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    121 BGA 10X10 Search Results

    121 BGA 10X10 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
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    121 BGA 10X10 Price and Stock

    KEMET Corporation C1210X103MBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 0.01uF 20% C0G 1210 Flex Term
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1210X103MBGACTU
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    • 10000 $0.572
    		Get Quote

    KEMET Corporation C1210X103JBGACTU

    Multilayer Ceramic Capacitors MLCC - SMD/SMT 630V 0.01uF 5% C0G 1210 Flex Term
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics C1210X103JBGACTU
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.664
    		Get Quote

    121 BGA 10X10 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033 PDF

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow PDF

    1.27mm pitch zif socket 3M 21X21

    Abstract: 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432
    Text: Ironwood Electronics SK.1 Sockets and Receptacles Ironwood offers the industry's widest array of high quality sockets and receptacles for BGA, MGA, PGA, QIP, and QFP packages. We also offer parts that provide sockets for in-circuit emulators. • • • •


    Original     		SK-MGAxx/xxxx-03 SK-MGAxx/xxxx-01 SK-MGAxx/xxxx-02 MGA10/100A- 1.27mm pitch zif socket 3M 21X21 1155 lga socket pins 17X17* BGA 289 1155 lga socket PGA zif socket 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga Am29040 BGA432 PDF

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20 PDF

    Legerity SLAC

    Abstract: Legerity bga 10x10 slac
    Text: Le58083 Worldwide 8-Channel Codec Product Brief 58 Series SLAC Today's telephony line cards and integrated voice and data IVD combo cards require cost-effective, dense solutions. Whether you are designing for multiple markets worldwide or developing multiple


    Original     		Le58083 Le58083 11/02-Ginnys Legerity SLAC Legerity bga 10x10 slac PDF

    MK20DX256VLQ10

    Abstract: MK20DN512VLK10 CEA-709 MK20DN512VMC10 MK20DN512VLL10 MK21dn QFN 64 8x8 footprint MK21DN512VMC5 MK20DX256VMC10 MK20DX128VLH5
    Text: Freescale Semiconductor Product Brief Document Number:K20PB Rev. 11, 08/2012 K20 Family Product Brief Supports all K20 devices Contents 1 Kinetis Portfolio 1 Kinetis Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of


    Original     		K20PB in284 MK20DX256VLQ10 MK20DN512VLK10 CEA-709 MK20DN512VMC10 MK20DN512VLL10 MK21dn QFN 64 8x8 footprint MK21DN512VMC5 MK20DX256VMC10 MK20DX128VLH5 PDF

    MK10dx128vlh7

    Abstract: MK10DX256VLL7 MK10DN64VFT5 MK10DN512VLQ10 CEA-709 MK10DN512VMD10 MK10DX32VLH5 MK10dn128vlh MK10DN512VLK10 MK10DN32VFM5
    Text: Freescale Semiconductor Product Brief Document Number:K10PB Rev. 11, 08/2012 K10 Family Product Brief Supports all K10 devices Contents 1 Kinetis Portfolio 1 Kinetis Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of


    Original     		K10PB in284 MK10dx128vlh7 MK10DX256VLL7 MK10DN64VFT5 MK10DN512VLQ10 CEA-709 MK10DN512VMD10 MK10DX32VLH5 MK10dn128vlh MK10DN512VLK10 MK10DN32VFM5 PDF

    0.3mm pitch csp package

    Abstract: 116PIN qfp 20x20 0.3mm pitch package bga
    Text: CSP Chip Size Package small! CSP Chip Size Package • CSP（Chip Size Package）とは？ チップサイズとほぼ同じ大きさにつくることのできるパッケージを総称して 「CSP」 といいます。 チップサイズとパッケージ外形サイズが同じものは特にリアルチップサイズタイプと呼ばれて


    Original     		8mm120 5mm208 C13185JJ2V0PF00 0.3mm pitch csp package 116PIN qfp 20x20 0.3mm pitch package bga PDF

    qt2025

    Abstract: QT2225 QT2225-1 S4886 QT2025-1 S19262 AMCC S4882 S4882 S19258 S19233
    Text: ɈɩɳȹɝĘɈअౠ Product Selector Guide ȹȤɃɁ ɕȡɖɪɃȯ ɕɬĘɞɞɃɑ ɇĘȿȳɠǗȕȀ Ɇɬȳɠಞซॾ PHY ɇɐȤȹ Product Selector Guide ࠖซþ૟ঝþࡼ೧ȹɈɬĘȸǻ ۛ‫ژ‬ǻȽɪɥĘȷɧɳȟળԽ ɍɃɈɯĘȯ ȳɳɐĘȸȧɳȹ ɈɪɗɫɗɬȤ


    Original     		QT2022/QT2032 QT2025 QT2025-1 QT2045 QT2225 QT2225-1 S1212/S1220 S1213/S1221 S1216/S1217 S19233/S19256 qt2025 QT2225 QT2225-1 S4886 QT2025-1 S19262 AMCC S4882 S4882 S19258 S19233 PDF

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack PDF

    MK20DX256VLH7

    Abstract: BGA 8x8 100 MK20DX128VLH7 MK20DX128VLH5 MK20DX256VLL7 104BGA MK20DN128VFM5 MK20DX64VLK7 MK20DX64VLH7 bootloader k40
    Text: Freescale Semiconductor Product Brief Document Number: K20PB Rev. 8, 5/2011 K20 Family Product Brief Supports all K20 devices Contents 1 Kinetis Portfolio Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of


    Original     		K20PB MK20DX256VLH7 BGA 8x8 100 MK20DX128VLH7 MK20DX128VLH5 MK20DX256VLL7 104BGA MK20DN128VFM5 MK20DX64VLK7 MK20DX64VLH7 bootloader k40 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Product Brief Document Number: K40PB Rev. 8, 5/2011 K40 Family Product Brief Supports all K40 devices Contents 1 Kinetis Portfolio Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of


    Original     		K40PB PDF

    SUN HOLD 0910

    Abstract: No abstract text available
    Text: Oki Semiconductor MSM32Q/33Q/98Q/99Q 0.35 |im Sea of Gates and Customer Structured Arrays DESCRIPTION Oki's 0.35 Jim Application-Specific Integrated Circuit ASIC products are available in both Sea Of Gates (SOG) and Customer Structured Array (CSA) architectures. Both the SOG-based MSM33Q0000 series and


    OCR Scan     		MSM32Q/33Q/98Q/99Q MSM33Q0000 MSM98Q000 MSM32Q MSM33Q MSM99Q 64-Mbit signifi9Q052X052 98Q/99Q056X056 98Q/99Q060X060 SUN HOLD 0910 PDF

    pbt-GF30-fr

    Abstract: pps-gf40 LCP-GF30 M39029/58-363 PCT-GF30 disposable camera flash capacitor Din 17223 Electro Stimulation 800-V3-NNN-12-002101 slc connector
    Text: Catalog 14.1 Catalog 14.1 preci-dip swiss world connects www.precidip.com preci-dip SA Rue Saint-Henri 11 P.O.Box 834 CH-2800 Delémont / Switzerland P ho n e +41 0 32 421 04 00 Fa x +41 (0)32 421 04 01 e- m a i l sales@precidip.com www.precidip.com


    Original     		CH-2800 pbt-GF30-fr pps-gf40 LCP-GF30 M39029/58-363 PCT-GF30 disposable camera flash capacitor Din 17223 Electro Stimulation 800-V3-NNN-12-002101 slc connector PDF

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9 PDF

    40x8 lcd

    Abstract: No abstract text available
    Text: Freescale Semiconductor Product Brief Document Number: K30PB Rev. 8, 5/2011 K30 Family Product Brief Supports all K30 devices Contents 1 Kinetis Portfolio Kinetis is the most scalable portfolio of low power, mixedsignal ARM Cortex -M4 MCUs in the industry. Phase 1 of


