P1394
Abstract: 787949-1
Text: 107-68299 Packaging Specification 23Jul09 Rev G PLUG KIT,UNASSEMBLED,IEEE P1394 1. PURPOSE 目的 Define the packaging specifiction and packaging method of PLUG KIT,UNASSEMBLED,IEEE P1394. 订定 PLUG KIT,UNASSEMBLED,IEEE P1394 产品之包装规格及包装方式。
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23Jul09
P1394
P1394.
38x25
330x135x10
335X138X145
102x51
P1394
787949-1
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WBCR02750000F
Abstract: bcr resistor bcr efi ElectroFilm
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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11-Mar-11
WBCR02750000F
bcr resistor
bcr efi
ElectroFilm
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Untitled
Abstract: No abstract text available
Text: VBPW34S, VBPW34SR Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: surface mount • Package form: GW, RGW VBPW34S • Dimensions L x W x H in mm : 6.4 x 3.9 x 1.2 • Radiant sensitive area (in mm2): 7.5 • High photo sensitivity
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VBPW34S,
VBPW34SR
VBPW34S
J-STD-020
2002/95/EC
2002/96/EC
VBPW34S
VBPW34SR
18-Jul-08
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TLHB510
Abstract: TLHB5100 TLHB5102
Text: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.
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TLHB510.
2002/95/EC
2002/96/EC
18-Jul-08
TLHB510
TLHB5100
TLHB5102
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TB2272
Abstract: No abstract text available
Text: 23-Jul-09 HM73-106R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Iron Powder 2 ADHESIVE Epoxy 3 WIRE Air Coil 4 BODY Ink 5 SOLDER Lead Free Solder CAS No Material Mass mg Composition (mg) 7439-89-6 - 855 846.45
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23-Jul-09
HM73-106R0LF
471-34-ect
7440-50-8ad
TB2272
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Untitled
Abstract: No abstract text available
Text: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.
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TLHB510.
2002/95/EC
2002/96/EC
2011/65/EU
2002/95/EC.
2011/65/EU.
12-Mar-12
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PET WHITE SUPPORT TAPE: PET (BLUE) CONTACT MATERIAL: COPPER CONTACT PLATING: TIN QUALITY CLASS: 20 MATING CYCLES MIN. PITCH: 1.00 MM A ENVIRONMENTAL OPERATING TEMPERATURE: -30°C UP TO 85°C
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E328849
27-FEB-12
02-SEP-11
28-SEP-10
27-OCT-09
23-JUL-09
03-FEB-09
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switch 4606
Abstract: Honeywell v3
Text: 4 FO-55111-C 2 3 HONEYWELL PART NUMBER 1 .375 MAX FREE POSITION 22AC1-D8 PUSH TO OPERATE-RETURNS AUTOMATICALLY TO POSITION SHOWN PULL TO OPERATE-REMAINS IN OPERATED POSITION UNTIL RESET FOR AUTOMATIC RETURN BY NEXT FULL STROKE "PUSH" OPERATION PRODUCT CODE
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FO-55111-C
22AC1-D8
KC-Q0015
23JUL09
V3-13-D8
PR-4606
23JUL09
5M-1982
22AC1-D8
switch 4606
Honeywell v3
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VEMD2020
Abstract: VEMD2020X01 VVC901 VEMD2000X01 J-STD-020D VSMB2000X01 21554
Text: VEMD2000X01, VEMD2020X01 Vishay Semiconductors Silicon PIN Photodiode FEATURES • • • • • • 21568-1 VEMD2020X01 VEMD2000X01 • • • • • • DESCRIPTION VEMD2000X01 and VEMD2020X01 are high speed and high sensitive PIN photodiodes in a miniature surface mount
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VEMD2000X01,
VEMD2020X01
VEMD2000X01
VEMD2000X01
VEMD2020X01
AEC-Q101
18-Jul-08
VEMD2020
VVC901
J-STD-020D
VSMB2000X01
21554
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HTB2-102-281
Abstract: EE25 bobbin TNY278PN yw-360-02b EKMX401ELL220ML20S MOSFET 818 ln TNY278 DER-228 ee25 ferrite core TNY277
Text: Design Example Report Title 15 W Power Supply with <30 mW No-load Input Power Using TinySwitch-III TNY278P Specification 85 VAC – 265 VAC Input; 12 V, 1.25 A Output Application TinySwitch-III Reference Design Author Applications Engineering Department
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TNY278P)
DER-228
HTB2-102-281
EE25 bobbin
TNY278PN
yw-360-02b
EKMX401ELL220ML20S
MOSFET 818 ln
TNY278
DER-228
ee25 ferrite core
TNY277
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Untitled
Abstract: No abstract text available
Text: VJ.W1BC X7R Dielectric Vishay Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications FEATURES • • • • • • • • • Stable class 2 dielectric Four standard sizes High capacitance per unit volume Supplied in tape on reel
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18-Jul-08
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smd diode GW
Abstract: VBPW34FASR
Text: VBPW34FAS, VBPW34FASR Vishay Semiconductors Silicon PIN Photodiode FEATURES VBPW34FAS • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 6.4 x 3.9 x 1.2 Radiant sensitive area (in mm2): 7.5 High radiant sensitivity
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VBPW34FAS,
VBPW34FASR
VBPW34FAS
J-STD-020
2002/95/EC
2002/96/EC
18-Jul-08
smd diode GW
VBPW34FASR
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SPC5567MZP132
Abstract: PBGA-B416
Text: SPC5567MZP132 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information
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SPC5567MZP132
S9U55670
23-Jul-09
PBGA-B416
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Untitled
Abstract: No abstract text available
Text: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PET WHITE SUPPORT TAPE: PET (BLUE) CONTACT MATERIAL: COPPER CONTACT PLATING: TIN QUALITY CLASS: 20 MATING CYCLES MIN. PITCH: 1.00 MM A ENVIRONMENTAL OPERATING TEMPERATURE: -30°C UP TO 85°C
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E328849
27-FEB-12
28-SEP-10
27-OCT-09
23-JUL-09
03-FEB-09
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Untitled
Abstract: No abstract text available
Text: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.
