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    30A06 Search Results

    30A06 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MSP430A066IPNR Texas Instruments 16-Bit Ultra-Low-Power Microcontroller, 32kB Flash, 1024B RAM, 12-Bit ADC, USART, 160 Segment LCD 80-LQFP -40 to 85 Visit Texas Instruments
    MSP430A064IPM Texas Instruments 16-Bit Ultra-Low-Power Microcontroller, 48 kB Flash, 2KB RAM, 12 bit ADC, 2 USARTs, HW multiplier 64-LQFP -40 to 85 Visit Texas Instruments Buy
    MSP430A065IRBHR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, 10 bit ADC, 1 USART 32-VQFN -40 to 85 Visit Texas Instruments Buy
    MSP430A061IDAR Texas Instruments 16-bit Ultra-Low-Power Microcontroller, 1KB Flash, 512B RAM 38-TSSOP -40 to 85 Visit Texas Instruments Buy
    MSP430A062IPZR Texas Instruments 16-Bit Ultra-Low-Power MCU, 48kB Flash, 2048B RAM, 12-Bit ADC, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85 Visit Texas Instruments
    SF Impression Pixel

    30A06 Price and Stock

    TDK Epcos B59721A0130A062

    SENSOR PTC 680OHM 50% 0805
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    DigiKey B59721A0130A062 Cut Tape 7,960 1
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    Newark B59721A0130A062 Cut Tape 4,000
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    Bristol Electronics B59721A0130A062 48,000
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    KORATECH 006N0030A06440606N

    6N 30MM 0.5P 4/4/6/6) P6
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    DigiKey 006N0030A06440606N Bulk 6,280 10
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    KORATECH 055N0030A06440505N

    55N 30MM 0.5P 4/4/5/5) P6
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    DigiKey 055N0030A06440505N Bulk 3,300 10
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    KORATECH 020N0030A06330404N

    20N 30MM 0.5P 3/3/4/4) P6
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    DigiKey 020N0030A06330404N Ammo Pack 2,986 10
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    KORATECH 034N0030A06330404N

    34N 30MM 0.5P 3/3/4/4) P6
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    DigiKey 034N0030A06330404N Bulk 2,365 10
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    Find more 30A06 price and stock on Findchips.com

    30A06 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit


    Original     		PDF FCH30 FCH30A 30A06 O-220AB FCH30A06 FCH30A06

    FCH30A06

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit


    Original     		PDF FCH30A06 FCH30 O-220AB Temperat180° FCH30A06

    dual common cathode

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit


    Original     		PDF FCH30 FCH30A 30A06 O-220AB FCH30A06 FCH30A06 dual common cathode

    FCH30A06

    Abstract: No abstract text available
    Text: SBD T y p e : FCH30 FCH30A 30A06 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol 30A06 Unit


    Original     		PDF FCH30A06 FCH30 O-220AB FCH30A06

    30021

    Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
    Text: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and


    Original     		PDF ORSO42G5 ORSO82G5 ORSO82G5 ORSO42G5-1BMN484I ORSO82G5-2FN680I 30021 L48C L41C IC L44C DATASHEET L30C l31c L43C ORT42G5

    310CB

    Abstract: transistor 30945 30945 30A27 k3264 TN1073 30A07 30A45
    Text: ORSPI4 Provisioning September 2004 Technical Note TN1073 Introduction The ORSPI4 is a next generation FPSC targeted at high speed data transmission, built on the Series 4 reconfigurable embedded System-on-Chip SoC architecture. The ORSPI4 device has been designed to support a broad


    Original     		PDF TN1073 310CB transistor 30945 30945 30A27 k3264 TN1073 30A07 30A45

    AL437

    Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		PDF 8b/10b OIF-SPI4-02 ORSPI4-1FE1036IES ORSPI4-F1156IES ORSPI4-2FE1036CES ORSPI4-1FE1036CES ORSPI4-2F1156CES ORSPI4-1F1156CES AL437 L97c L235C L103T L41C L140C L94C l165c L239C L43C

