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Catalog Datasheet	MFG & Type	PDF	Document Tags
SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .	Original	PDF

Catalog Datasheet

MFG & Type

PDF

Document Tags

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: MS011800 bond wire gold copper bond wire cte table epoxy substrate soft solder wire dispensing NATIONAL SEMICONDUCTOR ink MARKING AU4A cte table ic bga PCB monitor spc
Text: Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board PCB .

Original

PDF