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    DSASW0012633.pdf by Freescale Semiconductor

    • Q2, 2010 Flip Chip Plastic Ball Grid Array (FC-PBGA) Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other produc
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    "IPC 1752" gold 37.5x37.5 BGA PACKAGE thermal resistance Freescale fine BGA thermal profile flip chip bga 0,8 mm ipc 9701A ipc 9702 IPC strain gage IPC-1752 IPC-7525 IPC-9701A IPC-9702 IPC7525 JEDEC JESD51-8 BGA material declaration semiconductor package PBGA 23X23 PBGA 23X23 0.8 pitch pcb warpage in ipc standard Plastic Pin Grid Array UBM SAC305 SAC387 SAC387 solder SAC405 semiconductor cross reference thermal cycling reliability voids in bga solder
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