Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0039338.pdf

    • Xilinx
    • Application Note: Packaging R XAPP427 (v2.4) February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA0039338.pdf preview Download Datasheet

    User Tagged Keywords

    BFG95 BGA PROFILING BGA reflow guide FFG1136 FFG1738 FFG1738* moisture FFG668 FFG672 FFG676 fgg484 IPC-A-610D IPC-A610D Lead Free reflow soldering profile BGA PQG100 PQG160 PQG208 TQG144 VOG48 XAPP427
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel