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    1MM PITCH BGA SOCKET Search Results

    1MM PITCH BGA SOCKET Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62SK-000 High-Density D-Subminiature (HD62 Female D-Sub) Connector, 62-Position Socket Contacts, Solder-Cup Terminals Datasheet

    1MM PITCH BGA SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    connector tyco 1565357-1

    Abstract: "30 pin" SMT connector 1mm pitch BGA socket z-pack 24 pin connector DIN 1.5mm connector 2-5767004-2
    Text: Quick Reference Guide: Stacking Connectors Things to consider when selecting a mezzanine connector 1. Determine a range of stack heights that will meet the application requirements. 2. Determine the minimum number of signals that must pass between the two printed circuit boards PCBs with


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    connector tyco 1565357-1

    Abstract: 1565357-1 2-5767004-2 2057471-1 223652-1 4-175630-6 tyco 1469002 1mm pitch BGA socket 3-6318491-6 Mictor
    Text: Stacking Connectors Quick Reference Guide: Stacking Connectors THINGS TO CONSIDER WHEN SELECTING A MEZZANINE CONNECTOR 1. Determine a range of stack heights that will meet the application requirements. 2. Determine the minimum number of signals that must pass between the two printed circuit boards PCBs with consideration for


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    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    bga676

    Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
    Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable


    Original     		PDF 27x27mm, 26x26 SBT-BGA-6002 bga676 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 1mm pitch BGA

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


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    40KHZ ULTRASONIC CLEANER CIRCUIT

    Abstract: BGA reflow guide 1mm pitch zif BGA socket pogo pin cleaning "ultrasonic cleaner" 1mm pitch BGA socket 40KHz ultrasonic interface maintenance program ULTRASONIC bath CLEANER CIRCUIT ultrasonic probe
    Text: Stamped Spring Pin Socket for Burn-in & Test Applications User Manual Tel: 800 404-0204 www.ironwoodelectronics.com STAMPED SPRING PIN SOCKET USER MANUAL Table of Contents Socket Mechanics . 2


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    1mm pitch BGA socket

    Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
    Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)


    Original     		PDF MIL-STD202, 1mm pitch BGA socket thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO

    Spring Pin Sockets

    Abstract: p112a p115a p114a P-P139A P-P134A P-P115A P-P112A
    Text: Spring Pin Socket User Manual Tel: 800 404-0204 • (952) 229-8200 Fax: (952) 229-8201 11351 Rupp Dr. Suite 400, Burnsville, MN 55337 www.ironwoodelectronics.com Spring Pin Socket User Manual Selecting a BGA Spring pin socket .2


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    PPC750FX

    Abstract: 1mm pitch BGA socket thick bga die size 750FX SG-BGA-6051 0.125mm BGA
    Text: GHz BGA Socket - Direct mount, solderless Features Top View Socket supports IBM PowerPC 750FX as well as other BGA devices. Directly mounts to target PCB needs tooling holes with included hardware. High speed, reliable elastomer connection. Minimum real estate required.


    Original     		PDF 750FX 225mm 725mm 025mm SG-BGA-6051 125mm PPC750FX 1mm pitch BGA socket thick bga die size 0.125mm BGA

    HXC125

    Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
    Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The


    Original     		PDF 1654563-CC CE-PDF-07-08 HXC125 mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296

    "0.4mm" bga "ball collapse" height

    Abstract: cga 624 ibm semi reflow temperature bga
    Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the


    Original     		PDF w/2116 "0.4mm" bga "ball collapse" height cga 624 ibm semi reflow temperature bga

    1mm pitch BGA socket

    Abstract: 345C PB-BGA484C-01
    Text: 129.54mm [5.100"] 134.62mm [5.300"] 1mm typ. 2.54mm [0.100"] typ. Top View 12.84mm [0.506"] 3 2 49.49mm [1.948"] Side View 1 11.03mm [0.434"] Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4 1 2 3 per IPC 4101/21/26/83/98, Td>=345C Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm


    Original     		PDF 22x22 PB-BGA484C-01 1mm pitch BGA socket 345C

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		PDF 75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


