Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DASF0033026.pdf

    • Intel
    • Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in
    • Original
    • Price & Stock Powered by Findchips

    DASF0033026.pdf preview Download Datasheet

    User Tagged Keywords

    fcBGA PACKAGE thermal resistance fcbga package weight G-749 INTEL fcBGA PACKAGE thermal resistance Intel Mobile Celeron Processor BGA PBGA-B495 shin-etsu shinetsu T-PCM27-94 Thermagon Thermagon t pad

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel