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    DSA00337577.pdf

    • Xilinx
    • Application Note: Virtex Series R XAPP157 (v1.0) July 26, 2000 Board Routability Guidelines with Xilinx Fine-Pitch BGA Packages Author: Abhay Maheshwari and Soon-Shin Chee Summary Xilin
    • Original

    DSA00337577.pdf preview Download Datasheet

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    BGA 23 x 23 array BGA NSMD ball FG1156 FG256 FG676 pcb design 0,4 mm pitch Routability via diameter pitch XAPP157 XCV300

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