DSA00122354.pdf by Cypress Semiconductor

Partial File Text Cypress Semiconductor Package Qualification Report QTP# 000805 VERSION 1.0 October 2000 32 Lead 400 mil TSOP type ll package and Moisture Level 3 Chip Pac (Hyundai) Korea CYPRESS TECHNICAL C
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8361H CY62148 CY62148V TSOP 48 thermal resistance tsop package MSL