Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAASSA00012312.pdf

    • Amkor Technology
    • data sheet fcCSP Features: LAMINATE fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP (fcCSP) package -- a flip chip solution in a CSP package format. This package constructio
    • Original
    • Price & Stock Powered by Findchips

    DSAASSA00012312.pdf preview Download Datasheet

    User Tagged Keywords

    amkor cabga thermal resistance Amkor CSP mold compound amkor Cu pillar bga 5x5 BGA 64 PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 6x6 cu pillar FCCSP flip chip bga 0,8 mm HL832 HL832N

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel