Untitled
Abstract: No abstract text available
Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm
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Original
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063W/cm
149x135
120x130
112x130
100x100
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm
|
Original
|
063W/cm
149x135
120x130
112x130
100x100
|
PDF
|