8776N
TA8776N
30pin
SDIP30-P-400-1
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e50p
Abstract: DCE37PT
Text: D-subm iniature M etal Shell W ire W rap Basic D Series • Reliable wire wrap termination. • Two contact lengths: .375" or .585". • .025” square contact tails. Cinch Materials • Contact Material: Copper alloy machined . • Contact Plating: Gold flash or 30pin. gold. All over nickel.
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30pin.
30gin.
DE-9P-F179
DE-9P-F179-30
DEE-9P-F179
DEE-9P-F179-30
DEY-9P-F179
DEY-9P-F179-30
DA-15P
e50p
DCE37PT
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toshiba ctv circuit diagram
Abstract: dolby bass circuit TA8776N philips sub woofer circuit diagram surround processor 254TYP sorround sound processor ic Ic surround 1996090 super treble diagram
Text: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.
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TA8776N
TA8776N
30pin
20Max
SDIP30-P-400-1
toshiba ctv circuit diagram
dolby bass circuit
philips sub woofer circuit diagram
surround processor
254TYP
sorround sound processor ic
Ic surround
1996090
super treble diagram
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dip switch ece
Abstract: cs359
Text: I 3*427555 DD4T150 AIT • NECE N E C -DATA S H E E T . . BIPOLAR ANALOG INTEGRATED CIRCUIT ; E E C T R O N D E V IC E *’»> .» 4, . - »V -, it / / P C I 8 2 0 ' ; * ._t7 .7 ,.^ ?' COLOR TV/VTR PLL IF SIGNAL PROCESSING 1C The /¿PC1820 is a semiconductor integrated circuit for processing the color T V / V T R P IF / S IF signals. T his 1C is housed in a 30pin shrink dual-in-line package (D IP . Its main features are supported by the built-in keyed-pulse generator circuit needed for
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DD4T150
uPC1820
30pin
/zPC1820
30-pin
S30C-70-400B
dip switch ece
cs359
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Untitled
Abstract: No abstract text available
Text: D-subminiature Metal Shell Vertical Dip Solder PCS D*U Series Cinch • .024" contact diameter. • Longer rear insulator provides integral standoff from PCB. Materials • Contact Material: Plug - Brass machined . Socket - Copper alloy (machined). • Contact Plating: Gold flash or 30pin. gold. All over nickel.
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30pin.
DEU-9PBF-30
DEUE-9PBF-30
DEUY-9PBF-30
DAU-15PBF
DAU-15PBF-30
DAUE-15PBF
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC T A ft 7 7 fi M • m m » a ■v SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.
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TA8776N
f77fM
TA8776N
30pin
10//F
SDIP30-P-400-1
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