The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00296624.pdf
Manufacturer
-
Partial File Text
Influence of Solder Microstructure and Oxide Layers on High Frequency Electrical Losses of WL-CSP Pb-free Interconnections Dragos Burlacu, Luu Nguyen* and Jorma Kivilahti Laboratory of Electronics
Datasheet Type
Original
ECAD Model
DSASW00296624.pdf preview
Download Datasheet
User Tagged Keywords
36804-10M
Cu6Sn5
SnAgCu
Price & Stock Powered by
Findchips