P1394

Abstract: 787949-1
Contextual Info: 107-68299 Packaging Specification 23Jul09 Rev G PLUG KIT,UNASSEMBLED,IEEE P1394 1. PURPOSE 目的 Define the packaging specifiction and packaging method of PLUG KIT,UNASSEMBLED,IEEE P1394. 订定 PLUG KIT,UNASSEMBLED,IEEE P1394 产品之包装规格及包装方式。

WBCR02750000F

Abstract: bcr resistor bcr efi ElectroFilm
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

Contextual Info: VBPW34S, VBPW34SR Vishay Semiconductors Silicon PIN Photodiode FEATURES • Package type: surface mount • Package form: GW, RGW VBPW34S • Dimensions L x W x H in mm : 6.4 x 3.9 x 1.2 • Radiant sensitive area (in mm2): 7.5 • High photo sensitivity

TLHB510

Abstract: TLHB5100 TLHB5102
Contextual Info: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.

EIA-359

Abstract: EIA-359-A AMP Netconnect NS100N
Contextual Info: 4 D R A W IN G IS U N P U B L IS H E D . R ELEASED FOR ALL C O P Y R IG H T BY TYCO E L E C T R O N IC S 2 P U B L IC A T IO N R IG H T S R E V IS IO N S RESERVED. EH C O R P O R A T IO N . 00 D E S C R IP T IO N ENHANCED CATEGDRY 5e PERFDRMANCE CHARACTERISTICS

TB2272

Contextual Info: 23-Jul-09 HM73-106R0LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Iron Powder 2 ADHESIVE Epoxy 3 WIRE Air Coil 4 BODY Ink 5 SOLDER Lead Free Solder CAS No Material Mass mg Composition (mg) 7439-89-6 - 855 846.45

Contextual Info: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR MATERIAL: PET WHITE SUPPORT TAPE: PET (BLUE) CONTACT MATERIAL: COPPER CONTACT PLATING: TIN QUALITY CLASS: 20 MATING CYCLES MIN. PITCH: 1.00 MM A ENVIRONMENTAL OPERATING TEMPERATURE: -30°C UP TO 85°C

switch 4606

Abstract: Honeywell v3
Contextual Info: 4 FO-55111-C 2 3 HONEYWELL PART NUMBER 1 .375 MAX FREE POSITION 22AC1-D8 PUSH TO OPERATE-RETURNS AUTOMATICALLY TO POSITION SHOWN PULL TO OPERATE-REMAINS IN OPERATED POSITION UNTIL RESET FOR AUTOMATIC RETURN BY NEXT FULL STROKE "PUSH" OPERATION PRODUCT CODE

VEMD2020

Abstract: VEMD2020X01 VVC901 VEMD2000X01 J-STD-020D VSMB2000X01 21554
Contextual Info: VEMD2000X01, VEMD2020X01 Vishay Semiconductors Silicon PIN Photodiode FEATURES • • • • • • 21568-1 VEMD2020X01 VEMD2000X01 • • • • • • DESCRIPTION VEMD2000X01 and VEMD2020X01 are high speed and high sensitive PIN photodiodes in a miniature surface mount

HTB2-102-281

Abstract: EE25 bobbin TNY278PN yw-360-02b EKMX401ELL220ML20S MOSFET 818 ln TNY278 DER-228 ee25 ferrite core TNY277
Contextual Info: Design Example Report Title 15 W Power Supply with <30 mW No-load Input Power Using TinySwitch-III TNY278P Specification 85 VAC – 265 VAC Input; 12 V, 1.25 A Output Application TinySwitch-III Reference Design Author Applications Engineering Department

Contextual Info: VJ.W1BC X7R Dielectric Vishay Surface Mount Multilayer Ceramic Chip Capacitors for Commodity Applications FEATURES • • • • • • • • • Stable class 2 dielectric Four standard sizes High capacitance per unit volume Supplied in tape on reel

smd diode GW

Abstract: VBPW34FASR
Contextual Info: VBPW34FAS, VBPW34FASR Vishay Semiconductors Silicon PIN Photodiode FEATURES VBPW34FAS • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 6.4 x 3.9 x 1.2 Radiant sensitive area (in mm2): 7.5 High radiant sensitivity

