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    DO-204AP

    Abstract: No abstract text available
    Text: CG2/DG2 VISHAY Vishay Semiconductors Standard Sinterglass Diode \ Features • Specially designed for clamping circuits, horizontal deflection systems and damper applications • High temperature metallurgically bonded construction • Cavity-free glass passivated junction


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    PDF DO-204AP D-74025 28-Jan-03 DO-204AP

    Untitled

    Abstract: No abstract text available
    Text: CG1 / DG1 VISHAY Vishay Semiconductors Standard Sinterglass Diode Features • Specially designed for clamping circuits, horizontal deflection systems and damper applications • High temperature metallurgically bonded construction • Cavity-free glass passivated junction


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    PDF DO-204AP D-74025 28-Jan-03

    IP20

    Abstract: IP67 Y-CONRJ45
    Text: Y-ConRJ45 Crimping Instruction – IP67 Seite 1 2 3 4 5 6 IP67 7 8 9 Y-ConTool-30 10 11 Step 1 Step 2 13 Step 4 Yamaichi Electronics Deutschland GmbH 14 12 Step 3 15 28-Jan-03 Y-ConRJ45 Crimping instructions – IP20 Seite 1 2 3 4 5 6 IP20 8 7 9 Y-ConTool-30


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    PDF Y-ConRJ45 Y-ConTool-30 28-Jan-03 IP20 IP67

    DO-204AP

    Abstract: G2G G1 diode gg2a
    Text: G2A to G2M VISHAY Vishay Semiconductors Standard Sinterglass Diode \ Features • High temperature metallurgically bonded constructed rectifiers • Cavity-free glass passivated junction • Hermetically sealed package • 2.0 ampere operation at Tamb=75 °C with no thermal runaway


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    PDF DO-204AP MIL-STD-750, D-74025 28-Jan-03 DO-204AP G2G G1 diode gg2a

    fe6d

    Abstract: FE6D G-4
    Text: FE6A to FE6D VISHAY Vishay Semiconductors Ultra Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability


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    PDF MIL-STD-750, D-74025 28-Jan-03 fe6d FE6D G-4

    DIODE RG4A

    Abstract: rg4a diode
    Text: RG4A to RG4J VISHAY Vishay Semiconductors Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • Fast switching for high efficiency • 3.0 ampere operation at Tamb = 50 °C with no thermal runaway


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    PDF MIL-STD-750, D-74025 28-Jan-03 DIODE RG4A rg4a diode

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN AUSSCHNITT 53.34±0.13 [2.100±.005] 26.16 [1.030] 0.38±0.10 [.015±.004] 60.19±0.20 [2.370±.012] TOP OF PCB LP 59.17 [2.330] 3 x 13.97 [.550] = 41.91 [1.650] 1 8 1 8 1 8 1 1 8 1 8 1 8 1 8 3.50±0.30 [.138±.012]


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    DO-204AP

    Abstract: fe2c
    Text: FE2A to FE2D VISHAY Vishay Semiconductors Ultra Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability


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    PDF DO-204AP MIL-STD-750, D-74025 28-Jan-03 DO-204AP fe2c

    rg1g diode

    Abstract: No abstract text available
    Text: RG1A to RG1M VISHAY Vishay Semiconductors Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Hermetically sealed package • Cavity-free glass passivated junction • 1.0 ampere operation at Tamb = 55 °C with no thermal runaway


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    PDF DO-204AP DO-204AP 18-Jul-08 rg1g diode

    FE3A

    Abstract: fe3d
    Text: FE3A to FE3D VISHAY Vishay Semiconductors Ultra Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability


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    PDF MIL-STD-750, D-74025 28-Jan-03 FE3A fe3d

    Untitled

    Abstract: No abstract text available
    Text: RECOMMENDED PANEL CUTOUT EMPFOHLENER FRONTPLATTEN AUSSCHNITT 81.28±0.13 [3.200±.005] 26.16 [1.030] 0.38±0.10 [.015±.004] 88.01±0.20 [3.465±.008] TOP OF PCB LP 87.13 [3.430] 3 x 13.97 [.550] = 69.85 [2.750] 1 8 1 8 1 8 1 8 1 8 1 1 8 1 8 1 8 1 8 1 8


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    PDF 28JAN03

    DO-204AP

    Abstract: No abstract text available
    Text: CG1 / DG1 VISHAY Vishay Semiconductors Standard Sinterglass Diode Features • Specially designed for clamping circuits, horizontal deflection systems and damper applications • High temperature metallurgically bonded construction • Cavity-free glass passivated junction


    Original
    PDF DO-204AP 08-Apr-05

    DO-204AP

    Abstract: No abstract text available
    Text: RG1A to RG1M VISHAY Vishay Semiconductors Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Hermetically sealed package • Cavity-free glass passivated junction • 1.0 ampere operation at Tamb = 55 °C with no thermal runaway


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    PDF DO-204AP 08-Apr-05 DO-204AP

    MLP33-5

    Abstract: No abstract text available
    Text: Package Information Vishay Siliconix MLP33−5 PowerPAKr D2 L Q H 8 1 Z e 1 E2 3 4 Q 5 b 4 E1 E 2 2 L1 Q A Q A1 c DETAIL Z 2 D1 D NOTES: 1. Inch will govern 2. Dimensions D1 and E1 do not include mold gate burrs. MILLIMETERS Dim A A1 b c D D1 D2 E E1 E2 e


