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    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


    Original     		PDF

    hd66840fs

    Abstract: HD61100A Hitachi LCD 1602 sony x35 lcd HD66710FS HCD66205L HD66840 HD44100H UPILEX VT hd44105
    Text: Hitachi LCD Controller/Driver LSI Data Book Index 04.10.1996 17:44 Uhr Seite 3 INDE X General Information LCD Driver Character Display LCD Controller/Driver Graphic Display LCD Driver for Small System Graphic Display LCD Driver 1 Negative LCD Power Supply Type


    Original     		PDF HD66330T hd66840fs HD61100A Hitachi LCD 1602 sony x35 lcd HD66710FS HCD66205L HD66840 HD44100H UPILEX VT hd44105

    HT 1200-4

    Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341
    Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional


    Original     		PDF March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    Sony ACF

    Abstract: IC 452 in pqc ADE407-001H ANISOLM induction cooker component list on pcb induction furnace hd66131 INCOMING RAW MATERIAL INSPECTION format induction heating cooker MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR
    Text: Hitachi LCD Controller/Driver DATA BOOK ADE407-001H 8/98 Hitachi Ltd. MC-Setsu Contents GENERAL INFORMATION Quick Reference Guide.


    Original     		PDF ADE407-001H August1998 Sony ACF IC 452 in pqc ADE407-001H ANISOLM induction cooker component list on pcb induction furnace hd66131 INCOMING RAW MATERIAL INSPECTION format induction heating cooker MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR

    UPD4011BG

    Abstract: UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304
    Text: 目 次 1. パッケージの標準化 1.1 EIAJ規格 1.2 JEDEC規格 1.3 IEC規格 2. NECにおけるパッケージ名称 3. EIAJにおけるパッケージ・コード 3.1 パッケージ・コードの構成 4. 外形図面用照合文字と寸法表示例


    Original     		PDF M7A98 C10535J) SC47D) SC47D NEC2070 RS481) PD4011BGT1 PD4011BG PD421000LA10E1 PD421000LA100 UPD4011BG UPD4011 SC47D ED-7304-1 48 pin ic qfj ED-7407 ED-7500A ED-7419 ED-7401 ED7304

    PT740 AB

    Abstract: PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311
    Text: Hitachi Semiconductor Package Data Book ADE–410–001H 9th Edition March/2001 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/2001 standard-856-8650 PT740 AB PM351 transistor 9726 126 EDR-7313 ED-7402 texas instruments data guide manual Hitachi DSAUTAZ006 DO-35 land pattern Silicon Point Contact Mixer Diodes ED-7311

    Sony ACF

    Abstract: ANISOLM upilex S 40 hitachi ACF upilex AC-7144 AC-7104 Hitachi 15 inch LCD HD66712TA0 acf film
    Text: The Information of TCP Features of TCP TAB Technology Flexible Design The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages: The following can be tailored to the design of the


    Original     		PDF HD66120TA2 HD66120TA3 HD66300T00 HD66310T00 HD66330TA0 HD66503TA0 HD66503TB0 HD66520TA0 HD66520TB0 HD66712TA0 Sony ACF ANISOLM upilex S 40 hitachi ACF upilex AC-7144 AC-7104 Hitachi 15 inch LCD acf film

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		PDF C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


    Original     		PDF PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747

    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    induction furnace

    Abstract: induction cooker component list on pcb induction furnace manual cmos microcircuit catalog ANISOLM induction heating cooker IC 452 in pqc induction heating furnace MATSUSHITA OSCILLATOR EF INCOMING RAW MATERIAL INSPECTION procedure
    Text: LCD Controller Driver Data Book Application Note 9/1/98 Notice When using this document, keep the following in mind: 1• This document may, wholly or partially, be subject to change without notice. 2• All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of


    Original     		PDF

    M9627

    Abstract: uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire
    Text: SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL 1989 Document No. C10535EJ8V0IF00 8th edition Date Published February 1997 N Printed in Japan No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in


    Original     		PDF C10535EJ8V0IF00 M9627 uPC451g SMD 6PIN IC MARKING CODE PR-53365 NIHON SMD MARKING codes sealed relay ge mil 7451 UPD65013 smd code marking NEC g GE4F tanaka AL wire

    IC 7432

    Abstract: IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE RELATED STANDARDS 2. IC PACKAGE RELATED STANDARDS The following standards are related to IC package 1 EIAJ (Standards of the Electronic Industries Association of Japan) These standards, published by the Electronic Industries Association of Japan, define the dimensions, characteristics, ratings and test


    Original     		PDF ED-7301 ED-7302 ED-7303 ED-7305 ED-7311 ED-7400 ED-7400-1 ED-7400-2 ED-7401-2 ED-7401A IC 7432 IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF

    PT740 AB

    Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48
    Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48

    3ECV

    Abstract: upilex panasonic lcd tft panel anisolm Sony ACF AC-7104 upilex S 75 ED-7431 panasonic transistor c 6073
    Text: The Information of TCP Features of TCP TAB Technology The structure and materials used by Tape Carrier Package (TCP) give it the following features as compared with conventional packages: Thin, Lightweight, and Fine Pitch With thickness less than 1 mm and fine-pitch leads, a reduced pad pitch on the device enables more


    OCR Scan     		PDF HD66110STB5 HD66110STB8 HD66HOSTOO HD66110STC1 HD66110STC2 HD66110STC3 HD66112TA2 HD66113TA0 HD66113TA1 HD66115TA0 3ECV upilex panasonic lcd tft panel anisolm Sony ACF AC-7104 upilex S 75 ED-7431 panasonic transistor c 6073