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    27514 Price and Stock

    Harwin S2751-46R

    PC TEST POINT NATURAL
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    DigiKey S2751-46R Cut Tape 68,076 1
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    S2751-46R Digi-Reel 68,076 1
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    S2751-46R Reel 65,000 2,500
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    Mouser Electronics S2751-46R 31,714
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    Newark S2751-46R Cut Tape 2,425 1
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    Bristol Electronics S2751-46R 3,913
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    TTI S2751-46R Reel 2,500
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    Powell Electronics S2751-46R 22 1
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    Avnet Abacus S2751-46R 135,000 13 Weeks 2,500
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    Wurth Elektronik 74479275147

    FIXED IND 470NH 2.6A 47 MOHM SMD
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    DigiKey 74479275147 Cut Tape 2,396 1
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    74479275147 Digi-Reel 2,396 1
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    Mouser Electronics 74479275147 2,172
    • 1 $1.27
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    Wurth Elektronik 74275143

    FERRITE BEAD 961 OHM RADIAL 1LN
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    DigiKey 74275143 Tray 557 1
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    Mouser Electronics 74275143 737
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    Newark 74275143 Bulk 18 1
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    PEI Genesis MS27514-16B

    PT 07 16 HEX NUT CAD OD NI
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    DigiKey MS27514-16B Bulk 154 1
    • 1 $6.83
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    PEI Genesis MS27514-16A

    PT 07 16 HEX NUT CAD NI
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    DigiKey MS27514-16A Bulk 32 1
    • 1 $4.76
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    27514 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    27514000001 Wickmann USA Fuses, Circuit Protection, FUSE PICO FAST 4A 125V AXIAL Original PDF

    27514 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    101490

    Abstract: 33797 B57875S0212F000 B57875S0212H000 k 3569 81 718990 3567 EPCOS
    Text: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57875 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.


    Original     		PDF B57875 101490 33797 B57875S0212F000 B57875S0212H000 k 3569 81 718990 3567 EPCOS

    101490

    Abstract: 40409 Transistor 20417 33797 40409 73006 B57885S0103 001 Epcos 2908 EPCOS 800 376 B57885S0212
    Text: NTC thermistors for temperature measurement Leaded NTCs, lead spacing 5 mm Series/Type: Date: B57885 March 2006 EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.


    Original     		PDF B57885 101490 40409 Transistor 20417 33797 40409 73006 B57885S0103 001 Epcos 2908 EPCOS 800 376 B57885S0212

    merlin gerin NS100N

    Abstract: merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338
    Text: Catalogue 2004 Merlin Gerin Miniature circuit-breakers and earth leakage circuit-breakers MCBs/ELCBs contents page Miniature circuit-breakers RCCB / ELCB Technical information Mini pragma din kit Merlin Gerin C60a 2 C60N 3 C60H 4 C60N UL489 - DC circuit breaker


    Original     		PDF C120N C120H NC100L NC100LH NC100 UL489 SEIMC60C04 merlin gerin NS100N merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338

    mj 13002

    Abstract: transistor 40409 101490 40409 Transistor 62552 42003 75282 40409 NTC Thermistor 301 B57885S0103 001
    Text: NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 5 mm Series/Type: B57885S Date: February 2009 EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.


    Original     		PDF B57885S mj 13002 transistor 40409 101490 40409 Transistor 62552 42003 75282 40409 NTC Thermistor 301 B57885S0103 001

    82305

    Abstract: CMOS 4066 B3560 BAR63 BBY39 PIC16C56 HP MASTER SELECTION GUIDE RF 89552 dsp lsb modulation demodulation HP 4066 15k
    Text: Gran-Jansen AS GJRF USER GUIDE 2nd issue User tips Applications Preliminary test reports GRAN-JANSEN AS Slemdalsveien 70 * PO Box 187 Vinderen * 0319 Oslo * Norway Tel: +47 22 49 48 01 * Fax :+47 22 49 59 03 granjan@sn.no * http//www.sn.no/granjansen GJRF USER GUIDE