    L130C

    Abstract: L74c l31c l97c l65c A311TC l146c l48c L202C L235C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC May 2009 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		PDF 8b/10b OIF-SPI4-02 1156-fpBGA 1036-ball 6A-07 1036fpSBGA 1036-ftSBGA) 06x-09 1036-pin 1036-pin L130C L74c l31c l97c l65c A311TC l146c l48c L202C L235C

    WB4500

    Abstract: telecom bus WB1500 OC48 ORSO82G5 ORT8850 RD1018 STS-48C 30A06 8850H
    Text: Telecom Bus Bridge for SONET Cross Connect March 2004 Reference Design RD1018 Introduction The Telecom Bus Interface TBI is an accepted industry standard that is commonly found in SONET/SDH systems. It is a parallel interface used for chip-to-chip communication on SONET line cards. A typical example illustrating the usefulness of the TBI is shown in Figure 1.


    Original     		PDF RD1018 OC-12 WB1500 ORSO82G5 ORT8850 622Mbps 2488Mbps WB1501 WB4500 telecom bus WB1500 OC48 ORSO82G5 ORT8850 RD1018 STS-48C 30A06 8850H

    L62C

    Abstract: 30021 3080e equivalent L41C Transistor BC 177 Datasheet 3080e l48c verilog code BIP-8 L71C l31c
    Text: ORCA ORSO42G5 and ORSO82G5 0.6 to 2.7 Gbps SONET Backplane Interface FPSCs July 2008 Data Sheet DS1028 Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and


    Original     		PDF ORSO42G5 ORSO82G5 DS1028 ORSO82G5 L62C 30021 3080e equivalent L41C Transistor BC 177 Datasheet 3080e l48c verilog code BIP-8 L71C l31c

    3080e equivalent

    Abstract: No abstract text available
    Text: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane


    Original     		PDF ORSO82G5 ORSO82G5 ORSO82G5-3BM680C ORSO82G5-2BM680C ORSO82G5-1BM680C ORSO82G5-2BM680I ORSO82G5-1BM680I 3080e equivalent

    Untitled

    Abstract: No abstract text available
    Text: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs January 2004 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s. This device is targeted toward users needing high-speed


    Original     		PDF ORSO82G5 ORSO82G5 ORSO82G5-3BM680C ORSO82G5-2BM680C ORSO82G5-1BM680C ORSO82G5-2BM680I ORSO82G5-1BM680I

    L47C

    Abstract: L146C L135 l54c L62C L97C verilog code of prbs pattern generator L71C L235C L43C
    Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC February 2005 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two


    Original     		PDF 8b/10b OIF-SPI4-02 ORSPI4-2FE1036I ORSPI4-1FE1036I ORSPI4-2F1156I ORSPI4-1F1156I L47C L146C L135 l54c L62C L97C verilog code of prbs pattern generator L71C L235C L43C

    Untitled

    Abstract: No abstract text available
    Text: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane


    Original     		PDF ORSO82G5 ORSO82G5 aORSO82G5 ORSO82G5-3BM680C ORSO82G5-2BM680I ORSO82G5-1BM680I

    DMC CRIMP TOOL CHART

    Abstract: DMC CRIMP TOOL calibration CHART M39029/1-101 M39029/22-192 M39012/30-0503 crimping positioners cross reference DMC HX4 crimp tool M39029/22-192 crimp tool MS27493-22D M39029/11-144
    Text: Tooling Guide CD pages 2/11/03 2:56 PM Page 1 Connector Tooling Guide DANIELS MANUFACTURING CORPORATION an ISO9001 Registered Company Tooling Guide CD pages 2/11/03 2:56 PM Page 2 ® DANIELS MANUFACTURING CORPORATION PREFACE & TABLE OF CONTENTS Daniels tools have been utilized in military


    Original     		PDF ISO9001 PL93-637 MIL-STD-1646 DMC CRIMP TOOL CHART DMC CRIMP TOOL calibration CHART M39029/1-101 M39029/22-192 M39012/30-0503 crimping positioners cross reference DMC HX4 crimp tool M39029/22-192 crimp tool MS27493-22D M39029/11-144

