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DSAE0058268.pdf
Manufacturer
Malico
Partial File Text
Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic (UL94-V0) 2.Heat sink dimension : Foot print : 27x2
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
27X27MM
bu series
CU1100
MBA27002
plastic ul94v0