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DSA0057205.pdf
Manufacturer
Philips Semiconductors
Partial File Text
PDF: 2002 Jan 14 Philips Semiconductors Package outline BGA376: plastic ball grid array package; 376 balls; body 23 x 23 x 1.75 mm SOT741-1 B D A D1 ball A1 index area A
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
BGA376
MS 034
MS-034
sot741
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