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    PDF MLP33-5 S-03182--Rev. 03-Feb-03 28-Jan-03

    SIL6020

    Abstract: transformer step down 230 V 50 Hz 9 V HICAL sil6020 step down transformer 230 v to 12 v topswitch-gx EP-34 "general semiconductor diode" vogt 408 15 EPR-34 of transformer step down 230 V 50 Hz 9 V
    Text: Engineering Prototype Report for EP-34 – Single Output 30 W AC-DC Power Supply Using TOP245Y TOPSwitch-GX Title Specification Universal Input, 12 V at 30 W Output Application Generic Author Power Integrations Applications Department Document Number


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    PDF EP-34 OP245Y CISPR22B EPR-34 21-Apr-03 17F-3, SIL6020 transformer step down 230 V 50 Hz 9 V HICAL sil6020 step down transformer 230 v to 12 v topswitch-gx EP-34 "general semiconductor diode" vogt 408 15 of transformer step down 230 V 50 Hz 9 V

    GI1004

    Abstract: DO-204AP GI1001 GI1002 GI1003
    Text: GI1001 to GI1004 VISHAY Vishay Semiconductors Ultra Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Glass passivated cavity-free junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability


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    PDF GI1001 GI1004 DO-204AP MIL-STD-750, GI1001 GI1002 GI1003 GI1004 DO-204AP GI1002 GI1003

    DO-204AP

    Abstract: rg1g diode RG1A RG1G
    Text: RG1A to RG1M VISHAY Vishay Semiconductors Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Hermetically sealed package • Cavity-free glass passivated junction • 1.0 ampere operation at Tamb = 55 °C with no thermal runaway


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    PDF DO-204AP D-74025 28-Jan-03 DO-204AP rg1g diode RG1A RG1G

    Sinterglass

    Abstract: DO-204AP DO204AP Package g1g diode DO204AP
    Text: G1A to G1M VISHAY Vishay Semiconductors Standard Sinterglass Diode \ Features • High temperature metallurgically bonded constructed rectifiers • Cavity-free glass passivated junction in DO204AP package • Hermetically sealed package • 1.0 ampere operation at Tamb = 100 °C with no


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    PDF DO204AP DO-204AP MIL-STD-750, DO-20ges D-74025 28-Jan-03 Sinterglass DO-204AP DO204AP Package g1g diode

    DIODE RG3j

    Abstract: RG3D RG3M DIODE RG3D
    Text: RG3A to RG3M VISHAY Vishay Semiconductors Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Hermetically sealed package • Cavity-free glass passivated junction • 3.0 ampere operation at Tamb = 55 °C with no thermal runaway


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    PDF D-74025 28-Jan-03 DIODE RG3j RG3D RG3M DIODE RG3D

    Untitled

    Abstract: No abstract text available
    Text: FE5A to FE5D VISHAY Vishay Semiconductors Ultra Fast Sinterglass Diode \ Features • High temperature metallurgically bonded construction • Cavity-free glass passivated junction • Superfast recovery time for high efficiency • Low forward voltage, high current capability


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    PDF MIL-STD-750, D-74025 28-Jan-03

    SB5H100

    Abstract: SB5H90
    Text: SB5H90 and SB5H100 Vishay Semiconductors New Product formerly General Semiconductor High Voltage Schottky Rectifier Reverse Voltage 90 to 100V Forward Current 5.0A DO-201AD Features • Plastic package has Underwriters Laboratory Flammability Classification 94V-0


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    PDF SB5H90 SB5H100 DO-201AD DO-201AD MIL-STD-750, 28-Jan-03 SB5H100

    Untitled

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC G ALL RIGHTS RESERVED. DIST R E V IS IO N S 50 LTR DESCRIPTION DATE REV PER 0G 61- 0 0 1 6 - 0 3 DWN 28JAN03 APVD JR MS D D +.005 .2 7 5 - H D IA . *+.015


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    PDF 28JAN03 L-2147 31MAR2000 20APR01

    Untitled

    Abstract: No abstract text available
    Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. _ i_ ALL RIGHTS RESERVED. LOC DIST AF 50 REVISIONS LTR B DESCRIPTION REVISED PER OG6 3 - 0 0 0 5 - 0 3 DATE OWN APVD 28JAN03 JR GJ 1. SPECIFICATIO NS MAGNET WIRE #18 - #34 AWG,


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    PDF 28JAN03 11JAN2002 31MAR2000

    Untitled

    Abstract: No abstract text available
    Text: T H 1S D R A W 1NG T 1S C O R Y R 1G HT U N P U B L 1S H E D . RELEASED 19 BY AMP INCORPORATED. FOR ALL ,19 P U B L 1C A T ION RIGHTS LOC RESERVED. DY Dl ST REV I S IONS LTR DE SC R I P T I O N REVISED -DATE DATE 28JAN03 F P 0 0 -00I 1-03 CODE I . 6 0 ±0 . 08


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    PDF 28JAN03 09MAY94