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    130NM CMOS PROCESS PARAMETERS Search Results

    130NM CMOS PROCESS PARAMETERS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMP89FS60AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP64-P-1010-0.50E Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP52-P-1010-0.65 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS60BFG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP64-1414-0.80-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS63BUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP52-1010-0.65-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMP89FS62AUG Toshiba Electronic Devices & Storage Corporation 8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80A Visit Toshiba Electronic Devices & Storage Corporation

    130NM CMOS PROCESS PARAMETERS Datasheets Context Search

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    130NM cmos process parameters

    Abstract: 90 nm CMOS C6416 TMS320C6000 TMS320C6416 90nm cmos cmos logic 90nm nmos 130nm
    Text: Chasing Moore’s Law with 90-nm: More Than Just a Process Shrink By Ray Simar, Manager of Advanced DSP Architecture In the electronics industry, the term “process shrink” is often used to refer to when a semiconductor company migrates an existing design to a smaller process technology.


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    PDF 90-nm: 720-MHz TMS320C6416 C6416 130-nm 90-nm 130NM cmos process parameters 90 nm CMOS TMS320C6000 90nm cmos cmos logic 90nm nmos 130nm

    tsmc 130nm metal process

    Abstract: teradyne tiger aeroflex sram edac charactristics of cmos logic gates CCGA 472 leon3 teradyne flex tester CCGA 472 drawing 130NM cmos process parameters tsmc cmos
    Text: Semicustom Products UT130nHBD Hardened-by-Design HBD Standard Cell Advanced Data Sheet August 2010 www.aeroflex.com/RadHardASIC FEATURES PRODUCT DESCRIPTION ‰ Up to 15,000,000 usable equivalent gates using standard cell architecture The high-performance UT130n HBD Hardened-by-Design


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    PDF UT130nHBD 130nm 0x10-10 tsmc 130nm metal process teradyne tiger aeroflex sram edac charactristics of cmos logic gates CCGA 472 leon3 teradyne flex tester CCGA 472 drawing 130NM cmos process parameters tsmc cmos

    SPIF225A

    Abstract: 88f5181 MARVELL 88f5181 SIL5723 Sil3726 atp8620 Sil4726 88SM4140 SIL4723 spif-225
    Text: New Product Introduction XRS10L140/120/240/220 XRS10L140/120 SATA Port Multipliers & XRS10L240/220 SATA Combo Chips Confidential Information For Authorized EXAR Representatives Only SATA Port Multiplier & Combo Products Rev1.0 1 New Product Introduction XRS10L140/120/240/220


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    PDF XRS10L140/120/240/220 XRS10L140/120 XRS10L240/220 XRS10L140 XRS10L120 10L140IV 10L240IV SPIF225A 88f5181 MARVELL 88f5181 SIL5723 Sil3726 atp8620 Sil4726 88SM4140 SIL4723 spif-225

    GS8600

    Abstract: p2262 130NM cmos process parameters
    Text: SPARC64 V Processor For UNIX Server Revision 1.0 August 2004 FUJITSU LIMITED Copyright 2004 Fujitsu Limited. All Rights Reserved. No part of this product or related documentation may be reproduced in any form by any means without prior written authorization of Fujitsu Limited, and its licensors, if any.


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    PDF SPARC64 ARC64 0-SPARC64V-pub GS8600, 64-bit SPARC64 db/sparc64 GS8600 p2262 130NM cmos process parameters

    pressure sensor MATLAB program

    Abstract: CCGA 472 CCGA -CG 472 actel 1020 datasheet fpga radiation mixed signal fpga datasheet RH1020 actel rad pressure sensor 90nm cmos
    Text: A passion for performance. Digital and Mixed-Signal custom, semi-custom and off-the-shelf designs Guaranteed radiation performance QML-V, QML-Q, military, medical, industrial grades We connect the real world to the digital world RadHard ASICs Digital and Mixed-Signal


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    PDF 25-year pressure sensor MATLAB program CCGA 472 CCGA -CG 472 actel 1020 datasheet fpga radiation mixed signal fpga datasheet RH1020 actel rad pressure sensor 90nm cmos

    180NM cmos process parameters

    Abstract: circuit diagram for Design and Fabrication of 5V 130nm CMOS design of digital PLL using 180nm technology of digital PLL using 180nm technology 180NM rs232 schematic diagram
    Text: RadHard ASIC Products RadHard Mixed-Signal ASICs Datasheet July 2007 INTRODUCTION ‰ SEU-immune to less than 1.0E-12 errors/bits-day available using special library cells Aeroflex Colorado Springs’ RadHard Mixed-Signal ASICs combine high-density, high-speed digital logic with analog and