    Original     		PDF

    IEC-1169-1

    Abstract: connector N for RG 213 coaxial cable 133NE RG 393 cable sm 141 cable crimp tools suhner 32NPC EF142 RG-213 cable QN-50-7-1
    Text: SERIES QN, COAXIAL CONNECTORS DESCRIPTION CONTENT HUBER+SUHNER QN coaxial connectors are available with 50 8 impedance. The frequency range extends to 11 GHz, depending on the connector and cable type, however most of the QN connectors are Return Loss optimised for frequencies up to 6 GHz. The interface is based on the inner dimensions of the N connector, but, instead of a threaded coupling mechanism,


    Original     		PDF N-PC7-50-6/1-- PC7-N-50-6/1-- PC7-QN-50-1/1-- IEC-1169-1 connector N for RG 213 coaxial cable 133NE RG 393 cable sm 141 cable crimp tools suhner 32NPC EF142 RG-213 cable QN-50-7-1

    256kx8 sram 5v

    Abstract: 50-PIN
    Text: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS DPS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS128X16Cn3/DPSl 28X16Bn3 DPS128X16Cn3/DPS128X16Bn3 50-pin -40-C 125-C 30A097-32 256kx8 sram 5v

    DPS128C32BV3

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic


    OCR Scan     		PDF DPS128C32BV3 DPS128C32BV3 500mV 00012flb 30A044-28

    bma 023

    Abstract: DPZ128X32IV3
    Text: DENSE-PAC MICROSYSTEMS 4 M E G A B IT FLASH E EP R O M DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8X 3 2 IV 3 "V E R S A - S T A C K " module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers


    OCR Scan     		PDF DPZ128X32IV3 DPZ128X32IV3 120ns 150ns 170ns 200ns 250ns 30a072-10 275T415 bma 023

    050I

    Abstract: No abstract text available
    Text: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight


    OCR Scan     		PDF DPZ256X16ln3 50-pin DPZ256X16ln3 120ns 150ns 170ns 200ns 250ns 30A071-12 050I

    KA3213

    Abstract: KA32 KS5112 30A10 3A29
    Text: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for


    OCR Scan     		PDF DPD2MX16M2H3 DPD2MX16M2 32-Megabits DPD2MX16M2H3 100ns 40-PIN 30A106-1S 275T415 0QQ137Ã KA3213 KA32 KS5112 30A10 3A29

    lem HA

    Abstract: 50-PIN dps128m8bny
    Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .


    OCR Scan     		PDF DPS128M8CnY/BnY, DPS128X8CA3/BA3 128M8CnY/BnY, 28X8CA3/BA3 50-pin California92841-1428 OA097-31 lem HA dps128m8bny

    OL80m

    Abstract: DPS128X32BV3 DPS128X32CV3
    Text: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC


    OCR Scan     		PDF DPS128X32CV3/DPS128X32BV3 DPS128X32CV3/DPS128X32EV3 DPS128X32CV3/DPS128X32BV3 DPS128X32CV3 California92841-1428 30A044-24 275T415 OL80m DPS128X32BV3

    DPS512S8AP

    Abstract: 165001
    Text: DENSE PAC 4 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS512S8AP DESC RIPTIO N: The DPS512S8AP is a high speed 5 1 2K x 8 high-density, lo w -p o w e r static RAM m odule comprised of four high speed ceramic 128K x 8 monolithic SRAM's, an advanced high-speed CMOS


    OCR Scan     		PDF DPS512S8AP DPS512S8AP 600-mil-wide, 32-pin 00017aa 165001

    Untitled

    Abstract: No abstract text available
    Text: 16 14 15 13 12 11 10 8 SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. GD (4 9 . 1 ) M MISSING SYMBOLS TOTAL NO OF INSPECTIONS REQUIRED NO T E S 1.