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    ADHESIVE GAP PAD

    Abstract: TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz MLF Socket User Manual Selecting MLF socket: You need to have the IC package drawing ready to select the correct MLF socket. Go to


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    Tektronix

    Abstract: 750FX LA-BGA-750FX-Z-01 SF-BGA292D-B-11 TLA700
    Text: 67.31mm [2.650"] 27.46mm [1.081"] 30.51mm [1.201"] 28.32mm [1.115"] Top View 80.01mm [3.150"] 28.32mm [1.115"] 24.9mm [0.980"] 25.65mm [1.010"] 1 Side View PB-BGA-750FX-01 included 25.68mm [1.011"] assembled 10.74mm [0.423"] assembled 3 2 26.46mm [1.042"]


    Original     		PDF PB-BGA-750FX-01 SF-BGA292D-B-11 750FX TLA700 LA-BGA-750FX-Z-01 Tektronix SF-BGA292D-B-11

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		PDF SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432

    "Delta Electronics" dps 800

    Abstract: Delta Electronics dps 250 16 pin 2x25, 2mm pitch header connectors Delta Electronics dps 300 Delta Electronics dps 800 50 pin 2x25, 2mm pitch header connectors Delta Electronics dps -350MB A electronic passive components catalog areva 68 pin pcb SCSI connector
    Text: COMMUNICATIONS, DATA, CONSUMER DIVISION Connector Overview ABOUT FCI Created in 1989, FCI - an Areva Group company - rapidly secured its place among the world’s top three manufacturers of connectors and interconnect systems. With sales of 1.56 billion Euros 1.47 billion dollars in 2002, FCI


    Original     		PDF FEPOCDC0204E "Delta Electronics" dps 800 Delta Electronics dps 250 16 pin 2x25, 2mm pitch header connectors Delta Electronics dps 300 Delta Electronics dps 800 50 pin 2x25, 2mm pitch header connectors Delta Electronics dps -350MB A electronic passive components catalog areva 68 pin pcb SCSI connector

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		PDF C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow

    74 hc 59581

    Abstract: b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16
    Text: 717 Technical portal and online community for Design Engineers - www.element-14.com Semiconductor Hardware & Thermal Management Page Page 727 725 725 732 739 732 749 736 725 724 723 723 724 721 720 722 726 752 728 751 Crystal Oscillator Sockets . . . . . . . . . . . . . . . . . .


    Original     		PDF element-14 74 hc 59581 b768 transistor transistor smd 661 752 8 pin ic base socket round pin type lead 652B0082215-002 MM5231 702 transistor smd code LA9100 LGA 1155 Socket PIN diagram smd transistor w16

    PM8352

    Abstract: PM8373 PM8385 gmii sfp 196-pin bga footprint
    Text: PM8385 QuadPHY RT Released 4-Port Gigabit Ethernet and 1/2G Fibre Channel Repeater or Retimer GENERAL • Supports four physical interfaces for Gigabit Ethernet at 1.25 Gbit/s per IEEE 802.3z or Fibre Channel physical interfaces at 1.0625 or 2.125 Gbit/s per


    Original     		PDF PM8385 PMC-2030741 PM8352 PM8373 PM8385 gmii sfp 196-pin bga footprint

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY INTERI C o ntact 1,27mm .050" • High density up to 500 pins • High speed up to 10 GHz • High reliability Tiger Eye contacts • Headers, stackers and sockets • 5, 8 and 10 row • 5mm, 7mm, 9mm, 12mm, 19mm, 25mm and 30mm board spacings


    OCR Scan     		PDF 0787Stacker

    Untitled

    Abstract: No abstract text available
    Text: BGA 119 Pin NP276 Series CHARACTERISTICS Insulation Resistance 100MQ or more at 100VDC Withstanding Voltage Contact Resistance 100VAC for one minute 30mQ or less at 10mA, 20m V (initial) 40°C ~ +I50CC Operating Temperature ORDERING PROCEDURE NP276-119 04-*


    OCR Scan     		PDF NP276 100MQ 100VDC 100VAC NP276-119 NP276- NP276-1 190BGA^ 27x27