DSAE0075257.pdf by NEC

Partial File Text CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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0.5 mm pitch TSSOP 144 QFP body size 450-080 50 mil pitch ceramic package 7313 28 pin 7314 1 7400 pin configuration 7401 IC 7401 ic configuration 7402 pin configuration 7402-1 7412 pin configuration 7415 14 pins 7421 pin configuration 7432 ic 7432 ic pin configuration 7441A BGA and QFP Package BGA and QFP Package mounting datasheet IC 7422 DIODE ED 15 draw pin configuration of ic 7400 draw pin configuration of ic 7402 ED-7300 ED-7302 ED-7304-1 ED-7305 ED-7400 ED-7401-2 ED-7402 ED-7405 ED-7418 ED7311 ED7433 EDR-7311 EDR-7313 EE-13 EIA and EIAJ standards EIA and EIAJ tape standards IC 7400 IC 7400 datasheet IC 7401 datasheet IC 74012 IC 7403 datasheet IC 7409 IC 7410 IC 7413 datasheet IC 7414 IC 7414 datasheet IC 7418 IC 7419 datasheet ic 7421 IC 7422 datasheet IC 7424 datasheet IC 7432 IC 7432 NAME IC LQF IEC-Publication-747 IEC-Publication-747 7 information OF ic 7400 INFORMATION OF IC 7424 INTERNATIONAL ZIP CODES jedec QFP80 ls 74001 LS 7402 ls 7409 ls 7432 M 7401 NEC semiconductor land pattern dimensions NEC SOI pin configuration IC 7400 pin configuration of IC 7400 pin configuration of ic 7410 QFJ84-P-S115-1 qfp 64 0.4 mm pitch land pattern qfp 64 0.5 mm pitch land pattern QFP 64 Cavity dip QFP 64 Cavity package SC47D seam sealing land pattern SOP EIAJ TYPE II ED-7402-1 SOP40 package WSOP 48 socket