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TLHB510.
2002/95/EC
2002/96/EC
11-Mar-11
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AT91SAM
Abstract: 5.1 surround MP3 decoder 6476A compression mpeg 1 layer 2 IC doc file mp3
Text: Audio and Video CODEC Licensing 1. Introduction This guide gives Atmel customers information about, as well as an overview of, the licensing of patents that cover technologies such as MP3 and WMA that run on Atmel’s AVR® or ARM® Thumb® based microcontrollers. A video or audio technology
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6476B
11-Aug-09
AT91SAM
5.1 surround MP3 decoder
6476A
compression mpeg 1 layer 2
IC doc file mp3
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VSMB2020
Abstract: VEMD2000X01 VSMB2000 VSMB2000X01 VSMB2020X01
Text: VSMB2000X01, VSMB2020X01 Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH FEATURES VSMB2000X01 • • • • • • • • • • • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8
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VSMB2000X01,
VSMB2020X01
VSMB2000X01
AEC-Q101
VEMD2000X01
J-STD-020
2002/95/EC
2002/96/EC
11-Mar-11
VSMB2020
VSMB2000
VSMB2000X01
VSMB2020X01
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VEMT2020
Abstract: npn phototransistor VEMT2000X01 VEMT2020X01 IPC 7351 2 pin phototransistor P 250 20594 VSMB2000X01 VEMT2520 VEMT2000
Text: VEMT2000X01, VEMT2020X01 Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: surface mount • Package form: GW, RGW • Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8 • AEC-Q101 qualified • High radiant sensitivity • Daylight blocking filter matched with 830 nm to
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VEMT2000X01,
VEMT2020X01
AEC-Q101
VEMT2000X01
VSMB2000X01
J-STD-020
2002/95/EC
2002/96/EC
VEMT2000X01
VEMT2020
npn phototransistor
VEMT2020X01
IPC 7351
2 pin phototransistor P 250
20594
VSMB2000X01
VEMT2520
VEMT2000
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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vsmb2020x01
Abstract: VSMB2000X01 VEMD2000X01 VSMB2000 VSMB2020 IPC 7351
Text: VSMB2000X01, VSMB2020X01 Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH FEATURES VSMB2000X01 • • • • • • • • • • • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8
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VSMB2000X01,
VSMB2020X01
VSMB2000X01
AEC-Q101
VEMD2000X01
J-STD-020
2002/95/EC
2002/96/EC
18-Jul-08
vsmb2020x01
VSMB2000X01
VSMB2000
VSMB2020
IPC 7351
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methanol
Abstract: No abstract text available
Text: 21-Jul-09 HM72A-06R47LFTR summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Tooled Part 2 COIL Wire 3 LEAD Lead Frame Ink 4 MARKING Ink Element Composition CAS No Material Mass Composition g (g) Iron Magnesium Silicon
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21-Jul-09
HM72A-06R47LFTR
78-93-3ame
methanol
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CAT4103
Abstract: CAT4103V-GT2 SOIC-16 MD-5038
Text: CAT4103 3-Channel Constant-Current RGB LED Driver FEATURES DESCRIPTION 3 independent current sinks rated to 25V LED current to 175mA per channel set by separate external resistors High-speed 25MHz 4-wire serial interface Buffered output drivers to ensure data integrity
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CAT4103
175mA
25MHz
175mA)
16-lead
CAT4103V-GT2
SOIC-16*
CAT4103V
CAT4103
MD-5038,
CAT4103V-GT2
SOIC-16
MD-5038
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EIA-359
Abstract: EIA-359-A AMP Netconnect NS100N
Text: 4 D R A W IN G IS U N P U B L IS H E D . R ELEASED FOR ALL C O P Y R IG H T BY TYCO E L E C T R O N IC S 2 P U B L IC A T IO N R IG H T S R E V IS IO N S RESERVED. EH C O R P O R A T IO N . 00 D E S C R IP T IO N ENHANCED CATEGDRY 5e PERFDRMANCE CHARACTERISTICS
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OCR Scan
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ns/100n)
31MAR2000
EIA-359
EIA-359-A
AMP Netconnect
NS100N
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UL444
Abstract: 4 pr 16 awg cable nec 9513 AMP Netconnect 2000327
Text: 4 T H IS D R A W IN G IS 3 U N P U B L IS H E D . R ELEASED FOR P U B L IC A T IO N ALL C O P Y R IG H T BY TYCO E L E C T R O N IC S 2 R IG H T S R E V I SI O N S RESERVED. EH C O R P O R A T IO N . 00 D E S C R IP T IO N C A TE GD RY 5e P E R F O R M A N C E CHARACTERISTICS
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OCR Scan
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ns/100n)
31MAR2000
UL444
4 pr 16 awg cable
nec 9513
AMP Netconnect 2000327
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