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DSASW00296624.pdf
Manufacturer
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Partial File Text
Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections Dragos Burlacu, Luu Nguyen* and Jorma Kivilahti Laboratory of Electronics
Type
Original
ECAD Model
DSASW00296624.pdf preview
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User Tagged Keywords
36804-10M
Cu6Sn5
SnAgCu
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