ICC3P
Abstract: DDR200 DDR266A DDR266B PC2100
Text: LEGEND L1272YC5–RU1HDH5A 128x72 PC2100 REGISTERED LOW PROFILE DDR SDRAM Performance Technology L1272YC5–RU1HDH5A 128x72 PC2100 REGISTERED LOW PROFILE DDR SDRAM FEATURES • PC2100 compliant • JEDEC-standard 184-pin, dual in-line memory module DIMM
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L1272YC5
128x72
PC2100
184-pin,
400-mil
ICC3P
DDR200
DDR266A
DDR266B
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736-Pin
Abstract: LSI coreware library 64X144
Text: ADVANCE DATASHEET RC1800 Foundation Slice Family July 2005 The RapidChip RC1800 Foundation Platform ASIC Family, except for the RC1812 slice, is in NO-NEW-DESIGN Status as of July 2005. LSI Logic is not accepting new designs in this slice Family. Information in this datasheet is
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RC1800
RC1812
DB14-000253-04
DB14-000253-04,
DB14-000253-03
736-Pin
LSI coreware library
64X144
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da53
Abstract: DB26
Text: 1066 MHz RDRAMâ 512/576 Mb 8Mx16/18x4i Advance Information Overview • The 1066 MHz Rambus DRAM (RDRAMâ) is a general purpose high-performance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any
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8Mx16/18x4i)
DL0117-010
da53
DB26
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da53
Abstract: DB26 DL010
Text: RAMBUS Direct RDRAM Preliminary Information 256/288-Mbit 1Mx16/18x16d Overview The Rambus Direct RDRAM™ is a general purpose high-performance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any other application
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256/288-Mbit
1Mx16/18x16d)
256/288-Mbit
600MHz
800MHz
DL0105
DL0105
da53
DB26
DL010
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V850E/IA1
Abstract: U10684JJ3V0UM 2047102 MCU102 HFS2 w4t 313 703069Y GHS 59 TGA 345 V850E/IA2
Text: お客様各位 カタログ等資料中の旧社名の扱いについて 2010 年 4 月 1 日を以って NEC エレクトロニクス株式会社及び株式会社ルネサステクノロジ が合併し両社の全ての事業が当社に承継されております。従いまして、本資料中には旧社
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SAP703000-B03
U10684JJ3V0UM00
U10684JJ3V0UM
V850V850/SA1,
V850/SB1,
V850/SB2,
V850/SC1,
V850/SC2,
V850/SC3,
V850E/IA1
U10684JJ3V0UM
2047102
MCU102
HFS2
w4t 313
703069Y
GHS 59
TGA 345
V850E/IA2
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Untitled
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR3 DRAM DRAM DDR3
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800Mb/s
WD3SN04GX816-xxxxx-yy
512x64
256Mx8
WD3SN04GX808-xxxxx-yy
512Mx8
1066J
1066MHz
1333L
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Untitled
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR3 DRAM DRAM DDR3
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800Mb/s
WD3UN04GX816-xxxxx-yy
512x64
256Mx4
WD3UN08GX816-xxxxx-yy
1024x64
512Mx4
1066J
1066MHz
1333L
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RDRAM Clock
Abstract: No abstract text available
Text: 1066 MHz RDRAM 256/288 Mb 4Mx16/18x4i Advance Information Overview The RDRAM device is a general purpose highperformance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any other application where high
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DL-0119-030
RDRAM Clock
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da53
Abstract: DB26 DL0054 ycl dc 101
Text: 1066 MHz RDRAMâ 256/288 Mb 4Mx16/18x4i Advance Information Overview • The Rambus DRAM (RDRAMâ) device is a general purpose high-performance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any other
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4Mx16/18x4i)
DL-0119-010
da53
DB26
DL0054
ycl dc 101
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Untitled
Abstract: No abstract text available
Text: Page 1 of 2 DRAM DDR2 SODIMM RDIMM UDIMM SODIMM mini DIMM DDR2 has been the standard memory solutions for applications in virtually all market segments from Servers, PCs and Notebooks to Printers, Networking and Storage systems and many more for several years
