DSA00269216.pdf by Central Semiconductor

Partial File Text PROCESS CP315V Power Transistors NPN - High Current Transistor Chip PROCESS DETAILS Process Epitaxial Planar Die Size 40 x 40 MILS Die Thickness 7.1 MILS Base Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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CHIP TRANSISTOR CP315V CXT3150 CZT3150 transistor 936