17X17 BGA THERMAL RESISTANCE Search Results

17X17 BGA THERMAL RESISTANCE Result Highlights (5)

Part	Manufacturer	Description
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function
TCTH012AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function

17X17 BGA THERMAL RESISTANCE Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
60068-2-14Na Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance Text: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.	Original	E174442. 16x16 19x19 20x20 60068-2-14Na 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance	PDF
PCT-GF30 Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044 Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount	Original		PDF
35x35 bga Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877 Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169	Original	PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877	PDF
LFXP2-8E Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132 Text: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.	Original	64-ball 144-ball LFXP2-8E LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132	PDF
Preci-Dip Durtal SA Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin	Original	CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148	PDF
bt 1696 Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are	Original		PDF
BGA 11x11 junction to board thermal resistance Abstract: 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20 Text: Thermal Management February 2004 Introduction to Thermal Management Thermal considerations are rarely an issue with low-density PLDs such as the Lattice Semiconductor GAL products, however, high-density PLDs often require consideration of thermal issues as part of any sound design methodology. To avoid reliability problems, Lattice Semiconductor specifies a maximum allowable junction temperature	Original	320-ball 432-ball 27x27 31x31 35x35 40x40 45x45 BGA 11x11 junction to board thermal resistance 45x45 mm bga BGA 64 PACKAGE thermal resistance qfn jc jb 45x45 bga BGA 23X23 PQFP 32X32 QFN 48 JC JB 35x35 bga QFN 20X20	PDF
Untitled Abstract: No abstract text available Text: PGA / BGA / PLCC SOCKETS 546-PP-NNN-XX-XXX136 PGA Solderless compliant press-fit SERIES 546 Pin grid array sockets, with compliant press-fit terminations. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Bronze CuSn4Pb4Zn4 C54400	Original	546-PP-NNN-XX-XXX136 PCT-GF30-FR C54400) C17200) CH-2800	PDF
Untitled Abstract: No abstract text available Text: PGA / BGA / PLCC SOCKETS 550-PP-NNN-XX-XXX101 PGA Interconnect pin solder tail SERIES 550 Pin grid array sockets, interconnect pin TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life	Original	550-PP-NNN-XX-XXX101 PCT-GF30-FR CuZn36Pb3 C36000) 17x17 CH-2800	PDF
Untitled Abstract: No abstract text available Text: PGA / BGA / PLCC SOCKETS 514-PP-NNN-XX-XXX117 PGA Surface mount SERIES 514 Pin grid array sockets, surface mount with floating contacts. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000	Original	514-PP-NNN-XX-XXX117 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800	PDF
Untitled Abstract: No abstract text available Text: PGA / BGA / PLCC SOCKETS 614-PP-NNN-XX-XXX112 PGA Carrier SERIES 614 Pin grid array sockets, carriers with disposable plastic body. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact	Original	614-PP-NNN-XX-XXX112 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800	PDF
Untitled Abstract: No abstract text available Text: PGA / BGA / PLCC SOCKETS 510-PP-NNN-XX-XXX101 PGA Solder tail SERIES 510 Pin grid array sockets, standard solder version. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O Sleeve Brass CuZn36Pb3 C36000 Contact Clip (6 finger): Beryllium copper (C17200)	Original	510-PP-NNN-XX-XXX101 PCT-GF30-FR CuZn36Pb3 C36000) C17200) CH-2800	PDF
BGA 256 PACKAGE power dissipation Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced	Original	00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432	PDF
pcb warpage in ipc standard Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387 Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.	Original		PDF

