LTA260W3-L03
Abstract: I12L20004 SAMSUNG lcd INVERTER LTM260W3-L03 lj97 GH199A LJ97-00942A
Text: HR I12L20004 INVERTER ORIGINAL REFER. EQUIVAL. GH199A LJ97-00942A Dimensiones / size : 286mm x 95mm 1 24V 2 24V 3 24V Conector Control / Control Connector CN1 4 5 6 7 8 9 10 11 12 13 24V 24V GND GND GND GND GND P.det. on-off Br.A LCD panel manuf. LCD Panel cod.
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I12L20004
GH199A
LJ97-00942A
286mm
LTA260W3-L03
LTM260W3-L03
LTA260W3-L03
I12L20004
SAMSUNG lcd INVERTER
LTM260W3-L03
lj97
GH199A
LJ97-00942A
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Untitled
Abstract: No abstract text available
Text: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations
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W72M64V-XBX
16MByte
128Mb)
2Mx64
150ns
x64/x72
W72M64V-XBX
MIF2033
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W3E2M64S-XSBX
Abstract: No abstract text available
Text: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E2M64S-XSBX is a member if WEDC’s high density/high preformance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features
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W3E32M64S-XSBX*
W3E2M64S-XSBX
125mm2
500mm2
286mm2
W3E32M6GS-XSBX
MIF2045
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TSOP 66 Package
Abstract: W3E32M64S-XSBX
Text: 32M x 64 DDR SDRAM Optimum Density and Performance in One Package W3E32M64S-XSBX* The W3E32M64S-XSBX is a member of WEDC’s high density/high performance family of Double Data Rate DDR SDRAM’s designed to support high performance processors. Product Features
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W3E32M64S-XSBX*
W3E32M64S-XSBX
MIF2045
TSOP 66 Package
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212590
Abstract: LZ64 2065-51
Text: Issued July 1994 A17856 Data logging/acquisition General The RS range of dataloggers consists of several instruments with widely varying specifications, a l l o w i n g customers to select the appropriate model for their application. The number of channels available ranges from one to a
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A17856
212590
LZ64
2065-51
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Untitled
Abstract: No abstract text available
Text: 8M x 32 32MB Flash Optimum Density and Performance in One Package W78M32V-XBX* Features The W78M32V-XBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).
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W78M32V-XBX*
W78M32V-XBX
32MByte
256Mb)
120ns
x64/x72
W78M32V-XBX
W82M32V-XBX
MIF20
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WD400BB
Abstract: 2025h CCTV System WD400EB ST340016A WD400EB-00CPFO ST380021A WD400BB-00BSAO maxtor hard disk wd40
Text: September 2004 HTL-One Digital Video Recorder The Honeywell HTL-One, represents an integrated digital recorder solution for single camera CCTV system applications. HTL-One provides a low cost upgrade from outdated VCR technology to the latest digital technology, providing a drop-in replacement
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250GB.
168hr
338hr
203hr
253hr
405hr
675hr
304hr
608hr
380hr
WD400BB
2025h
CCTV System
WD400EB
ST340016A
WD400EB-00CPFO
ST380021A
WD400BB-00BSAO
maxtor hard disk
wd40
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Untitled
Abstract: No abstract text available
Text: 8M x 64 64MB Flash Optimum Density and Performance in One Package W78M64V-XSBX* Features The W78M64V-XSBX is member of WEDC’s high density/high performance family of Flash MCPs. Designed to complement high performance processors and memory controllers. (See page 2 for typical block diagram).
