DSASW00135443.pdf by Central Semiconductor

Partial File Text PROCESS CPD41 Switching Diode High Current Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 19.7 x 19.7 MILS Die Thickness 8.0 MILS Anode Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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1N3600 1n3600 die 1N4150 1N4150 DIE CMPD4150 CPD41