pbt-GF30-fr Abstract: pps-gf40 LCP-GF30 M39029/58-363 PCT-GF30 disposable camera flash capacitor Din 17223 Electro Stimulation 800-V3-NNN-12-002101 slc connector Text: Catalog 14.1 Catalog 14.1 preci-dip swiss world connects www.precidip.com preci-dip SA Rue Saint-Henri 11 P.O.Box 834 CH-2800 Delémont / Switzerland P ho n e +41 0 32 421 04 00 Fa x +41 (0)32 421 04 01 e- m a i l sales@precidip.com www.precidip.com	Original	CH-2800 pbt-GF30-fr pps-gf40 LCP-GF30 M39029/58-363 PCT-GF30 disposable camera flash capacitor Din 17223 Electro Stimulation 800-V3-NNN-12-002101 slc connector	PDF
90041-AS Abstract: ATI Lead Free reflow soldering profile BGA 90023-AS 90022-AS LCD 90026 540-99-044-24-000 111-93-308-41-001 540-99-084-24-000-1 IP0002 41013 mounting clip dimensions Text: Staying tough at the top When it comes to professional connecting devices with machined precision contacts read: ICsockets, PCB connectors and allied products you can consider Preci-Dip as one of the top addresses in the world. Preci-Dip's skill and manufacturing experience,	Original	IP0000 8PM-SS-0006-01-913 CH-2800 90041-AS ATI Lead Free reflow soldering profile BGA 90023-AS 90022-AS LCD 90026 540-99-044-24-000 111-93-308-41-001 540-99-084-24-000-1 IP0002 41013 mounting clip dimensions	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 7, 10/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch	Original	IMX50CEC MCIMX50	PDF
tec driver peltier Abstract: No abstract text available Text: R Chapter 4 PCB Design Considerations Summary This chapter covers the following topics: • • • • • • • • • • Pinout Information Pinout Diagrams Package Specifications Flip-Chip Packages Thermal Data Printed Circuit Board Considerations Board Routability Guidelines	Original	FG256 FG456: FF672, FF896, FF1152, FF1517: BF957: FG456 FF672 tec driver peltier	PDF
12x12 bga thermal resistance Abstract: XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB Text: R Chapter 4 PCB Design Considerations 1 Summary This chapter covers the following topics: • • • • • • • • • • 2 Pinout Information Pinout Diagrams Package Specifications 3 Flip-Chip Packages Thermal Data Printed Circuit Board Considerations	Original	UG002 CS144: FG256, FG456, FG676: FF896, FF115XC2V40 CS144 XC2V40 FG256 12x12 bga thermal resistance XC2V6000-ff1152 xc2v3000fg XC2V3000-FG676 smd transistor J6 pin XC2V3000-BG728 XC2V80 IO-L93N UG002 Printed Circuit Boards PCB	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 6, 08/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch	Original	IMX50CEC MCIMX50	PDF
QL1P1000 Abstract: QL1P100 100 pin vqfp drawing TFBGA196 12x12 bga thermal resistance vqfp 44 thermal resistance 100C QL8050 LBGA thermal SSDL18 Text: PolarPro Solution Platform Family Data Sheet •••••• Family of Solution Platforms Integrating Low Power Programmable Fabric and Embedded SRAM Platform Highlights Flexible Programmable Fabric • 8 to 240 customizable building blocks CBBs (see	Original		PDF
samsung eMMC 4.5 Abstract: emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51 Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 4, 1/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch	Original	IMX50CEC MCIMX50 samsung eMMC 4.5 emmc 4.4 standard jedec Samsung eMMC 4.41 153 ball eMMC memory emmc 4.5 spec emmc spec emmc 4.41 spec 50 50 mfd CAPACITOR USB_OTG Samsung eMMC 4.51	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 5, 06/2013 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch	Original	IMX50CEC MCIMX50	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX50CEC Rev. 3, 11/2012 MCIMX50 Package Information Plastic Package Case 416 MAPBGA 13 x 13 mm, 0.5 mm pitch Case 416 PoPBGA 13 x 13 mm, 0.5 mm pitch Case 400 MAPBGA 17 x 17 mm, 0.8 mm pitch	Original	IMX50CEC MCIMX50	PDF

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17X17 BGA THERMAL RESISTANCE Search Results

17X17 BGA THERMAL RESISTANCE Result Highlights (5)

17X17 BGA THERMAL RESISTANCE Datasheets Context Search

60068-2-14Na

PCT-GF30

35x35 bga

LFXP2-8E

Preci-Dip Durtal SA

bt 1696

BGA 11x11 junction to board thermal resistance

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BGA 256 PACKAGE power dissipation

pcb warpage in ipc standard

pbt-GF30-fr

90041-AS

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tec driver peltier

12x12 bga thermal resistance

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QL1P1000

samsung eMMC 4.5

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