    Dense-Pac Microsystems

    Abstract: No abstract text available
    Text: COPIA D P Z 128W 16A 3 Dense-Pac Microsystems. Inc. q 128K X 16 FLASH EEPROM DENSE-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D PZ128W 16A3 "DEN SE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF DPZ128W16 DPZ128W16A3 DPZ128W16A3 125-C 120ns 150ns 170ns 200ns 250ns 30A067-0Ã Dense-Pac Microsystems

    ueju

    Abstract: No abstract text available
    Text: V V, i -5 l i £7 DPZ256W16A3 SD PM ; Dense-Pac Microsystems, Inc ^ 2S6K X 16 FLASH EEPROM DENSE-STACK M ODULE PRELIMINARY DESCRIPTION: The DPZ256W16A3 “ DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF DPZ256W16A3 DPZ256W16A3 120ns 150ns 170ns 200ns 250ns 30A067-02 ueju

    Untitled

    Abstract: No abstract text available
    Text: A fS í *' î c DPMÍ D P Z 1 M W 1 6 A 3 a^nseHPac^Microsyítems, Inc. 0 _1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY D E SC R IP T IO N : The DPZ1MW16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF DPZ1MW16A3 DPZ1MW16A3 200ns 250ns 30A067-00

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS128X16BH3 Dense-Pac Microsystems. Inc. ^ 128K X 16 CMOS SRAM J-LEADED STACKS ADVANCED INFORMATION DESCRIPTION: The DPS128X16BH3 "S T A C K " m odule is a r e v o lu tio n a ry n e w h ig h sp e e d m e m o ry subsystem using D ense-Pac M icro syste m s'


    OCR Scan     		PDF DPS128X16BH3 DPS128X16BH3 500mV 30A065-20

    Untitled

    Abstract: No abstract text available
    Text: I 1 3 1993 APR C d p DPZ512X16A3 m 512K X 16 FLASH EEPRO M DENSE-STACK M O D U LE PRELIM INARY DESCRIPTION: The D PZ512X 16A 3 "DCN SE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable leadless Chip C arriers S L C C mounted on a co-fired ceram ic


    OCR Scan     		PDF DPZ512X16A3 PZ512X DPZ512X16A3 density25 120ns 150ns 170ns 200ns 250ns 125-C

    Untitled

    Abstract: No abstract text available
    Text: D P S512S 16U □PM Dense-Pac M icrosystem s. Inc. 512K X 16 CM OS SRAM MODULE O PRELIMINARY D E S C R IP T IO N : T he D P S 5 1 2 S 1 6 U is a 5 12 K X 16 high-density, low-power static R A M m odule com prised of eight 128K X 8 m onolithic SR A M 's, an advanced high-speed


    OCR Scan     		PDF S512S DPS512S16U 100ns 150ns 30A063-00

    Untitled

    Abstract: No abstract text available
    Text: f ip ii# , U f * m DPS256X32WS Dense-Pac Microsystems, Inc. 0 256K x 32 CMQS SRAM w/ Separate 1/0 MODULE D E S C R IP T IO N : P IN -O U T D IA C R A M The D P S2 5 6 X 3 2 W S is a 256K X 32 with separate Input/Output, high density, high-speed Static Random Access M em ory SR AM module, intended for high


    OCR Scan     		PDF DPS256X32WS

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DRAM Dense-Pac Microsystems. Inc. ^ DPD16MX8PH4 PRELIMINARY DESCRIPTION: The DPD16MX8PH4 DRAM module is a revo lu tio n ary m em ory system using Dense-Pac M icrosystem s' new 2nd G eneration Stacking Technology. The module combines eight stackable ceramic


    OCR Scan     		PDF DPD16MX8PH4 DPD16MX8PH4 100ns PHET17 100ns

    Untitled

    Abstract: No abstract text available
    Text: o tt a s 1991 —— DPZ1 MX! 6A3 □ P M o 1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE ADVANCED INFORMATION DESCRIPTION: The D PZ1M X 16A 3 "D EN SE-STA CK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip


    OCR Scan     		PDF X16A3 120ns 150ns 170ns 200ns 250ns 125-C 30A067-00