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    PDF 0E-12 180NM cmos process parameters circuit diagram for Design and Fabrication of 5V 130nm CMOS design of digital PLL using 180nm technology of digital PLL using 180nm technology 180NM rs232 schematic diagram

    180NM cmos process parameters

    Abstract: 180NM nmos Germanium audio Amplifier diagram "BJT Transistors" spice high frequency SiGe bicmos transistor circuit diagram for simple RF transceiver BJT Transistors CMOS Stacked RF 130NM cmos process parameters AUDIO MOSFET POWER AMPLIFIER SCHEMATIC
    Text: Motivation for RF Integration W H I T E P A P E R Motivation for RF Integration Introduction While CMOS technology has made great strides in its ability to fabricate radio frequency RF circuitry, many RF chip designers have yet to take advantage of this


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    PDF WFS-FS-21329-9/2008 180NM cmos process parameters 180NM nmos Germanium audio Amplifier diagram "BJT Transistors" spice high frequency SiGe bicmos transistor circuit diagram for simple RF transceiver BJT Transistors CMOS Stacked RF 130NM cmos process parameters AUDIO MOSFET POWER AMPLIFIER SCHEMATIC

    CCGA 472

    Abstract: pressure sensor MATLAB program CCGA -CG 472 rtax250 fpga radiation mixed signal fpga datasheet RH1280 RH1020
    Text: A passion for performance. Digital and Mixed-Signal custom, semi-custom, off-the-shelf designs Guaranteed radiation performance QML-V, QML-Q, military, medical, industrial grades Category 1A Trusted Accreditation We connect the real world to the digital world


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    PDF 25-year CCGA 472 pressure sensor MATLAB program CCGA -CG 472 rtax250 fpga radiation mixed signal fpga datasheet RH1280 RH1020

    diagram of connectors of 4 USB and 1 RS232 and 1 Firewire 2 infrared

    Abstract: diagram of connectors of 4 USB and 1 RS232 an 1 Firewire and 1 Infrared sony lcd tv circuit diagram free SONY crt colour tv circuit diagram IBM motherboard socket 478 rev 1.6 diagram of connectors of 4 USB and 2 RS232 and 1 Firewire 2 infrared 5 pin PCB Mounted 3.5mm Stereo jack IBM motherboard socket 478 rev 1.6 manual pin connection lvds cable lcd sony 2418TJ-PHD
    Text: APOLLO Intel Celeron M/Pentium M based EBX Single Board Computer Technical Manual www.arcom.com a company Definitions Arcom is the trading name for Arcom Control Systems Inc and Arcom Control Systems Ltd. Disclaimer The information in this manual has been carefully checked and is believed to be accurate. Arcom assumes no responsibility


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    Untitled

    Abstract: No abstract text available
    Text: TM September 2013 • What are Semiconductor Devices? • How Semiconductors are Made − Front-End Process − Back-End Process • Fabrication Facility and Equipment Issues • Business Aspects of Supplying Semiconductors TM 2 TM 4 A conductor carries electricity like a pipe


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    TSMC 40nm

    Abstract: TSMC 40nm layout issue cascode transistor array 90 nm CMOS Double high-speed switching diode EP4SE530 90-nm-FPGAs transistor gds
    Text: Process-Design Co-Optimization for FPGA Qi Xiang Altera Corporation, 101 Innovation Drive, San Jose, CA 95134 Email: qxiang@altera.com Abstract Advancing field programmable gate array FPGA technology can be very challenging. Some of the major difficulties are power management and high-speed


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    PDF 40-nm TSMC 40nm TSMC 40nm layout issue cascode transistor array 90 nm CMOS Double high-speed switching diode EP4SE530 90-nm-FPGAs transistor gds

    toshiba Transistors catalog

    Abstract: TC200 TC220C TC220E TC280 TC280C toshiba semiconductor catalog tc190c TC223G 65-nm CMOS standard cell library process technology
    Text: SEMICONDUCTOR GENERAL CATALOG ASICs CMOS Gate Array Series CMOS Cell-Based IC Series CMOS Embedded Array Series 1 2011/9 SCE0004L To ensure competitiveness in the marketplace, companies need to produce more sophisticated, more technology-intensive and higher value-added models, using technological innovation and


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    PDF SCE0004L toshiba Transistors catalog TC200 TC220C TC220E TC280 TC280C toshiba semiconductor catalog tc190c TC223G 65-nm CMOS standard cell library process technology

    AN1064

    Abstract: CY62168DV30 CY62168DV30LL-55BVI cypress AN1064 sram system guidelines
    Text: CY62168DV30 MoBL ® 16-Mbit 2 M x 8 MoBL Static RAM Features • Very high speed ❐ 55 ns ■ Wide voltage range ❐ 2.2 V – 3.6 V ■ Ultra-low active power ❐ Typical active current: 2 mA at f = 1 MHz ❐ Typical active current: 15 mA at f = fMax (55 ns Speed)


