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    DSA005171.pdf

    • Bergquist
    • ® Gap Pad HC1000 "Gel-Like" Modulus Gap Filling Material Features and Benefits Typical Properties of Gap Pad HC1000 Property · Thermal conductivity 1.0 W/m-K Imperial Value Metric Va
    • Original
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    DSA005171.pdf preview Download Datasheet

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    ASTM d792 D2240 hc 1000 HC100 HC1000

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