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DSA00368072.pdf
Manufacturer
Philips Semiconductors
Partial File Text
Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often prefe
Datasheet Type
Original
ECAD Model
Part Details
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DBS PACKAGES
LQFP32
LQFP48
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QFP package weight
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QFP160
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SMD Packages
SSOP16
SSOP20
TQFP100 footprint
TQFP64
TQFP80
TQFP80 footprint
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