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    256-PIN BGA DRAWING Search Results

    256-PIN BGA DRAWING Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet
    CS-DSDMDB50MF-025 Amphenol Cables on Demand Amphenol CS-DSDMDB50MF-025 50-Pin (DB50) Deluxe D-Sub Cable - Copper Shielded - Male / Female 25ft Datasheet

    256-PIN BGA DRAWING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    AREG D10

    Abstract: 1010 817 K14
    Text: PCI1251A GFN/GJG PC CARD CONTROLLER SCPS038 – AUGUST 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    Original     		PDF PCI1251A SCPS038 256-Pin Card16 TPS2206 AREG D10 1010 817 K14

    PCI1251B

    Abstract: No abstract text available
    Text: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    Original     		PDF PCI1251B SCPS043A 256-Pin Card16 TPS2206 SLLA067 SSYA008 SLLA075 TMS320VC5409/5421 SPRA679

    AREG D10

    Abstract: SCHEMATIC graphics card PCI1251A TPS2206 b12 7d diode
    Text: PCI1251A GFN/GJG PC CARD CONTROLLER SCPS038 – AUGUST 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    Original     		PDF PCI1251A SCPS038 256-Pin Card16 TPS2206 AREG D10 SCHEMATIC graphics card b12 7d diode

    GP 809 DIODE

    Abstract: Intel 8237 dma PCI1251B TPS2206 82365SL diode gp 805 U1 LM386
    Text: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    Original     		PDF PCI1251B SCPS043A 256-Pin Card16 TPS2206 GP 809 DIODE Intel 8237 dma 82365SL diode gp 805 U1 LM386

    1010 817 K14

    Abstract: No abstract text available
    Text: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    Original     		PDF PCI1251B SCPS043A 256-Pin Card16 TPS2206 scps043a SLLA067 TMS320VC5409/5421 SPRA679 1010 817 K14

    C4228

    Abstract: No abstract text available
    Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.


    Original     		PDF 26X26X5 C4228 PC-BGA/QFP-SX32A-S-01

    QFP Package 80 lead

    Abstract: C4002 256-QFP 256QFP
    Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.


    Original     		PDF 26X26X5 C4002 PC-BGA/QFP-SX72A-S-01 QFP Package 80 lead 256-QFP 256QFP

    st LD33

    Abstract: ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC
    Text: NM6403 Digital Signal Processor 431282.001D3 Features General Description 40 MIPS, 25 ns Instruction Rate. CMOS 0,5µm Technology. 256-pin BGA Package. Low Voltage Supply, 3.0V to 3.6V. Memory Address Space - 16 Gbytes. Scalar and Vector Data Format: 32-bit Scalar Data,


    Original     		PDF NM6403 001D3 256-pin 32-bit 64-bit 64-bits NM6403 st LD33 ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC

    ATM-18

    Abstract: ATM-5 DG 7-119 ATM machine using microprocessor 0x760 GSM modem M10 icp multiplexer 24 pin SINGLE POINT load cell C3 CLASS CX28225 CX28229
    Text: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-B January 2003 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C


    Original     		PDF CX28224/5/9 28229-DSH-001-B CX28224 256-pin, CX28225 CX28229 CX28224/5/9 ATM-18 ATM-5 DG 7-119 ATM machine using microprocessor 0x760 GSM modem M10 icp multiplexer 24 pin SINGLE POINT load cell C3 CLASS CX28225 CX28229

    ATM-18

    Abstract: CX28229-14 CX28225-14 DG 7-119 GSM modem M10 CX28224-14 CX28225 CX28229 512K16
    Text: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-D March 2004 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C


    Original     		PDF CX28224/5/9 28229-DSH-001-D CX28224 CX28224-14 256-pin, CX28225 CX28225-14 CX28229 CX28229-14 ATM-18 CX28229-14 CX28225-14 DG 7-119 GSM modem M10 CX28224-14 CX28225 CX28229 512K16