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    PDF CY62168DV30 16-Mbit AN1064 CY62168DV30LL-55BVI cypress AN1064 sram system guidelines

    Untitled

    Abstract: No abstract text available
    Text: CY62168DV30 MoBL ® 16-Mbit 2 M x 8 MoBL Static RAM Features • Very high speed ❐ 55 ns ■ Wide voltage range ❐ 2.2 V – 3.6 V ■ Ultra-low active power ❐ Typical active current: 2 mA at f = 1 MHz ❐ Typical active current: 15 mA at f = fMax (55 ns Speed)


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    PDF CY62168DV30 16-Mbit

    CY62177DV30

    Abstract: No abstract text available
    Text: CY62177DV30 MoBL 32-Mbit 2M x 16 Static RAM Features applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE


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    PDF CY62177DV30 32-Mbit I/O15)

    CY62177DV30

    Abstract: No abstract text available
    Text: CY62177DV30 MoBL 32-Mbit 2 M x 16 Static RAM Features applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE


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    PDF CY62177DV30 32-Mbit I/O15)

    Untitled

    Abstract: No abstract text available
    Text: CY62157DV30 MoBL  8-Mbit 512K x 16 MoBL Static RAM This is ideal for providing More Battery Life (MoBL®) in portable applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption. The device can also be put into


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    PDF CY62157DV30 CY62157CV25, CY62157CV30, CY62157CV33 48-ball 44-pin

    Untitled

    Abstract: No abstract text available
    Text: CY62168DV30 MoBL  16-Mbit 2M x 8 MoBL Static RAM Features • Very high speed ❐ 55 ns ■ Wide voltage range ❐ 2.2 V – 3.6 V ■ Ultra-low active power ❐ Typical active current: 2 mA @ f = 1 MHz ❐ Typical active current: 15 mA @ f = fMax (55 ns Speed)


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    PDF 16-Mbit CY62168DV30 48-ball

    CY62168DV30

    Abstract: CY62168DV30LL-55BVI
    Text: CY62168DV30 MoBL ® 16-Mbit 2M x 8 MoBL Static RAM Features • Very high speed ❐ 55 ns ■ Wide voltage range ❐ 2.2 V – 3.6 V ■ Ultra-low active power ❐ Typical active current: 2 mA @ f = 1 MHz ❐ Typical active current: 15 mA @ f = fMax (55 ns Speed)


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    PDF CY62168DV30 16-Mbit CY62168DV30LL-55BVI

    Untitled

    Abstract: No abstract text available
    Text: THIS SPEC IS OBSOLETE Spec No: 38-05392 Spec Title: CY62157DV30 MOBL R 8-MBIT (512K X 16) MOBL(R) STATIC RAM Sunset Owner: Ramesh Raghavan (rame) Replaced by: NONE CY62157DV30 MoBL  8-Mbit (512K x 16) MoBL Static RAM This is ideal for providing More Battery Life (MoBL®) in


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    PDF CY62157DV30 CY62157CV25, CY62157CV30, CY62157CV33

    Untitled

    Abstract: No abstract text available
    Text: CY62177DV30 MoBL 32-Mbit 2 M x 16 Static RAM Features applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE


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    PDF CY62177DV30 32-Mbit I/O15)

    nl5500

    Abstract: TRF6151 RF Transceiver WL1273 nl5350 schematic diagram of bluetooth headphone diagram circuit usb mp3 player with radio fm lcd wl1251 trf6151 omap3440 wl1271
    Text: Wireless Handsets Solutions Guide 2008 Wireless Handsets Solutions Guide 2 ➔ Table of Contents Technologies Overview of Technologies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 DRP Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5


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    PDF TMS320C55x, TMS320C54x, SWPY010I nl5500 TRF6151 RF Transceiver WL1273 nl5350 schematic diagram of bluetooth headphone diagram circuit usb mp3 player with radio fm lcd wl1251 trf6151 omap3440 wl1271

    Untitled

    Abstract: No abstract text available
    Text: CY62177DV30 MoBL 32-Mbit 2 M x 16 Static RAM Features applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption. The device can also be put into standby mode when deselected (CE1 HIGH or CE2 LOW or both BHE and BLE


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    PDF CY62177DV30 32-Mbit 48-ball

    Untitled

    Abstract: No abstract text available
    Text: CY62167DV30 MoBL 16-Mbit 1 M x 16 Static RAM Features • Thin small outline package (TSOP-I) configurable as 1 M × 16 or as 2 M × 8 SRAM ■ Wide voltage range: 2.2 V – 3.6 V ■ Ultra-low active power: Typical active current: 2 mA at f = 1 MHz ■


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    PDF CY62167DV30 16-Mbit