    OCR Scan     		PDF 14SE05 M2292002

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "STACK" modules are a revolutionarynew memory subsystem using Dense-PacMicrosystems'ceramicStackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded


    OCR Scan     		PDF DPS256X16n3 DPS256X16n3SRAM 50-pin DPS256X16n3 California92841-1428 3OA097-04

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 12 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X24MFn3 ADVANCED INFORMATION DESCRIPTION : The DPS512X24MFn3 High Speed SRAM "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS512X24MFn3 DPS512X24MFn3 12-Megabits 500mV California92841-1428 30A154-03

    4kx16 sram

    Abstract: No abstract text available
    Text: DENSE-PAC m C R O S Y S T E M S D7E D | 275^415 DGDGIDD 1 | 4KX4 BASED Dense-Pac 7^ Microsystems, Inc. DESCRIPTION: CMOS SRAM FAMILY - DIPS DPS88H04 - 7 V i/ * - P 3 - / Z- The 4KX4 Based Family is part of a new line of high speed static RAM modules developed by Dense-Pac Microsys­


    OCR Scan     		PDF DPS88H04 DPS84H08 DPS88H04 DPS88H08 DPS88H16 4KX16 DPS88H08 DPS88H16-35M DPS88H16-55M DPS4X16-25C 4kx16 sram

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 9 Megabit CMOS SRAM DPS256X36L PRELIM INARY DESCRIPTION: The DPS256X36L is a 256K X 36 high-density, low-power static RAM module comprised of eight 256K X 4 and four 256K x 1 monolithic SRAM's and decoupling capacitors surface mounted on a FR-4


    OCR Scan     		PDF DPS256X36L DPS256X36L 512Kx 256Kx36 500mV 30A112-00

    54HC30

    Abstract: M38bl 1M38510
    Text: REVISIONS LTR DATE VR-MO-M DESCRIPTION Inactivate case outline 01AX for new design. Add vendor CAGE 27014 to case outline 01DX. Editorial changes throughout APPROVED 88 APR. 7 Device type 01, case outline 2 inactive for new design as of 11 Sept 87 Device type 01, case outline C


    OCR Scan     		PDF M38510/65004BCX M38510/6 5004B2X. 54HC30 M38bl 1M38510

    Untitled

    Abstract: No abstract text available
    Text: 16 14 15 13 12 11 10 8 SYMBOL DEFINITION A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL DOES NOT REQUIRE INSPECTION. IT MAY BE CONTROLLED ON THE INDIVIDUAL COMPONENT DRAWING. ( 6X 24 ) M — 6X 1.2 ±0,1 TYP TOTAL NO OF INSPECTIONS REQUI RED LU <> 0. 3


    OCR Scan     		PDF 31MY05 07AP05 29N005 21N005 25AU05

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 8 Megabit CM OS SRAM DPS256S32AW MICROSYSTEMS ADVANCED INFORMATION DESCRIPTION: The D P S 2 5 6 S 3 2 A W is a 2 5 6 K x 32 high-density, static RAM module comprised of eight 1 2 8 K x 8 m o nolithicSRA M 's,an advanced high-speed CM O S decoder,


    OCR Scan     		PDF DPS256S32AW DPS256S32AWisa256Kx 128Kx DPS256S32AWoperatesfrom 256Kx California92841-1428 30A093-10

    CERAMIC FLATPACK

    Abstract: cerdip 28- brazed ceramic
    Text: SENSE-PAC HICROSYSTEMS C Î3 P M BSE I • 275^15 ODD037M S H D P C DPS128M8 Dense-Pac Microsystems, Inc. ^ CERAMIC 128K X 8 CM OS SRAM MONOLITHIC T -4 C -2 1 -J4 DESCRIPTION: The DPS128M8 is a monolithic 128K X 8 Static Random Access Memory SRAM fabricated using


    OCR Scan     		PDF DPS128M8 A0-A16 I/00-I/07 44-21-H DPS128M8 600-mil 32-pin 30A037-00 CERAMIC FLATPACK cerdip 28- brazed ceramic

    DPV12832V

    Abstract: 4-00J1 Dense-Pac Microsystems
    Text: DENSE-PAC MICR OSY STEMS 2ÔE D • £75=1415 OOQQIBb ? «] >PC DPV12832V Dense-Pac Microsystems, Inc. ^ 128K X 32 UVEPROM VERSAPAC X 4 ¿ ,- / 3 '2 9 DESCRIPTION: The DPV12832V is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in


    OCR Scan     		PDF DPV12832V DPV12832V 66-pin 200ns 250ns 512KX8, 256KX16 128KX32 30A014-32 4-00J1 Dense-Pac Microsystems