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400Mb/s
800Mb/s
WD2SN01GX808-xxxx-yy
128x64
128Mx8
WD2SN02GX816-xxxx-yy
256x64
WD2SN02GX808-xxxx-yy
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128MX8
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR3 DRAM DRAM DDR3
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800Mb/s
256Mx4
WD3LE08GX418V-xxxxx-yyz
1024x72
1024Mx4
1066J
1066MHz
1333L
1333Mhz
1600N
128MX8
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a103 636 transistor
Abstract: MIPS32 cache LSI Rapidchip K9CFG CFG102 ARM926 ARM926EJ-S DB04-000094-02 Preliminary Gflx-r RapidChip Cell Technology Data infiniband PHY
Text: DATASHEET RapidChip Integrator Platform ASIC Family July 2004 Preliminary DB08-000237-02 This document is preliminary. As such, it contains data derived from functional simulations and performance estimates. LSI Logic has not verified either the functional descriptions, or the electrical and mechanical specifications using
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DB08-000237-02
DB08-000237-02,
a103 636 transistor
MIPS32 cache
LSI Rapidchip
K9CFG
CFG102
ARM926
ARM926EJ-S
DB04-000094-02
Preliminary Gflx-r RapidChip Cell Technology Data
infiniband PHY
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Untitled
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Page 1 of 2 DRAM DDR2 RDIMM RDIMM UDIMM SODIMM mini DIMM DDR2 has been the standard memory solutions for applications in virtually all market segments from Servers, PCs and Notebooks to Printers, Networking
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400Mb/s
800Mb/s
128Mx4
WD2RE02GX818V-xxxx-yyz
256x72
128Mx8
WD2RE04GX418V-xxxx-yyz
512x72
512Mx4
WD2RE04GX818V-xxxx-yyz
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Untitled
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR2 DRAM DRAM DDR2
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WD2SN04GX816-xxxx-yy
512x64
256Mx8
WD2SN04GX808-xxxx-yy
512Mx8
800MHz
667MHz
533MHz
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Untitled
Abstract: No abstract text available
Text: 1066 MHz RDRAM 512/576 Mb 8Mx16/18x4i Advance Information Overview The 1066 MHz RDRAM is a general purpose highperformance memory device suitable for use in a broad range of applications including computer memory, graphics, video, and any other application where high
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DL-0117-030
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LVTTL18
Abstract: LSI Rapidchip epbga DB06-000160-04 DB06-000471-01
Text: DATASHEET Entry-Level RapidChip Platform ASIC Slices RC1812, RC18Si150, RC18Si184 October 2005 Advance ® DB08-000300-00 This document is advance. As such, it describes a product under development. This information is intended to help you evaluate the product. LSI Logic reserves
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RC1812,
RC18Si150,
RC18Si184
DB08-000300-00
DB08-000300-00,
EBG512,
LVTTL18
LSI Rapidchip
epbga
DB06-000160-04
DB06-000471-01
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Untitled
Abstract: No abstract text available
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR2 DRAM DRAM DDR2
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WD2UN02GX808-xxxx-yy
256x64
256Mx8
WD2UN04GX818-xxxx-yy
512x64
800MHz
667MHz
533MHz
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512Mx4
Abstract: WD2RE08GX436
Text: Wintec Industries – OEM Embedded Design Center Where to Buy | Contact Us CONSUMER EMBEDDED OEM SUPPLY CHAIN CLOUD SERVICES DISTRIBUTION Submit SUPPORT ABOUT WINTEC Embedded OEM Home > Embedded OEM > DRAM > DDR2 DRAM DRAM DDR2
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512x72
256Mx8
WD2RE08GX818V-xxxxx-yyz
1024x72
512Mx8
800MHz
667MHz
533MHz
512Mx4
WD2RE08GX436
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