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DASF0045486.pdf
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AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technol
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AN-9037
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Intel reflow soldering profile BGA
IPC-4101
IPC-4101B
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IPC-SM-7525A
IPC610D
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J-STD-001C
JESD22-B102D
QFN 52 8x8 footprint