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    DSAUTAZ0015054.pdf by Philips Semiconductors

    • PDF: 1999 Sep 10 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm D pin 1 index area x B b1 w M w M b SOT560-1 E
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