SPC5567MZP132

Abstract: PBGA-B416
Contextual Info: SPC5567MZP132 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information

MD-5042

Abstract: CAT4109 CAT4109V CAT4109V-GT2 SOIC-16 MD504
Contextual Info: CAT4109 3-Channel Constant-Current RGB LED Driver with Individual PWM Dimming FEATURES DESCRIPTION „ 3 independent current sinks up to 175mA rated 25V „ LED Current set by external low power control resistors „ Individual PWM control per channel „ Low dropout current source 0.4V at 175mA

UL444

Abstract: 4 pr 16 awg cable nec 9513 AMP Netconnect 2000327
Contextual Info: 4 T H IS D R A W IN G IS 3 U N P U B L IS H E D . R ELEASED FOR P U B L IC A T IO N ALL C O P Y R IG H T BY TYCO E L E C T R O N IC S 2 R IG H T S R E V I SI O N S RESERVED. EH C O R P O R A T IO N . 00 D E S C R IP T IO N C A TE GD RY 5e P E R F O R M A N C E CHARACTERISTICS

Contextual Info: TLHB510. Vishay Semiconductors High Efficiency Blue LED, Ø 5 mm Untinted Non - Diffused Package FEATURES • • • • • • • • 19223 DESCRIPTION This device has been designed in GaN on SiC technology to meet the increasing demand for high efficiency blue LEDs.

AT91SAM

Abstract: 5.1 surround MP3 decoder 6476A compression mpeg 1 layer 2 IC doc file mp3
Contextual Info: Audio and Video CODEC Licensing 1. Introduction This guide gives Atmel customers information about, as well as an overview of, the licensing of patents that cover technologies such as MP3 and WMA that run on Atmel’s AVR® or ARM® Thumb® based microcontrollers. A video or audio technology

VSMB2020

Abstract: VEMD2000X01 VSMB2000 VSMB2000X01 VSMB2020X01
Contextual Info: VSMB2000X01, VSMB2020X01 Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH FEATURES VSMB2000X01 • • • • • • • • • • • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8

VEMT2020

Abstract: npn phototransistor VEMT2000X01 VEMT2020X01 IPC 7351 2 pin phototransistor P 250 20594 VSMB2000X01 VEMT2520 VEMT2000
Contextual Info: VEMT2000X01, VEMT2020X01 Vishay Semiconductors Silicon NPN Phototransistor FEATURES • Package type: surface mount • Package form: GW, RGW • Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8 • AEC-Q101 qualified • High radiant sensitivity • Daylight blocking filter matched with 830 nm to

WBCR02750000F

Abstract: BCR50000FKAHWS
Contextual Info: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation

vsmb2020x01

Abstract: VSMB2000X01 VEMD2000X01 VSMB2000 VSMB2020 IPC 7351
Contextual Info: VSMB2000X01, VSMB2020X01 Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH FEATURES VSMB2000X01 • • • • • • • • • • • • • • • Package type: surface mount Package form: GW, RGW Dimensions L x W x H in mm : 2.3 x 2.3 x 2.8

methanol

Contextual Info: 21-Jul-09 HM72A-06R47LFTR summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Tooled Part 2 COIL Wire 3 LEAD Lead Frame Ink 4 MARKING Ink Element Composition CAS No Material Mass Composition g (g) Iron Magnesium Silicon

CAT4103

Abstract: CAT4103V-GT2 SOIC-16 MD-5038
Contextual Info: CAT4103 3-Channel Constant-Current RGB LED Driver FEATURES DESCRIPTION „ 3 independent current sinks rated to 25V „ LED current to 175mA per channel set by separate external resistors „ High-speed 25MHz 4-wire serial interface „ Buffered output drivers to ensure data integrity