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    DSA00269216.pdf

    • Central Semiconductor
    • PROCESS CP315V Power Transistors NPN - High Current Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 40 x 40 MILS Die Thickness 7.1 MILS Base Bonding Pad
    • Original
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    DSA00269216.pdf preview Download Datasheet

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    CHIP TRANSISTOR CP315V CXT3150 CZT3150 transistor 936

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