    ATM-18

    Abstract: IMA16 CX28224-14 CX28229-14 CX28225 CX28225-14 CX28229
    Text: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-C August 2003 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 ° C to 85 ° C


    Original     		PDF CX28224/5/9 28229-DSH-001-C CX28224 CX28224-14 256-pin, CX28225 CX28225-14 CX28229 CX28229-14 ATM-18 IMA16 CX28224-14 CX28229-14 CX28225 CX28225-14 CX28229

    AD27

    Abstract: AD29 AD30 PCI1250A TPS2206 XCPS014
    Text: PCI1250A PC CARD CONTROLLER XCPS014 – DECEMBER 1997 D D D D D D D D D D D D D D D D Peripheral Component Interconnect PCI Power Management Compliant ACPI 1.0 Compliant Packaged in 256-Pin BGA PCI Local Bus Specification Revision 2.1 Compliant 1995 PC Card Standard Compliant


    Original     		PDF PCI1250A XCPS014 256-Pin Card16 TPS2206 AD27 AD29 AD30 PCI1250A XCPS014

    AD23-AD16

    Abstract: PCI1250A AD27 AD29 AD30 TPS2206 XCPS014 pci1250
    Text: PCI1250A PC CARD CONTROLLER XCPS014 – DECEMBER 1997 D D D D D D D D D D D D D D D D Peripheral Component Interconnect PCI Power Management Compliant ACPI 1.0 Compliant Packaged in 256-Pin BGA PCI Local Bus Specification Revision 2.1 Compliant 1995 PC Card Standard Compliant


    Original     		PDF PCI1250A XCPS014 256-Pin Card16 TPS2206 AD23-AD16 PCI1250A AD27 AD29 AD30 XCPS014 pci1250

    of BGA Staggered pins

    Abstract: of BGA Staggered Pins package C10943X
    Text: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up


    Original     		PDF S272S2-C6-1 S416S2-H6 S480S2-K6-1 S580S2-K6 S672S2-K6-1 C10943X) of BGA Staggered pins of BGA Staggered Pins package C10943X

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF 49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA

    FBGA-484

    Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
    Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly


    Original     		PDF FBGA484 SI-SX32-ACQ256SFG484 SI-SX72-ACQ256SFG484) SI-SX72-ACQ256SFG484 CQ256 FG484 SI-SX72ACQ256SFG484) FBGA-484 A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    bet GP 119 diode

    Abstract: ir p 813h bet 82a BA-06 d31ad
    Text: PCI1251AGFN/GJG PC CARD CONTROLLER S C P S 038-A U G U S T 1998 * • • • PCI Power Management 1.0 Compliant ACP11.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant


    OCR Scan     		PDF PCI1251AGFN/GJG ACP11 256-Pin TPS2206 bet GP 119 diode ir p 813h bet 82a BA-06 d31ad

    CAD15-CAD8

    Abstract: No abstract text available
    Text: PCI1250A PC CARD CONTROLLER XCPS014 -D E C E M B E R 1997 * Peripheral Component Interconnect PCI Power Management Compliant • Supports Zoom Video With Internal Buffering • ACP11.0 Compliant • Programmable Output Select for CLKRUN • Packaged in 256-Pin BGA


    OCR Scan     		PDF PCI1250A XCPS014 256-Pin 82365SL-DF 16-Bit on1997 S-PBGA-N256) 4040185/A CAD15-CAD8

    Untitled

    Abstract: No abstract text available
    Text: TMS320C6711 FLOATING-POINT DIGITAL SIGNAL PROCESSOR S P R S 088A - FEB R U A R Y 1999 - R EVISED MARCH 1999 GFN 256-PIN BALL GRID ARRAY BGA PACKAGE (BOTTOM VIEW) Y W V U T R P N M L K J H G F E D C VelociTI Advanced Very Long Instruction Word (VLIW) ’C6700 CPU Core


    OCR Scan     		PDF TMS320C6711 150-MHz 32-Bit C6211 C6700