DSASW00107560.pdf by Altera

Partial File Text PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100.
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672-BALL Compound EP20K200E EP20K300E EPF10K100E EPF10K130E EPF10K200E EPF10K200S HC100 Nitto Nitto HC nitto hc100 Nitto-HC100 PCN0119 shin-etsu