DSA00299935.pdf by Central Semiconductor

Partial File Text PROCESS CP315V Power Transistors NPN - High Current Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 40 X 40 MILS Die Thickness 7.1 MILS Base Bonding Pad Ar
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA00299935.pdf preview

Download Datasheet

User Tagged Keywords

CP315V CXT3150 CZT3150