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    324 BGA THERMAL Search Results

    324 BGA THERMAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    PQU650M-F-COVER Murata Manufacturing Co Ltd PQU650M Series - 3x5 Fan Cover Kit, RoHs Medical Visit Murata Manufacturing Co Ltd
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    324 BGA THERMAL Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    gp026 st

    Abstract: TA 7217 AP GP012 pin diagram of ic 7414 GP021 gp1131 gp018 block diagram for EIO SLOT for Data Storage AF 238 IC 7413
    Text: SLC90E46 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E46 SouthBridge Member of High Performance TeXas Chipset FEATURES • • • • • • • • • 324 Pin BGA South Bridge Chip Supports Pentium Compatible Processor With SLC90E42 North Bridge Chip


    OCR Scan     		SLC90E46 SLC90E46 SLC90E42 DMA/33" 33Mbytes/Second gp026 st TA 7217 AP GP012 pin diagram of ic 7414 GP021 gp1131 gp018 block diagram for EIO SLOT for Data Storage AF 238 IC 7413 PDF

    bcm 7413

    Abstract: OH182 slc90e4
    Text: SLC90E46 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E46 SouthBridge Member of High Performance TeXas Chipset FEATURES • • • • • • • • • 324 Pin BGA South Bridge Chip Supports Pentium Compatible Processor With SLC90E42 North Bridge Chip


    OCR Scan     		SLC90E46 SLC90E46 SLC90E42 DMA/33" 33Mbytes/Second LC90E46 bcm 7413 OH182 slc90e4 PDF

    SMBD1

    Abstract: No abstract text available
    Text: SLC90E46 ADVANCE INFORMATION STANDARD MICROSYSTEMS CORPORATION SLC90E46 SouthBridge Member of High Performance TeXas Chipset FEATURES • • • • • • • • • 324 Pin BGA South Bridge Chip Supports Pentium Com patible Processor With SLC90E42 North Bridge Chip


    OCR Scan     		SLC90E46 SLC90E46 SLC90E42 DMA/33â 13/Default 13/Description 28/Bit 31/Description SMBD1 PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: C5200 C52006-1 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20
    Text: 15. Package Information for Cyclone Devices C52006-1.2 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 15–1


    Original     		C52006-1 EP1C12 EP1C20 BGA 256 PACKAGE thermal resistance C5200 EP1C12 TQFP 144 PACKAGE altera 324 bga thermal altera cross reference BGA EP1C20 PDF

    BGA 256 PACKAGE thermal resistance

    Abstract: bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance C52006-1 EP1C12 BGA400 EP1C6 C5200
    Text: 15. Package Information for Cyclone Devices C52006-1.3 Introduction This data sheet provides package information for Altera devices. It includes the following sections: • ■ ■ “Device and Package Cross Reference” on page 15–1 “Thermal Resistance” on page 15–2


    Original     		C52006-1 EP1C20 BGA 256 PACKAGE thermal resistance bga 208 PACKAGE ep1c6-144 324 bga thermal BGA PACKAGE thermal resistance EP1C12 BGA400 EP1C6 C5200 PDF

    altera cyclone 3

    Abstract: C52006-1 EP1C12 table 15
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications. This section includes the following chapter:


    Original     		EP1C12 EP1C20 altera cyclone 3 C52006-1 EP1C12 table 15 PDF

    altera cyclone 3

    Abstract: C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6
    Text: Section VII. Cyclone Device Package Information This section provides information for board layout designers to successfully layout their boards for Cyclone devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.


    Original     		EP1C20 altera cyclone 3 C5200 C52006-1 EP1C12 BGA256 altera cross reference EP1C6 PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    STANAG 3838

    Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601 PDF

    bu61740b

    Abstract: BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal
    Text: Micro-ACE , Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 bu61740b BU-61860B BU-BU-64863B DDC total ace 1553 chip pcb footprint BU-61740B 64K RAM BU-64863B 3E02 61840B 324 bga thermal PDF

    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3 PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 PDF

    BGA 23X23

    Abstract: 324PBGA 324 PBGA 23x23 22X22 23X23 PBGA 23X23 Solder Balls
    Text: 324 PBGA / TEPBGA Wire Bond Daisy Chain Test Board and Package Traces: Looking Through Package and at Test Board Perimeter Balls 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 A B C D E Common F G H J K L M N P Thermal Balls R T U V W Y AA AB Slide 1


    Original     		22x22 23x23 Defined24 BGA 23X23 324PBGA 324 PBGA 23x23 PBGA 23X23 Solder Balls PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    BGA324B

    Abstract: SF-BGA324B-B-11
    Text: D C Package Code: BGA324B 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA324B FR4/G10 SF-BGA324B-B-11 BGA324B PDF

    SF-BGA324F-B-11

    Abstract: land pattern BGA 0,50
    Text: D Package Code: BGA324F C 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] 0.025" dia . pad X 24.13mm [0.950"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 3 Side View (reference only)


    Original     		BGA324F FR4/G10 20X20 SF-BGA324F-B-11 land pattern BGA 0,50 PDF

    Micro-ACE-TE

    Abstract: No abstract text available
    Text: Micro-ACE , Micro-ACE-TE, and PCI Micro-ACE-TE Product Brief Models: BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 DDC's Micro-ACE series of MIL-STD-1553 terminals with 1553 protocol, memory, and either +3.3V or +5V transceiver, in a small plastic BGA. This series is ideal for use in mixed voltage applications where PC board space is limited.


    Original     		BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 MIL-STD-1553 MIL-STD-1760 128-ball 324-ball AS9100 Micro-ACE-TE PDF

    SF-BGA324D-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA324D C 25.5mm [1.004"] 1.5mm [0.059"] See BGA pattern code to the right for actual pattern layout Y 1.5mm typ. [0.059"] X 25.5mm [1.004"] Top View reference only 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] B 1 Ø 0.64mm pad [Ø 0.025"]


    Original     		BGA324D 18X18 SF-BGA324D-B-11 PDF

    SF-BGA324E-B-11

    Abstract: No abstract text available
    Text: D C Package Code: BGA324E 24.13mm [0.950"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.76mm [0.030"] X 24.13mm [0.950"] Top View reference only 1.27mm [0.050"] 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]


    Original     		BGA324E FR4/G10 SF-BGA324E324 SF-BGA324E-B-11 PDF