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W78M64V-XSBX*
W78M64V-XSBX
64MByte
512Mb)
120ns
Bank50%
414mm2
286mm2
W82M64V-XSBX
MIF2044
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Sn63pB37 tds
Abstract: W3E32M64S-XSBX TSOP66
Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES DDR SDRAM rate = 200, 250, 266, 333* Package: BENEFITS • 208 Plastic Ball Grid Array PBGA , 13 x 22mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CK and CK#)
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W3E32M64S-XSBX
32Mx64
Sn63pB37 tds
W3E32M64S-XSBX
TSOP66
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Untitled
Abstract: No abstract text available
Text: TECHNICAL ARTICLE | Join | Tweet Connect Maximizing Performance and Integration in Applications Requiring Isolated SPI by Mark Cantrell and Bikiran Goswami, Analog Devices, Inc. Real-World SPI Implementation SPI is a very useful and flexible standard, but its flexibility stems from its
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TA13071-0-3/15
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Untitled
Abstract: No abstract text available
Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply
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W3E32M64S-XSBX
32Mx64
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Untitled
Abstract: No abstract text available
Text: W3E32M64S-XB3X 256 – 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count
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W3E32M64S-XB3X
32Mx64
cycle55Â
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rd60 battery charger
Abstract: S4 65 E134962 CB801 CB100-12S CB325-12 yellow crimps a14s R38-S5 R150-L10
Text: 압착단자 Solderless Terminals 소 개 Introduction 압착단자 개관 이 카탈로그에는 한국몰렉스에서 생산하는 광범위한 압착단자들 을 수록했습니다. 한국몰렉스는 R타입, Y타입과 같은 규격 압착단자 뿐 아니라
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1-800-78MOLEX
KOR-005/Rev
Korea/2K/KY/KY/2002
rd60 battery charger
S4 65
E134962
CB801
CB100-12S
CB325-12
yellow crimps
a14s
R38-S5
R150-L10
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W332M64V-XSBX ADVANCED* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing
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W332M64V-XSBX
32Mx64
125MHz
256MByte
728-bit
W332M64V-ESSB
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W332M64V-XSBX PRELIMINARY* 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing
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W332M64V-XSBX
32Mx64
125MHz
256MByte
728-bit
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LZ64
Abstract: psion SF10 pcxa 20VA 40VA SF12 30 pin laptop screen connector to vga port PT-100 temperature transducer SPCX
Text: Data Pack A Data Sheet General The RS range of dataloggers consists of several instruments with widely varying specifications, allowing customers to select the appropriate model for their application. The number of channels available ranges from one to a top of the range model with 8 analogue and 5 digital
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LZ64
Abstract: psion convert ega to vga 213-234 30 pin laptop screen connector to vga port 20VA 40VA SF10 SF12 sf12 "pin compatible"
Text: Data Pack A Data Sheet General The RS range of dataloggers consists of several instruments with widely varying specifications, allowing customers to select the appropriate model for their application. The number of channels available ranges from one to a top of the range model with 8 analogue and 5 digital
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telemecanique catalogue 1995
Abstract: GUE7082W GU6412 GUE7062W GU3050 GU3420DWSSMP
Text: Schneider Electric wiring devices, lighting & air movement LifeSpace product catalogue Electrical solutions Smart home An innovative range of affordable home automation systems. From Sphere programmable lighting control system, LexCom Performance networking
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SE7257
telemecanique catalogue 1995
GUE7082W
GU6412
GUE7062W
GU3050
GU3420DWSSMP
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Untitled
Abstract: No abstract text available
Text: W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz The 256MByte 2Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing 536,870,912 bits. Each chip is internally configured as a quad-bank DRAM with
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W332M64V-XSBX
32Mx64
133MHz
W332M64V-XSBX
256MByte
133MHz
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VCCQ15
Abstract: No abstract text available
Text: W3E32M64S-XSBX 32Mx64 DDR SDRAM Advanced* FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266 Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CK and CK)
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W3E32M64S-XSBX
32Mx64
200MHz
250MHz
266MHz
VCCQ15
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BGA PACKAGE thermal resistance
Abstract: W332M64V-XSBX PDQ22
Text: White Electronic Designs W332M64V-XSBX 32Mx64 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: • 208 Plastic Ball Grid Array PBGA , 13 x 22mm The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 4 chips containing
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W332M64V-XSBX
32Mx64
133MHz
256MByte
728-bit
133MHz
BGA PACKAGE thermal resistance
W332M64V-XSBX
PDQ22
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Untitled
Abstract: No abstract text available
Text: Datasheet | Switches X900-48 Enhanced Fast Ethernet Layer 3+ Switch x900-48FE 48 x 10/100BASE-T copper ports 4 x 1000BASE-X SFP uplinks x900-48FS 48 x 100BASE-X SFP ports Fiber only 4 x 1000BASE-X SFP uplinks Industry-leading Features The x900-48 offers performance, flexibility,
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X900-48
x900-48FE
10/100BASE-T
1000BASE-X
x900-48FS
100BASE-X
x900-48
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3E32M64S-XSBX PRELIMINARY* 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% SPACE SAVINGS vs. TSOP Package: • 43% Space Savings vs FPBGA • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count
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W3E32M64S-XSBX
32Mx64
333Mbs/166MHz
PCN04019
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3E32M64S-XSBX 32Mx64 DDR SDRAM FEATURES BENEFITS DDR SDRAM rate = 200, 250, 266, 333* 73% Space Savings vs. FPBGA Package: • 43% Space Savings vs TSOP • 208 Plastic Ball Grid Array PBGA , 13 x 22mm Reduced part count 2.5V ±0.2V core power supply
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W3E32M64S-XSBX
32Mx64
PCN04019
333Mbs
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