    Original     		K30PB 40x8 lcd PDF

    philips diode PH 33J

    Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
    Text: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without


    Original     		10-BIT QS3L384) QS3L2384 QS3L384 QS3L2384 philips diode PH 33J UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY PDF

    UM61256FK-15

    Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
    Text: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch


    Original     		74F257, 74FCT257, 74FCT257T QS32257 QS3257 QS32257 UM61256FK-15 YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624 PDF

    801-PP-NNN-10-001101

    Abstract: PBT-GF30-FR 803-pp-nnn-10-249101 CuZn36Pb3 pbt-GF30 "electronica" 514-PP-NNNMXX-XXX148 802 PRECIDIP 540-88-068-24-000-1 8PM-SS-0006-01-913
    Text: カタログ14-Japanese swiss world connects Preci-Dip スイス品質の コネクション テクノロジ 内部接続部品 標準品から カスタムデザイン スイス品質を ご覧ください この一つの 工場から 原材料から完成品


    Original     		14-Japanese ISO9001 ISO14001MIL790 ISO14001 ISO14001Preci-Dip 836mm CH-2800 801-PP-NNN-10-001101 PBT-GF30-FR 803-pp-nnn-10-249101 CuZn36Pb3 pbt-GF30 "electronica" 514-PP-NNNMXX-XXX148 802 PRECIDIP 540-88-068-24-000-1 8PM-SS-0006-01-913 PDF

    Untitled

    Abstract: No abstract text available
    Text: Flexible Input Deterministic Output fido 32-Bit Real-Time Communications Controller Data Sheet December 11, 2012 fido1100® Data Sheet 32-Bit Real-Time Communications Controller IA211080807-09 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 74 http://www.innovasic.com


    Original     		32-Bit fido1100Â IA211080807-09 PDF

    a27cs

    Abstract: A30CS ieee embedded system projects 2013 free
    Text: Flexible Input Deterministic Output fido 32-Bit Real-Time Communications Controller Data Sheet April 10, 2013 fido1100® Data Sheet 32-Bit Real-Time Communications Controller IA211080807-10 UNCONTROLLED WHEN PRINTED OR COPIED Page 1 of 74 http://www.innovasic.com


    Original     		32-Bit fido1100® IA211080807-10 a27cs A30CS ieee embedded system projects 2013 free PDF

    64-pin BGA thermal resistance

    Abstract: arm Str711f TQFP144 TQFP64 ISO7816-3 LFBGA144 LFBGA64 STR710F AN1781 diode p115
    Text: STR71xF ARM7TDMI 16/32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES PRELIMINARY DATA • ■ ■ ■ ■ Memories – Up to 256+16 Kbytes Flash memory 100,000 cycles endurance, 20 yrs retention – Up to 64 Kbytes RAM – External Memory Interface (EMI) for up to 4


    Original     		STR71xF 16/32-BIT 64-pin BGA thermal resistance arm Str711f TQFP144 TQFP64 ISO7816-3 LFBGA144 LFBGA64 STR710F AN1781 diode p115 PDF

    STR712f reference manual

    Abstract: AN1774 LFBGA64 STR710F ISO7816-3 LFBGA144 STR711F STR712F TQFP144 TQFP64
    Text: STR71xF ARM7TDMI 32-BIT MCU WITH FLASH, USB, CAN 5 TIMERS, ADC, 10 COMMUNICATIONS INTERFACES • ■ ■ ■ ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash Memories – Up to 256Kbytes Flash program memory


    Original     		STR71xF 32-BIT 256Kbytes STR712f reference manual AN1774 LFBGA64 STR710F ISO7816-3 LFBGA144 STR711F STR712F TQFP144 TQFP64 PDF