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DSA00269222.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP341V Small Signal Transistors NPN - Low VCE(SAT) Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 18 x 18 MILS Die Thickness 7.1 MILS Base Bondi
Type
Original
ECAD Model
Part Details
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