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    DSASW00106125.pdf

    • Altera
    • Reliability Study of High-Pin-Count Flip-Chip BGA Yuan Li, John Xie, Tarun Verma and Vincent Wang Altera Corp. 101 Innovation Drive, San Jose, CA 95134 ysli@altera.com Abstract A family of 1.0-m
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    DSASW00106125.pdf preview Download Datasheet

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    63Sn37Pb 95Pb5Sn ansys ansys darveaux application for bt 151 bt 151 600 cte table cte table bga cte table flip chip substrate FR4 substrate FR4 substrate height and thickness FR4 substrate height and thickness 1.2 MO-151 modulus underfill with or without underfill
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