DSA00510849.pdf by National Semiconductor

Partial File Text Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Elec
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00510849.pdf preview

Download Datasheet

User Tagged Keywords

bond wire gold copper bond wire cte table epoxy substrate cte table ic bga MS011800 NATIONAL SEMICONDUCTOR ink MARKING PCB monitor spc pcb substrate SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY soft solder die bonding ultrasonic bond