The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00107572.pdf
Manufacturer
Altera
Partial File Text
PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional
Type
Original
Part Details
Price & Stock Powered by
Findchips
DSASW00107572.pdf preview
Download Datasheet
User Tagged Keywords
altera marking
altera top marking
ASE BGA
Denko
HC100
HC100-XJ
HC100XJAA
mold compound
Nitto
Nitto Denko HC100-XJ
nitto hc100
nitto hc100-xj
PCN0415
trace code altera