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    Abstract: MBA27002 plastic ul94v0 CU1100 27X27MM
    Text: Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic UL94-V0 2.Heat sink dimension : Foot print : 27x27mm Part no. Height Fin shape Base MBA27002MBA27002MBA27002MBA27002- 12


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    MBA27002 27x27 CU1100 UL94-V0) 27x27mm MBA27002MBA27002MBA27002MBA27002- MBA27002-12PCU/2 MBA27002-15PCU/2 MBA27002-20PCU/2 bu series plastic ul94v0 CU1100 27X27MM PDF