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    DSAUD0068115.pdf

    • Texas Instruments
    • PowerPADTM - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments,
    • Original

    DSAUD0068115.pdf preview Download Datasheet

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